WO2015161601A1 - 一种移动通信终端 - Google Patents

一种移动通信终端 Download PDF

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Publication number
WO2015161601A1
WO2015161601A1 PCT/CN2014/085339 CN2014085339W WO2015161601A1 WO 2015161601 A1 WO2015161601 A1 WO 2015161601A1 CN 2014085339 W CN2014085339 W CN 2014085339W WO 2015161601 A1 WO2015161601 A1 WO 2015161601A1
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WIPO (PCT)
Prior art keywords
heat
mobile communication
communication terminal
oil
pcb board
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Application number
PCT/CN2014/085339
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English (en)
French (fr)
Inventor
王超
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2015161601A1 publication Critical patent/WO2015161601A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of mobile communications, and in particular, to a mobile communication terminal with good heat dissipation effect.
  • BACKGROUND OF THE INVENTION The hot spots of existing mobile communication terminals are mainly concentrated on several chips with higher heat generation, that is, the point temperature is high. With the rapid development of mobile broadband and the Internet, the data bandwidth is getting higher and higher, and the amount of information is higher. The greater the number of people, the higher the information processing speed of mobile communication terminals, so the core of the main processor of the mobile communication terminal is more and more, the main frequency is getting higher and higher, and the accompanying power consumption is also increasing. Big.
  • the chip in the mobile communication terminal is highly integrated, and its main heating points are concentrated in the following chips: Application Processor (AP), Power Management IC (PMIC), Radio Amplifier (Radio) Frequency Power Amplifier, referred to as RF PA).
  • AP Application Processor
  • PMIC Power Management IC
  • Radio Amplifier Radio Amplifier
  • RF PA Frequency Power Amplifier
  • the temperature of the above several hot spots may reach 890 degrees, the other places of the mobile communication terminal are not very hot, so the current measures are to spread the point temperature as quickly as possible to the entire mobile communication terminal, which can speed up heat dissipation and prevent Local overheating of the mobile communication terminal.
  • the heat-generating measures used in the prior art are mainly thermal conductive silica gel and graphite sheets.
  • the thermal conductive silica gel is mainly longitudinal heat conduction, and the graphite sheet is laterally thermally conductive, thereby lowering the local temperature.
  • the present invention provides a mobile terminal to solve at least the problem of local overheating of a mobile communication terminal in the related art.
  • the present invention provides a mobile communication terminal, including a PCB board and at least one shield cover.
  • the shielding cover covers the PCB board, and the shielding cover is sealingly connected with the PCB board to form a hollow oil storage cavity for storing heat-dissipating insulating oil, and the shielding cover is provided with a sealing member.
  • the PCB board has a plurality of heat generating points, and at least one of the heat generating points is disposed in the shielding cover.
  • the shielding cover is a plurality of, and a gapless structure is formed between the cover walls of the plurality of shielding covers, and the plurality of the shielding covers cover the entire surface of the PCB board.
  • the PCB has at least one through hole, and the shield covers the upper and lower plates of the PCB, and the through hole is disposed in the shield.
  • the shielding cover covering the upper and lower surfaces of the PCB board is mirror-symmetrical.
  • FIG. 1 is a schematic structural diagram of a mobile communication terminal according to an embodiment of the present invention.
  • 2 is a top plan view of a mobile communication terminal according to an embodiment of the present invention.
  • FIG. 3 is another schematic structural diagram of a mobile communication terminal according to an embodiment of the present invention.
  • 4 is another top plan view of a mobile communication terminal according to an embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly, the following detailed description will be made with reference to the accompanying drawings and specific embodiments.
  • the present invention provides a mobile communication terminal, including a PCB board 1 and at least one shielding cover 2, the shielding cover 2 covers the PCB board 1, and the shielding cover 2 is sealed with the PCB board 1.
  • a hollow oil storage chamber 4 for storing the heat-dissipating insulating oil 3 is formed.
  • the shield cover 2 is provided with an oil-filling hole 5 for engaging the heat-dissipating insulating oil 3 into the oil-storing chamber.
  • the technical solution of the above embodiment injects the heat insulating insulating oil 3 into the oil reservoir 4 formed by the PCB board 1 and the shield case 2, so that the heat generated by the electrical components on the PCB board 1 is evenly distributed throughout the shield case 2. Then, the heat is transmitted to the entire body through the shield 2 and the PCB 1, thereby solving the internal dispersion of the mobile communication terminal. The problem of uneven heat and point overheating.
  • the main heating points of the mobile communication terminal are, for example, an application processor 11 (AP), a power management chip 12 (PMIC), and an RF power amplifier 13 (RF PA) should be placed in the shield.
  • the PCB board 1 has a plurality of heat generating points, and at least one of the heat generating points is disposed in the shield case 1.
  • the electrical components on the PCB 1 generate more or less heat, but there are some points with higher heat generation, and the hot spots are placed in the shield 2, with the help of The flow of the heat insulating insulating oil 3 distributes the heat generated by the heat generating points evenly to the entire body.
  • a plurality of shielding covers 2 are generally provided to meet the requirements of EMC certification.
  • a gapless structure is formed between the shielding walls of the plurality of shielding covers 2, and a plurality of shieldings are formed.
  • the cover 2 covers the entire surface of the PCB 1. In this way, the surface of the entire PCB board 1 is covered by the shield cover 2, and the heat generated by the PBC board 1 is absorbed by the heat-dissipating insulating oil 3 in the oil storage chamber 4, so that a better heat dissipation effect can be achieved.
  • the PCB board 1 may be a through-hole board or a non-through-hole board.
  • the shield cover 1 needs to cover the upper and lower boards of the PCB board 1.
  • the through hole 14 is disposed in the shield case 2.
  • the diameter of the through hole 14 should be as large as possible, and the number is preferably a plurality, so as to accelerate the flow of the heat insulating oil 3 in the upper and lower shields 2 to achieve better heat dissipation.
  • the shield cover 2 covering the upper and lower plates of the PCB board 1 is mirror-symmetrical, so that the hot spots can be placed in the shield 2 of the upper and lower layers, which is more advantageous for the heat-generating point and the heat-dissipating insulating oil. 3 contacts, thus speeding up heat dissipation.
  • a plurality of through holes 14 are provided in the PCB board 1.
  • the seal is a gasket and a gland. The oil hole is sealed by the gasket and the gland, or the oil hole may be sealed with a hot melt adhesive or a sealant.
  • FIG. 1 is a schematic structural diagram of a mobile communication terminal according to an embodiment of the present invention.
  • 2 is a top plan view of a mobile communication terminal according to an embodiment of the present invention.
  • the embodiment provides a mobile communication terminal, including a non-through-hole PCB board 1 and a plurality of shield covers 2, and a plurality of shield covers 2 cover the PCB board 1.
  • the shield cover 2 The oil-filled cavity 4 for storing the heat-dissipating insulating oil 3 is formed in a sealed manner with the PCB board 1.
  • FIG. 3 is another schematic structural diagram of a mobile communication terminal according to an embodiment of the present invention.
  • 4 is another top plan view of a mobile communication terminal according to an embodiment of the present invention. As shown in FIG. 3 and FIG. 4, the embodiment provides a mobile communication terminal including a PCB board 1 having a plurality of through holes 14 and a shield cover 2 covering the upper and lower surfaces of the PCB board 1.
  • the upper and lower shields 2 are mirror-symmetrical, and the plurality of through holes 14 are disposed in the shield 2, and the shield 2 is sealingly connected with the PCB 1 to form a hollow oil storage chamber 4 for storing the heat insulating oil 3, shielding
  • the cover 2 is provided with an oiling hole 5 for injecting heat-dissipating insulating oil into the oil reservoir 4, and the oil-filling hole 5 is sealed in an operating state.
  • An application processor 11 (AP), a power management chip 12 (PMIC), and a radio frequency power amplifier 13 (RF PA) on the PCB 1 are disposed in the shield.
  • the shield is designed to cover a sufficiently large area on the PCB, and a shield matching shield can be customized according to the shape of the main board of the mobile communication terminal. If there are multiple shields, the gap between the shield walls of the shield is as small as possible, that is, the multiple shields are combined as much as possible.
  • the new process is used for proofing. If the shield is not integral with the whole, the side of the shield that is in contact with the PCB is preferably horizontal and easy to seal. When the PCB is mounted, the heat generating chip and the shield are welded at the same time, and the sealing of the solder is ensured.
  • the heat insulating oil is injected into the shield through the oil hole, and then the oil hole is sealed.
  • heat-insulating insulating oil it is necessary to select insulating oil with high heat capacity, high thermal conductivity, good fluidity, low freezing point, thermal stability and good oxidation stability.
  • the heat capacity and thermal conductivity of the insulating oil are much higher than that of the air, so that the temperature of the heat generating chip can be quickly absorbed and the heat conduction can be accelerated.
  • a mobile communication terminal provided by an embodiment of the present invention has the following beneficial effects: a shielded cover and a PCB board of a mobile communication terminal are formed into a sealed oil storage chamber, and injected into the oil storage chamber
  • the heat-dissipating insulating oil is such that the heat-generating points on the PCB board distribute heat to the entire body through heat exchange with the heat-dissipating insulating oil, thereby achieving good heat dissipation of the mobile communication terminal.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本实用新型提供一种移动通信终端，包括PCB板和至少一个屏蔽罩，所述屏蔽罩覆盖于所述PCB板上，所述屏蔽罩与所述PCB板密封连接，形成中空的用于存储散热绝缘油的储油腔，所述屏蔽罩上设置有与密封件配合的用于向所述储油腔内注入所述散热绝缘油的注油孔。本实用新型通过使移动通信终端的屏蔽罩和PCB板形成密封的储油腔，并于所述储油腔内注入散热绝缘油，从而使得PCB板上的发热点通过与所述散热绝缘油的热交换，把热量散布到整个机身，实现了移动通信终端的良好散热。

Description

一种移动通信终端 技术领域 本实用新型涉及移动通信领域， 尤其涉及一种散热效果良好的移动通信终端。 背景技术 现有的移动通信终端的发热点主要集中于几个发热较高的芯片， 也就是点温度很 高， 随着移动宽带和互联网的迅速发展， 其数据带宽越来越高， 信息量越来越大， 人 们对于移动通信终端的信息处理速度要求越来越高， 因此移动通信终端的主处理器的 内核越来越多、 主频越来越高， 同时伴随的功耗也越来越大。 目前移动通信终端内芯 片的高度集成，其主要发热点集中在以下几个芯片：应用处理器（Application Processor, 简称为 AP)、 电源管理芯片（Power Management IC， 简称为 PMIC)、射频功放（Radio Frequency Power Amplifier, 简称为 RF PA)。另外现在的显示屏越做越大， 摄像头像素 越来越高， 因此在显示屏高亮时背光的发热， 及高清摄像时摄像头的发热都比较大。 虽然上述几个发热点的温度可能达到八九十度， 但是移动通信终端其它地方却不是很 热， 所以目前采用的措施是将点温度尽快的分散到整个移动通信终端， 这样可以加快 散热并且防止移动通信终端的局部过热。 现有技术中采用的发热措施主要是贴导热硅 胶和石墨片， 导热硅胶主要是纵向导热， 石墨片是横向导热， 从而降低局部温度。 发明内容 本实用新型提供了一种移动终端， 以至少解决相关技术中移动通信终端局部过热 的问题 为解决上述问题， 本实用新型提供了一种移动通信终端， 包括 PCB板和至少一个 屏蔽罩， 所述屏蔽罩覆盖于所述 PCB板上， 所述屏蔽罩与所述 PCB板密封连接， 形 成中空的用于存储散热绝缘油的储油腔， 所述屏蔽罩上设置有与密封件配合的用于向 所述储油腔内注入所述散热绝缘油的注油孔。 优选地， 所述 PCB板上具有多个发热点， 至少一个所述发热点设置于所述屏蔽罩 内。 优选地， 所述屏蔽罩为多个， 多个所述屏蔽罩的罩壁之间形成无间隙结构， 多个 所述屏蔽罩覆盖于所述 PCB板的整个板面上。 优选地， 所述 PCB板上具有至少一个通孔， 所述屏蔽罩覆盖于所述 PCB板的上 下两个板面上， 所述通孔设置于所述屏蔽罩内。 优选地， 覆盖于所述 PCB板的上下两个板面上的屏蔽罩镜面对称。 优选地， PCB板上的所述通孔设置有多个。 优选地， 所述密封件为密封垫片和压盖。 本实用新型通过使移动通信终端的屏蔽罩和 PCB板形成密封的储油腔，并于所述 储油腔内注入散热绝缘油，从而使得 PCB板上的发热点通过与所述散热绝缘油的热交 换， 把热量散布到整个机身， 实现了移动通信终端的良好散热。 附图说明 图 1为本实用新型的实施例的移动通信终端的一结构示意图。 图 2为本实用新型的实施例的移动通信终端的一俯视示意图。 图 3为本实用新型的实施例的移动通信终端的另一结构示意图。 图 4为本实用新型的实施例的移动通信终端的另一俯视示意图。 具体实施方式 为使本实用新型要解决的技术问题、 技术方案和有益效果更加清楚， 下面将结合 附图及具体实施例进行详细描述。 如图 1至图 4所示， 本实用新型提供了一种移动通信终端， 包括 PCB板 1和至少 一个屏蔽罩 2， 屏蔽罩 2覆盖于 PCB板 1上， 屏蔽罩 2与 PCB板 1密封连接， 形成中 空的用于存储散热绝缘油 3的储油腔 4， 屏蔽罩 2上设置有与密封件配合的用于向所 述储油腔内注入散热绝缘油 3的注油孔 5。 上述实施例的技术方案通过在由 PCB板 1和屏蔽罩 2成型的储油腔 4中注入散热 绝缘油 3， 使得 PCB板 1上的电器元件所产生的热量均匀的散布到整个屏蔽罩 2内， 再通过屏蔽罩 2和 PCB板 1将热量传递到整个机身，从而解决了移动通信终端内部散 热不均、 点过热的问题。 为了满足电磁兼容性 （Electro Magnetic Compatibility, 简称 为 EMC)认证的要求， 所述移动通信终端的主要发热点， 例如： 应用处理器 11 (AP)、 电源管理芯片 12 (PMIC)、 射频功放 13 (RF PA) 均应设置于所述屏蔽罩内。 优选地， PCB板 1上具有多个发热点， 至少一个所述发热点设置于所述屏蔽罩 1 内。 在所述移动通信终端的工作过程中， PCB板 1 上的电器元件均或多或少的产生 热量， 但其中存在一些发热较高的点， 将所述发热点置于屏蔽罩 2内， 借助散热绝缘 油 3的流动， 将所述发热点产生的热量均匀的散布到整个机身。 在所述移动通信终端内部， 一般会设置多个屏蔽罩 2来满足 EMC认证的要求， 当屏蔽罩 2为多个时， 多个屏蔽罩 2的罩壁之间形成无间隙结构， 多个屏蔽罩 2覆盖 于 PCB板 1的整个板面上。如此，使得整个 PCB板 1的板面均被屏蔽罩 2覆盖， PBC 板 1产生的热量均由储油腔 4中的散热绝缘油 3吸收， 可到达更优的散热效果。
PCB板 1可为通孔板或非通孔板， 当 PCB板 1上具有至少一个通孔时， 为了避免 散热绝缘油 3的泄露， 屏蔽罩 1需覆盖于 PCB板 1的上下两个板面上， 通孔 14设置 于屏蔽罩 2内。 通孔 14的直径要尽量的大， 且数量最好为多个， 以加快散热绝缘油 3 在上下两层屏蔽罩 2内的流动， 达到更好的散热效果。 优选地， 覆盖于 PCB板 1的上下两个板面上的屏蔽罩 2镜面对称， 由此所述发热 点可置于上下层的屏蔽罩 2内， 更有利于所述发热点与散热绝缘油 3的接触， 从而加 快散热。 优选地， PCB板 1上的通孔 14设置有多个。 优选地， 所述密封件为密封垫片和压盖。 利用所述密封垫片和压盖将所述注油孔 密封， 或者所述注油孔也可采用热熔胶或密封胶进行密封。 以上仅为本实用新型的优选实施例， 任何在此范围内做出的润饰和变化， 均应涵 盖在本实用新型的保护范围之内。 下面举两个优选实施例加以说明： 图 1为本实用新型的实施例的移动通信终端的一结构示意图。 图 2为本实用新型 的实施例的移动通信终端的一俯视示意图。 如图 1、 图 2所示， 本实施例提供了一种 移动通信终端，包括非通孔的 PCB板 1和多个屏蔽罩 2， 多个屏蔽罩 2覆盖于 PCB板 1上， 屏蔽罩 2与 PCB板 1密封连接， 形成中空的用于存储散热绝缘油 3的储油腔 4， 多个屏蔽罩 2上分别设置有用于向储油腔 4内注入散热绝缘油的注油孔 5， 注油孔 5 采用热熔胶密封。 PCB板 1上的应用处理器 11 (AP)、 电源管理芯片 12 (PMIC)、 射 频功放 13 (RF PA) 设置于所述屏蔽罩内。 图 3为本实用新型的实施例的移动通信终端的另一结构示意图。 图 4为本实用新 型的实施例的移动通信终端的另一俯视示意图。 如图 3、 图 4所示， 本实施例提供了 一种移动通信终端， 包括具有多个通孔 14的 PCB板 1和屏蔽罩 2， 屏蔽罩 2覆盖于 PCB板 1的上下两个板面上， 上下两个屏蔽罩 2镜面对称， 多个通孔 14设置于屏蔽 罩 2内， 屏蔽罩 2与 PCB板 1密封连接， 形成中空的用于存储散热绝缘油 3的储油腔 4， 屏蔽罩 2上设置有用于向储油腔 4内注入散热绝缘油的注油孔 5， 工作状态下， 注 油孔 5密封。 PCB板 1上的应用处理器 11 (AP)、 电源管理芯片 12 (PMIC)、 射频功 放 13 (RF PA) 设置于所述屏蔽罩内。 在具体的安装过程中， 设计的屏蔽罩尽量覆盖 PCB板上足够大的区域， 可以根据 移动通信终端的主板形状定制外形匹配的屏蔽罩。 如果有多个屏蔽罩， 屏蔽罩的罩壁 之间的缝隙尽量要小， 即多个屏蔽罩尽量合并做成一个整体。 对于内部含有上述三个 发热器件的屏蔽要用新的工艺进行打样， 该屏蔽罩要是一个整体不能有缝隙， 屏蔽罩 与 PCB板接触的一面最好保证水平， 便于密封焊接。 在对 PCB进行贴片时， 将发热 芯片和屏蔽罩同时进行焊接， 并要保证焊接的密封性。 对 PCB调试完成后， 通过注油 孔向屏蔽罩内注入散热绝缘油， 然后密封注油孔。 散热绝缘油要选择热容高、 导热率 高、 流动性好、 凝固点低、 热安定性和氧化安定性好的绝缘油。 加入绝缘油后， 绝缘 油的热容和导热率均比空气高很多， 因此可以迅速的吸收发热芯片的温度并加快热传 导。 以上所述是本实用新型的优选实施方式， 应当指出， 对于本技术领域的普通技术 人员来说， 在不脱离本实用新型所述原理的前提下， 还可以作出若干改进和润饰， 这 些改进和润饰也应视为本实用新型的保护范围。 工业实用性 如上所述， 本发明实施例提供的一种移动通信终端具有以下有益效果： 通过使移 动通信终端的屏蔽罩和 PCB 板形成密封的储油腔， 并于所述储油腔内注入散热绝缘 油， 从而使得 PCB板上的发热点通过与所述散热绝缘油的热交换， 把热量散布到整个 机身， 实现了移动通信终端的良好散热。

Claims

权 利 要 求 书
1. 一种移动通信终端， 包括 PCB 板和至少一个屏蔽罩， 所述屏蔽罩覆盖于所述 PCB板上，所述屏蔽罩与所述 PCB板密封连接，形成中空的用于存储散热绝缘 油的储油腔， 所述屏蔽罩上设置有与密封件配合的用于向所述储油腔内注入所 述散热绝缘油的注油孔。
2. 根据权利要求 1所述的移动通信终端， 所述 PCB板上具有多个发热点， 其中， 至少一个所述发热点设置于所述屏蔽罩内。
3. 根据权利要求 1所述的移动通信终端， 其中， 所述屏蔽罩为多个， 多个所述屏 蔽罩的罩壁之间形成无间隙结构，多个所述屏蔽罩覆盖于所述 PCB板的整个板 面上。
4. 根据权利要求 1所述的移动通信终端，所述 PCB板上具有至少一个通孔，其中， 所述屏蔽罩覆盖于所述 PCB板的上下两个板面上，所述通孔设置于所述屏蔽罩 内。
5. 根据权利要求 4所述的移动通信终端， 其中， 覆盖于所述 PCB板的上下两个板 面上的屏蔽罩镜面对称。
6. 根据权利要求 4所述的移动通信终端， 其中， PCB板上的所述通孔设置有多
根据权利要求 1所述的移动通信终端， 其中， 所述密封件为密封垫片和压盖。
PCT/CN2014/085339 2014-04-24 2014-08-27 一种移动通信终端 WO2015161601A1 (zh)

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CN101689537A (zh) * 2007-04-26 2010-03-31 陶瓷技术股份公司 用于元件或电路的冷却盒
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