WO2019184674A1 - 导热组件及终端 - Google Patents

导热组件及终端 Download PDF

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Publication number
WO2019184674A1
WO2019184674A1 PCT/CN2019/077228 CN2019077228W WO2019184674A1 WO 2019184674 A1 WO2019184674 A1 WO 2019184674A1 CN 2019077228 W CN2019077228 W CN 2019077228W WO 2019184674 A1 WO2019184674 A1 WO 2019184674A1
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WO
WIPO (PCT)
Prior art keywords
heat
middle frame
hole
heat source
conducting
Prior art date
Application number
PCT/CN2019/077228
Other languages
English (en)
French (fr)
Inventor
孙永富
杨果
李泉明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP19777721.2A priority Critical patent/EP3764760A4/en
Publication of WO2019184674A1 publication Critical patent/WO2019184674A1/zh
Priority to US17/031,040 priority patent/US11284537B2/en
Priority to US17/683,698 priority patent/US11839055B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • the present application relates to the field of electronic technologies, and in particular, to a heat conducting component and a terminal.
  • the mobile phone includes a housing, a middle frame located inside the housing, and a battery, a central processing unit (CPU), and other devices disposed on the middle frame.
  • CPU central processing unit
  • the CPU becomes a large heat source in mobile phones.
  • the present application provides a heat conducting component and a terminal, which can solve the problem of how to dissipate heat emitted by a heat source, and the technical solution is as follows:
  • a thermally conductive assembly comprising: a middle frame and a thermally conductive structure, the middle frame being in the shape of a plate, the middle frame having opposite first and second sides, the middle frame a first through hole connecting the first side surface and the second side surface;
  • the heat conducting structure includes: a heat dissipating portion fixed to the second side surface, and the conductive portion extending In the first through hole, the conducting portion includes: a conducting member and a heat insulating member, the conductive member is connected to the heat radiating portion, and the conductive member is fixed to the first through the heat insulating member Inside the through hole and in contact with a heat source, the heat source is adjacent to one end of the first through hole at the first side.
  • a first through hole is defined in the middle frame of the heat conducting component, and at least a portion of the conductive portion in the heat conducting structure is fixed in the first through hole.
  • the conducting portion comprises: a conducting member capable of conducting heat conduction with the heat source, so that heat generated by the heat source can be conducted into the conducting member, and then transmitted to the heat dissipating portion by the conducting member for heat dissipation, thereby achieving the purpose of dissipating heat from the heat source.
  • the conductive member is fixed to the middle frame by the heat insulating member, and the heat insulating member can insulate the heat on the conductive member.
  • the heat source is in contact with the conductive member, which reduces the contact area between the heat source and the middle frame, thereby reducing the heat conducted from the heat source to the middle frame. Therefore, the temperature of the portion of the middle frame close to the heat source is reduced, and the influence of the device on the middle frame close to the heat source is reduced.
  • the heat insulating member is disposed outside the conductive member, and an area of the outer side of the conductive member except the area in contact with the heat insulating member is spaced apart from an inner wall of the first through hole .
  • the conductive member and the middle frame are not in direct contact, the heat conduction between the conductive member and the middle frame is greatly reduced, and the temperature of the portion of the middle frame close to the heat conducting structure is further reduced.
  • At least one second through hole is further disposed in a region of the middle frame adjacent to the heat dissipation portion. Since the second through hole exists in the region of the middle frame near the heat dissipating portion, the contact area between the heat dissipating portion and the middle frame is reduced, and heat conduction between the heat dissipating portion and the middle frame is reduced.
  • the area of the middle frame adjacent to the heat dissipation portion includes at least a portion of the orthographic projection area of the heat dissipation portion on the middle frame.
  • the heat dissipation portion has a strip shape, and a length of the second through hole along a width direction of the heat dissipation portion is a first length, and the first length is greater than a width of the heat dissipation portion.
  • the second through hole is large, and a part of the heat dissipating portion can be effectively insulated from the middle frame, thereby reducing heat conduction between the portion of the heat dissipating portion and the middle frame.
  • the first through hole is in communication with the second through hole.
  • the first through hole and the second through hole can be simultaneously manufactured, so that the efficiency of manufacturing the middle frame is high.
  • the heat conducting component further includes: a first phase change structure attached to an outer side of a portion of the heat conducting structure that is not in contact with the middle frame and the heat source, The heat in the heat conducting structure is absorbed to reduce the degree of heat generation in the side of the terminal where the heat conducting component is located.
  • the first through hole is a stepped hole
  • the stepped hole includes: an small hole near the second side, and a large hole near the first side, and the large hole and the small hole
  • a step is formed between the holes; the heat insulating member is disposed on the step.
  • the conductive member comprises: a metal sheet, and at least a portion of the evaporation section in the heat pipe, and one side of the metal piece is in contact with the heat source, and the other side of the metal piece and the at least a portion are evaporated Paragraph contact.
  • the metal sheet is overlapped on the heat insulating member.
  • the conductive member comprises: at least a portion of the evaporation section in the heat pipe, and the at least a portion of the evaporation section is in contact with the heat source.
  • the conductive member further includes: a plurality of metal rods, one end of each of the metal rods is fixed on the at least one evaporation section, and the other end is overlapped on the heat insulation member.
  • the number of the metal rods is four, and the four metal rods are divided into two sets of metal rods, and each set of metal rods comprises two metal rods; the two sets of metal rods are respectively located in the at least one part of the evaporation section Side, and the heat source is located between the two metal rods.
  • the heat conducting structure is a heat pipe
  • the heat pipe includes a dead section, an evaporation section and a condensation section, and the evaporation section and the condensation section are sequentially connected, the heat dissipation portion is the condensation section, and the conduction The portion is the evaporation section, and the invalid section is fixed to the second side.
  • the second side is rectangular, the heat source is adjacent to one end of any diagonal of the second side, and the heat sink is adjacent to the other end of any of the diagonals.
  • the heat conducting component further includes: a second phase change structure, the second phase change structure is located at a side of the heat source away from the middle frame for absorbing heat of the heat source.
  • a terminal comprising: a heat source, a housing, and the heat conducting component of the first aspect, the heat conducting component comprising a middle frame and a heat conducting structure, wherein the heat conducting structure is configured to dissipate heat for the heat source
  • the outer casing includes a front casing and a rear casing fixed to both sides of the middle frame; the heat source is located between the front casing and the middle casing, or the heat source Located between the rear case and the middle frame.
  • the heat conducting component comprises a middle frame
  • the heat conducting component further comprises a second phase change structure
  • the second phase change structure is disposed inside the outer casing
  • the heat source is located in the second phase change Between the structure and the middle frame.
  • FIG. 1 is a schematic structural diagram of a heat conducting component according to an embodiment of the present application.
  • Figure 2 is a bottom plan view of the thermally conductive assembly of Figure 1;
  • FIG. 3 is a schematic structural diagram of another heat conducting component according to an embodiment of the present application.
  • Figure 4 is a plan view showing a partial structure of the heat conducting assembly shown in Figure 3;
  • FIG. 5 is a schematic structural diagram of still another heat conducting component according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a terminal according to an embodiment of the present application.
  • a terminal is a device commonly used in people's lives, such as a mobile phone, a tablet computer, and the like.
  • the terminal includes a housing, a middle frame located within the housing, and a battery, CPU, and other components disposed on the middle frame.
  • the CPU, battery or other device may become a heat source in the mobile phone.
  • the CPU is a heat source with a large amount of heat.
  • the embodiment of the present application provides a heat conducting component for a terminal, which can dissipate heat from a heat source, thereby reducing the overall temperature of the terminal.
  • FIG. 1 is a schematic structural view of a heat conducting component according to an embodiment of the present invention.
  • FIG. 2 is a bottom view of FIG. 1 .
  • the heat conducting component 0 may include a middle frame 01 and a heat conducting structure 02 .
  • the middle frame 01 has a plate shape, and the middle frame 01 has a first first side surface M1 and a second side surface M2.
  • the middle frame 01 defines a first through hole A1 communicating with the first side surface M1 and the second side surface M2.
  • the heat conducting structure 02 includes a conducting portion 021 and a heat radiating portion 022.
  • the heat radiating portion 022 is fixed to the second side surface M2, and the conductive portion 021 extends into the first through hole A1.
  • the conductive portion 021 may include a conductive member 0211 and a heat insulating member 0212.
  • the conductive member 0211 may be connected to the heat radiating portion 022, and the conductive member 0211 is fixed to the inner wall of the first through hole A1 through the heat insulating member 0212, and is in contact with the heat source 1.
  • the heat source 1 is adjacent to one end of the first through hole A1 at the first side face M1.
  • the middle frame is provided with a first through hole, and at least a part of the conductive portion in the heat conduction structure is fixed in the first through hole.
  • the conducting portion includes: a conducting member capable of conducting heat conduction with the heat source and the heat dissipating portion, so that heat generated by the heat source can be conducted to the conducting member, and then the conductive member is conducted to the heat dissipating portion for heat dissipation, thereby achieving the purpose of dissipating heat to the heat source.
  • the conductive member is fixed to the middle frame by the heat insulating member, and the heat insulating member can insulate the heat on the conductive member. Since the heat source is in contact with the conductive member, the contact area between the heat source and the middle frame is reduced, thereby reducing the heat conducted from the heat source to the middle frame. Therefore, the temperature of the portion of the middle frame close to the heat source is reduced, and the influence of the device on the middle frame close to the heat source is reduced.
  • the heat dissipating portion may be disposed in the lower half of the middle frame; if the heat source is located in the upper right corner of the middle frame, the heat dissipating portion may be disposed in the lower left corner of the terminal.
  • the second side of the middle frame 01 may have a rectangular shape, and the heat source 1 in FIG. 1 may be close to any diagonal line of the second side (such as a pair connecting the lower left corner vertex and the upper right corner vertex of the rectangle).
  • An end point of the corner line (such as near the upper right corner vertex of the second side), at this time, the heat dissipating portion 022 is close to the other end point of the diagonal line (such as the bottom right corner vertex of the second side).
  • the heat insulator 0212 is disposed outside the conductive member 0211, and an area of the outer side of the conductive member 0211 except the area in contact with the heat insulator 0212 is spaced apart from the inner wall of the first through hole A1. .
  • the conductive member 0211 and the middle frame 01 are not in direct contact, the heat conduction between the conductive member 0211 and the middle frame 01 is greatly reduced, and the temperature of the portion of the middle frame 01 close to the heat conducting structure 02 is further reduced.
  • the heat source 1 may not be in contact with the middle frame 01.
  • the heat conduction between the heat source 1 and the middle frame 01 is greatly reduced, and the temperature of the portion of the middle frame 01 close to the heat source 1 is further reduced.
  • the heat source 1 can also be in contact with the middle frame 01, and the conductive member 0211 can also be in contact with the middle frame 01. This embodiment of the present invention does not limit this.
  • At least one second through hole A2 may be opened in the area of the middle frame 01 near the heat dissipating portion 022.
  • only a second through hole A2 is opened in the middle frame 01.
  • the plurality of second through holes A2 may be disposed on the middle frame 01.
  • the plurality of second through holes A2 may be sequentially arranged along the extending direction of the heat dissipating portion 022. This is not limited.
  • the area of the middle frame 01 near the heat dissipation portion 022 may include at least a portion of the orthographic projection area of the heat dissipation portion 022 on the middle frame 01.
  • the area of the middle frame 01 near the heat dissipation portion 022 may be the orthographic projection area of the heat dissipation portion 022 on the middle frame 01; or the region of the middle frame 01 near the heat dissipation portion 022 may include the heat dissipation portion 022 on the middle frame 01.
  • the orthographic area and the nearby area may be Alternatively, the heat dissipation portion 022 may have a strip shape, and the length of the second through hole A2 in the width direction along the heat dissipation portion 022 is a first length, and the first length may be greater than the width of the heat dissipation portion 022.
  • the minimum projection distance of the orthographic projection of the heat source 1 on the first side M1 in FIG. 1 and the second through hole A2 in FIG. 2 may be greater than or equal to 5 mm.
  • the first through hole A1 is in communication with the second through hole A2.
  • the first through hole A1 and the second through hole A2 can be simultaneously manufactured, so that the efficiency of manufacturing the middle frame 01 is high.
  • the first through hole A1 is not connected to the second through hole A2, which is not limited in this embodiment of the present application.
  • the heat conducting component 0 may further include: a first phase change structure 03 and a second phase change structure 04.
  • Phase change structure 03. The first phase change structure 03 is attached to the outside of the portion of the heat conducting structure 02 that is not in contact with the middle frame 01 and the heat source 1 for absorbing heat in the heat conducting structure 02.
  • the second phase change structure 04 is located on the side of the heat source 1 away from the middle frame 01, that is, the heat source 1 is located between the second phase change structure 04 and the middle frame 01, and the second phase change structure 04 is used to absorb the heat of the heat source 1.
  • the materials of the first phase change structure 03 and the second phase change structure 04 are phase change materials (PCM), and the physical properties of the phase change material can change with the ambient temperature and are changing.
  • the process of physical properties absorbs heat from the environment.
  • the phase change material may be any one of an inorganic material, an organic material, and a mixed phase change material, and the phase change latent heat value of the phase change material is greater than or equal to 120 joules/gram.
  • the amount of phase change material in each of the first phase change structure and the second phase change structure is related to the amount of heat that the phase change structure needs to absorb.
  • the phase change structure may be a phase change material layer having a thickness greater than or equal to 0.1 mm.
  • the heat conduction component 0 may include: two first phase change structures 03 and one second phase change structure 04 , and the two first phase change structures 03 are respectively located on both sides of the heat conduction structure 02 . (Some sides of the portion of the conductive member that is not in contact with the middle frame 01 and the heat source 1 in the heat conducting structure 02).
  • the two first phase change structures 03 are both for absorbing heat on the heat conducting structure 02 to reduce the degree of heat generation in the terminal end of the heat conducting structure 02; the second phase change structure 04 may be disposed inside the outer casing of the terminal.
  • the heat source 1 is located between the middle frame 01 and the second phase change structure 04 (where the heat source 1 can be located inside the rear case of the outer casing), and the second phase change structure 04 is used to reduce the degree of heat generation of the outer casing (especially the rear case) .
  • the heat conducting structure in the embodiment of the present application may have various implementable manners, and several of the implementable modes are exemplified below.
  • the first achievable manner of the thermally conductive structure can be as shown in FIGS. 1 and 2.
  • the first through hole A1 is a stepped hole
  • the stepped hole includes: a small hole close to the second side surface M2 , and a large hole near the first side surface M1 , and a step is formed between the large hole and the small hole.
  • the heat insulator 0212 can be placed on the step.
  • the heat insulator 0212 may include: two sets of heat insulating blocks C1 disposed on the step
  • the conductive member 0211 may include: at least a part of the evaporation section B2 in the heat pipe (in the embodiment of the present application, the conductive member includes the heat pipe) All of the evaporation section B2 is an example) and the metal piece C2.
  • the metal piece C2 may be placed on the two sets of insulating blocks C1, and the at least a part of the evaporation section B2 may be located between the two sets of insulating blocks C1.
  • One side of the metal piece C2 is in contact with the heat source 1, and the other side of the metal piece C2 is in contact with the at least a part of the evaporation section B2.
  • the heat dissipation portion 022 may include a condensation section B3 in the heat pipe.
  • the thermally conductive structure may also include an inactive segment B1 in the heat pipe.
  • the heat pipe may include: a casing, a wick, and a liquid, and the wick is located in the casing, and the liquid is adsorbed in the wick.
  • 2 is a bottom view of the heat conducting assembly shown in FIG. 1.
  • the heat pipes may be sequentially divided into a dead section B1, an evaporation section B2, and a condensation section B3.
  • the heat source is heated to cause the evaporation section B2 to be heated
  • the liquid in the evaporation section B2 evaporates into water vapor and moves to the condensation section B3. Since the condensation section B3 is disposed away from the heat source, the temperature of the condensation section B3 is low, and the water vapor will be Condensation is carried out in the condensation section B3, and the heat from the water vapor is led out in the condensation section B3.
  • the heat source 1 in FIG. 1 may be in contact with the metal piece C2 through a Thermal Interface Material (TIM), and the at least a portion of the evaporation section B2 may also be in contact with the metal piece C2 through the TIM, which is not shown in FIG. TIM.
  • the material of the metal piece C2 may be copper, copper alloy or stainless steel.
  • the opening shape of the first through hole A1 may be any shape such as a square, a rectangle, a circle, or the like, and the width of the step in the stepped hole may be greater than or equal to 2 mm.
  • the insulating block C1 in the heat insulating member may be made of an insulating rubber having a thickness of 0.05 mm or more, and the thermal insulating material may have a thermal conductivity of less than or equal to 0.2 W/m ⁇ Kelvin.
  • the heat pipe (including the inactive section B1, the evaporation section B2, and the condensation section B3) in FIG. 2 may be attached to the second side of the middle frame 01 by a glue such as an insulating paste (not shown in FIG. 2).
  • a second achievable manner of the thermally conductive structure can be as shown in FIGS. 3 and 4.
  • FIG. 3 is a schematic structural view of another heat conducting component according to an embodiment of the present application
  • FIG. 4 is a top view of a partial structure of the heat conducting component shown in FIG. 3 (and the second phase transition in FIG. 3 is not shown in FIG. Structure 04).
  • the first through hole A1 is a stepped hole
  • the stepped hole includes: a small hole near the second side surface M2, and a large hole near the first side surface M1, and a step is formed between the large hole and the small hole.
  • the heat insulator 0212 can be placed on the step.
  • the heat insulator 0212 can include a plurality of insulating blocks C3 including at least a portion of the evaporation section B2 and a plurality of metal rods C4 in the heat pipe.
  • the heat dissipation portion 022 may include a condensation section B3 in the heat pipe.
  • the thermally conductive structure may also include an inactive segment B1 in the heat pipe.
  • each metal rod C4 is fixed on the at least a part of the evaporation section B2, and the other end is overlapped on the heat insulator 0212.
  • the plurality of insulating blocks C3 may be in one-to-one correspondence with the plurality of metal rods C4, and the other end of each of the metal rods C4 is overlapped on the corresponding insulating block C3.
  • the material of the metal rod C4 may be copper, copper alloy or stainless steel.
  • the number of metal rods C4 may be four, and the four metal rods C4 are divided into two sets of metal rods C4, and each set of metal rods C4 includes two metal rods C4.
  • the two sets of metal rods C4 may be respectively located on both sides of the at least a portion of the evaporation section B2, and as shown in FIG. 4, the heat source 1 may be located between the two metal rods C4 of each set of metal rods C4.
  • the heat source 1 in FIG. 3 can be connected to the at least a portion of the evaporation section B2 through the TIM, and the heat insulation block C3 in the heat insulator 0212 can be made of an insulating glue having a thickness of 0.05 mm or more, and the thermal conductivity of the heat insulating adhesive can be Less than or equal to 0.2 watts / meter ⁇ Kelvin.
  • the heat pipe (including the inactive section B1, the evaporation section B2, and the condensation section B3) in FIG. 4 may be attached to the second side of the middle frame 01 by a glue such as an insulating paste (not shown in FIG. 4).
  • a third achievable manner of the thermally conductive structure can be as shown in FIG.
  • FIG. 5 is a schematic structural diagram of still another heat conducting component according to an embodiment of the present application.
  • the conducting portion 021 includes at least a portion of the evaporating section B2 in the heat pipe, and the heat dissipating portion 022 may include a condensing section B3 in the heat pipe.
  • the heat conducting structure may further include an ineffective section B1 in the heat pipe.
  • the heat source is directly in contact with at least a portion of the evaporation section in the heat pipe, and therefore, the two achievable manners can be applied to the first through hole having a small depth
  • the situation that is, applies to the thinner middle frame.
  • the middle frame 01 may further be provided with a first sinking groove (not shown in FIGS. 1 to 5, and the first sinking slot may be located in the middle frame heat pipe).
  • the position where the invalid segment is located) and the second sinking groove (not shown in FIGS. 1 to 5, the second sinking groove may be located at a position where the heat radiating portion of the middle frame is located).
  • the first sinking groove, the first through hole A1, the second through hole A2, and the second sinking groove may be sequentially arranged and communicated.
  • One end of the ineffective section of the heat pipe is laid in the first sinker, and one end of the heat pipe in which the condensation section is located is laid in the second sinker.
  • the depths of the first sinker and the second sinker may each be greater than or equal to 0.15 mm.
  • the middle frame is provided with a first through hole, and at least a part of the conductive portion in the heat conduction structure is fixed in the first through hole.
  • the conducting portion comprises: a conducting member capable of conducting heat conduction with the heat source, so that heat generated by the heat source can be conducted into the conducting member, and then transmitted to the heat dissipating portion by the conducting member for heat dissipation, thereby achieving the purpose of dissipating heat from the heat source.
  • the conductive member is fixed to the middle frame by the heat insulating member, and the heat insulating member can insulate the heat on the conductive member. Since the heat source is in contact with the conductive member, the contact area between the heat source and the middle frame is reduced, thereby reducing the heat conducted from the heat source to the middle frame. Therefore, the temperature of the portion of the middle frame close to the heat source is reduced, and the influence of the device on the middle frame close to the heat source is reduced.
  • the temperature of the middle frame is lowered, the temperature of the side of the terminal in which the middle frame is located can be lowered.
  • heat conduction between the frames in the heat conducting structure can be reduced, thereby reducing the influence of the device disposed in the middle frame close to the heat source.
  • the first phase change structure and the second phase change structure if the heat generated by the heat source is high, the first phase change structure and the second phase change structure can absorb the heat to assist the heat transfer structure to heat The emission is performed to reduce the temperature of the back and sides of the terminal. It has been verified that the heat conducting component provided in the embodiment of the present application can reduce the temperature of the heat source by 3 to 5 degrees Celsius, and the temperature of the outer side of the terminal and the heat source is reduced by 2 to 3 degrees Celsius.
  • the conductive member and the heat dissipating portion can be simultaneously realized by the heat pipe.
  • the heat pipe can be divided into two segments arranged in sequence, and the two segments arranged in sequence can be referred to as an evaporation segment and a condensation segment arranged in sequence; or, the heat pipe can be divided into three segments arranged in sequence, which are sequentially arranged. These three sections of the cloth may be referred to as ineffective sections, evaporation sections, and condensation sections arranged in sequence.
  • the invalid segment, the evaporation segment, and the condensation segment are the names of one segment in the heat pipe.
  • the evaporation section of the heat pipe can be used to realize the above-mentioned conductive member
  • the condensation section of the heat pipe can be used to realize the above-mentioned heat dissipation portion.
  • the drawings provided in the embodiments of the present application (as shown in FIG. 2, FIG. 4 and FIG. 5) only schematically show the positional relationship of the invalid section, the evaporation section and the condensation section obtained by the heat pipe division, and optionally, the heat pipe division
  • the positional relationship of the obtained ineffective section, the evaporation section and the condensation section may also be different from the positional relationship shown in the drawings provided by the embodiments of the present application.
  • FIG. 6 is a schematic structural diagram of a terminal according to an embodiment of the present disclosure.
  • the terminal may include: a heat source 1, a shell, and a heat conducting component.
  • the thermally conductive component can be the thermally conductive component of any of Figures 1 to 5.
  • a thermally conductive component is used to dissipate heat from the heat source.
  • the outer casing may include a front case and a rear case (only the rear case is shown in FIG. 6), and the front case and the rear case are fixed to both sides of the middle frame 01.
  • the heat source 1 is located between the front case and the middle frame 01, or the heat source 1 is located between the rear case and the middle frame 01 (in FIG. 6, the heat source 1 is located between the rear case and the middle frame 01).
  • the terminal 6 can be a mobile phone, a tablet or other type of terminal.
  • the terminal 6 may further include a touch panel, and the middle frame 01 of the heat conducting component may further be provided with a battery compartment.
  • the outer casing opposite to the touch panel also referred to as a rear casing
  • a portion of the outer casing that is connected to the middle frame is not shown in FIG.
  • the heat source 1 can be a CPU, the CPU is disposed on a Printed Circuit Board (PCB), and the heat source 1 can be located between the PCB and the middle frame 01.
  • the heat source 1 can also be fixed to the middle frame 01.
  • the PCB can be fixed on the middle frame by a locking member (such as a screw) (the portion of the PCB connected to the middle frame is not shown in FIG. 6), and the CPU is disposed on a Printed Circuit Board (PCB).
  • the heat source 1 is taken as an example of the CPU.
  • the heat source may be other structures in the terminal.
  • the heat source includes the CPU and the PCB, which is not limited by the embodiment of the present application.
  • the second phase change structure 04 in the heat conducting component may be disposed inside the outer casing.
  • the heat source 1 may be located between the second phase change structure 04 and the middle frame 01.
  • the second phase change structure 04 may be disposed on the inner surface of the rear case, or the second phase change structure 04 may be disposed on the surface of the PCB away from the CPU side. At this time, the second phase change structure 04 is located between the outer casing and the PCB. .
  • the heat transfer material 3 (such as graphite or metal) having a higher thermal conductivity may be covered outside the condensation section of the heat pipe, and the explosion-proof membrane 4 may be attached to the inner side of the outer casing.
  • the terminal may further include at least one network interface, a memory, and at least one bus (not shown in FIG. 6), the bus is used to implement connection communication between the CPU, the network interface, and the memory; the memory and the network interface are respectively Connected to the CPU via the bus.
  • the CPU can also execute executable modules, such as computer programs, stored in memory.
  • the memory may include a high speed random access memory (RAM), and may also include a non-volatile memory such as at least one disk memory.
  • the communication connection between the terminal and at least one other device is implemented by at least one network interface (wired or wireless).
  • the memory stores a program that can be executed by the CPU.

Abstract

本申请公开了一种导热组件及终端，属于电子技术领域。导热组件包括：中框和导热结构，中框呈板状，中框具有相对的第一侧面和第二侧面，中框上开设有连通第一侧面与第二侧面的第一通孔；导热结构包括：散热部和传导部，散热部固定在第二侧面，传导部伸入第一通孔内，传导部包括：传导件和隔热件，传导件与散热部连接，且传导件通过隔热件固定在第一通孔内，并与热源接触，热源靠近第一通孔中位于第一侧面的一端。本申请解决了如何对热源进行散热的问题，本申请用于对热源进行散热。

Description

导热组件及终端
相关申请的交叉引用
本公开要求于2018年3月26日递交的中国专利申请第201810254641.8号的优先权，在此全文引用上述中国专利申请公开的内容以作为本公开的一部分。
技术领域
本申请涉及电子技术领域，特别涉及一种导热组件及终端。
背景技术
随着时代的发展，手机逐渐成为人们生活中必不可少的一部分。
手机包括外壳，位于外壳内的中框，以及设置在中框上的电池、中央处理器(Central Processing Unit，CPU)和其他器件。手机在被用户使用的过程中，CPU成为手机中较大的热源。
因此，如何将手机中热源发出的热传出去成为亟待解决的问题。
发明内容
本申请提供了一种导热组件及终端，可以解决如何将热源发出的热散出的问题，所述技术方案如下：
第一方面，提供了一种导热组件，所述导热组件包括：中框和导热结构，所述中框呈板状，所述中框具有相对的第一侧面和第二侧面，所述中框上开设有连通所述第一侧面与所述第二侧面的第一通孔；所述导热结构包括：散热部和传导部，所述散热部固定在所述第二侧面，所述传导部伸入所述第一通孔内，所述传导部包括：传导件和隔热件，所述传导件与所述散热部连接，且所述传导件通过所述隔热件固定在所述第一通孔内，并与热源接触，所述热源靠近所述第一通孔中位于所述第一侧面的一端。
导热组件中的中框上开设有第一通孔，导热结构中的传导部的至少一部分固定在该第一通孔内。并且，传导部包括：能够与热源进行热传导的传导件，从而使热源产生的热量能够传导至传导件中，进而由传导件传导至散热部进行散热，实现了对热源进行散热的目的。并且，传导件通过隔热件固定在中框上，该隔热件能够对传导件上的热量进行隔热。热源与传导件接触，减少了热源与中框的接触面积，从而减少了从热源传导至中框的热量。因此，减小了中框中靠近热源的部分的温度，减少了中框上靠近热源设置的器件受到的影响。
可选的，所述隔热件设置在所述传导件的外侧，所述传导件的外侧中除与所述隔热件接触的区域之外的区域与所述第一通孔的内壁间隔设置。此时，传导件与中框并没有直接接触，大大减少了传导件与中框之间热传导，进一步减小了中框中靠近导热结构的部分的温度。
可选的，所述中框上靠近所述散热部的区域还开设有至少一个第二通孔。由于中框上靠近散热部的区域存在第二通孔，从而减少了散热部与中框的接触面积，减少了散热部与 中框之间的热传导。
可选的，所述中框上靠近所述散热部的区域包括所述散热部在所述中框上的至少一部分正投影区域。
可选的，所述散热部呈条状，所述第二通孔在沿着所述散热部的宽度方向上的长度为第一长度，所述第一长度大于所述散热部的宽度。此时第二通孔较大，能够有效的将散热部中的一部分与中框隔绝，减少了散热部中的这一部分与中框之间的热传导。
可选的，所述第一通孔与所述第二通孔连通。这样一来，在制造中框时，第一通孔与第二通孔可以同时制造，因此制造中框的效率较高。
可选的，所述导热组件还包括：第一相变结构，所述第一相变结构贴附在所述导热结构中未与所述中框及所述热源接触的部分的外侧，用于吸收所述导热结构中的热量，以减轻导热组件所在的终端中侧边的发热程度。
可选的，所述第一通孔为阶梯孔，所述阶梯孔包括：靠近所述第二侧面的小孔，以及靠近所述第一侧面的大孔，且所述大孔和所述小孔之间形成有台阶；所述隔热件设置在所述台阶上。
可选的，所述传导件包括：金属片，以及热管中的至少一部分蒸发段，且所述金属片的一侧与所述热源接触，所述金属片的另一侧与所述至少一部分蒸发段接触。
可选的，所述金属片搭接在所述隔热件上。
可选的，所述传导件包括：热管中的至少一部分蒸发段，且所述至少一部分蒸发段与所述热源接触。
可选的，所述传导件还包括：多个金属杆，每个所述金属杆的一端固定在所述至少一部分蒸发段上，另一端搭接在所述隔热件上。
可选的，所述金属杆的数量为四，四个金属杆分为两组金属杆，每组金属杆包括两个金属杆；所述两组金属杆分别位于所述至少一部分蒸发段的两侧，且所述热源位于所述两个金属杆之间。
可选地，所述导热结构为热管，所述热管包括无效段、蒸发段和冷凝段，并且所述蒸发段和所述冷凝段依次连接，所述散热部为所述冷凝段，所述传导部为所述蒸发段，所述无效段固定在所述第二侧面。
可选地，所述第二侧面呈矩形，所述热源靠近所述第二侧面的任一对角线的一个端点，所述散热部靠近所述任一对角线的另一个端点。
可选地，所述导热组件还包括：第二相变结构，所述第二相变结构位于所述热源远离所述中框的一侧，用于吸收所述热源的热量。
第二方面，提供了一种终端，所述终端包括：热源、外壳以及第一方面所述的导热组件，所述导热组件包括中框和导热结构，所述导热结构用于为所述热源散热；所述外壳包括前壳和后壳，所述前壳和所述后壳固定在所述中框的两侧；所述热源位于所述前壳与所述中框之间，或所述热源位于所述后壳与所述中框之间。
可选的，所述导热组件包括中框，所述导热组件还包括第二相变结构，所述第二相变结构设置在所述外壳的内侧，且所述热源位于所述第二相变结构与所述中框之间。
附图说明
图1为本申请实施例提供的一种导热组件的结构示意图；
图2为图1所示的导热组件的仰视图；
图3为本申请实施例提供的另一种导热组件的结构示意图；
图4为图3所示的导热组件中局部结构的俯视图；
图5为本申请实施例提供的又一种导热组件的结构示意图；
图6为本申请实施例提供的一种终端的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
终端是人们生活中常用到的一种设备，如手机、平板电脑等电子设备。终端包括外壳，位于外壳内的中框，以及设置在中框上的电池、CPU和其他器件。终端在被用户使用的过程中，CPU、电池或者其他器件均可能成为手机中的热源。其中，CPU为发热量较大的热源。本申请实施例提供了一种用于终端的导热组件，该导热组件能够对热源进行散热，进而降低终端的整体温度。
图1为本申请实施例提供的一种导热组件的结构示意图，图2为图1的仰视图，请结合图1和图2，该导热组件0可以包括：中框01和导热结构02。
中框01呈板状，中框01具有相对的第一侧面M1和第二侧面M2，且中框01上开设有连通第一侧面M1和第二侧面M2的第一通孔A1。
导热结构02包括：传导部021和散热部022。散热部022固定在第二侧面M2，传导部021伸入第一通孔A1内。传导部021可以包括：传导件0211和隔热件0212，传导件0211可以与散热部022连接，且传导件0211通过隔热件0212固定在第一通孔A1的内壁，并与热源1接触，热源1靠近第一通孔A1中位于第一侧面M1的一端。
综上所述，本申请实施例提供的导热组件中，中框上开设有第一通孔，导热结构中的传导部的至少一部分固定在该第一通孔内。并且，传导部包括：能够与热源和散热部进行热传导的传导件，从而使热源产生的热量能够传导至传导件中，进而由传导件传导至散热部进行散热，实现了对热源进行散热的目的。
并且，传导件通过隔热件固定在中框上，该隔热件能够对传导件上的热量进行隔热。由于热源与传导件接触，所以，减少了热源与中框的接触面积，从而减少了从热源传导至中框的热量。因此，减小了中框中靠近热源的部分的温度，减少了中框上靠近热源设置的器件受到的影响。
另外需要说明的是，为了实现较好的散热效果，需要将散热部远离热源设置。例如，若热源位于中框的上半部分，则散热部可以设置在中框的下半部分；若热源位于中框的右上角，则可以将散热部设置在终端的左下角。如图2所示，中框01的第二侧面可以呈矩形，图1中的热源1可以靠近该第二侧面的任一对角线(比如连接该矩形的左下角顶点和右上角顶点的对角线)的一个端点(比如靠近第二侧面的右上角顶点)，此时，散热部022靠近该任一对角线的另一个端点(比如靠近第二侧面的右下角顶点)。
可选的，请参考图1，隔热件0212设置在传导件0211的外侧，传导件0211的外侧中 除与隔热件0212接触的区域之外的区域与第一通孔A1的内壁间隔设置。此时，传导件0211与中框01并没有直接接触，大大减少了传导件0211与中框01之间的热传导，进一步减小了中框01中靠近导热结构02的部分的温度。可选的，热源1可以与中框01不接触，此时，大大减少了热源1与中框01之间热传导，进一步减小了中框01中靠近热源1的部分的温度。实际应用中，热源1也可以与中框01少部分接触，传导件0211也可以与中框01少部分接触，本申请实施例对此不作限定。
进一步的，请参考图2，中框01上靠近散热部022的区域还可以开设有至少一个第二通孔A2，本申请实施例中仅以中框01上开设有一个第二通孔A2为例，实际应用中中框01上还可以开设有多个第二通孔A2，可选地，该多个第二通孔A2可以沿散热部022的延伸方向依次排布，本申请实施例对此不做限定。由于中框01上靠近散热部022的区域存在第二通孔A2，从而减少了散热部022与中框01的接触面积，减少了散热部022与中框01之间的热传导。其中，该中框01上靠近散热部022的区域可以包括散热部022在中框01上的至少一部分正投影区域。比如该中框01上靠近散热部022的区域可以为散热部022在中框01上的正投影区域；或者，该中框01上靠近散热部022的区域可以包括散热部022在中框01上的正投影区域和附近区域。可选地，散热部022可以呈条状，第二通孔A2在沿着散热部022的宽度方向上的长度为第一长度，第一长度可以大于散热部022的宽度。可选的，图1中的热源1在第一侧面M1上的正投影与图2中第二通孔A2的最小边缘距离可以大于或等于5毫米。
可选的，请继续参考图2，第一通孔A1与第二通孔A2连通。这样一来，在制造中框01时，第一通孔A1与第二通孔A2可以同时制造，因此制造中框01的效率较高。实际应用中，第一通孔A1还可以与第二通孔A2不连通，本申请实施例对此不作限定。
可选的，请继续参考图1，该导热组件0还可以包括：第一相变结构03和第二相变结构04，需要说明的是，图2中并未示出图1中的第一相变结构03。该第一相变结构03贴附在导热结构02中未与中框01及热源1接触的部分的外侧，用于吸收导热结构02中的热量。第二相变结构04位于热源1远离中框01的一侧，也即热源1位于第二相变结构04与中框01之间，第二相变结构04用于吸收热源1的热量。
需要说明的是，该第一相变结构03和第二相变结构04的材质均为相变材质(phase change material，PCM)，该相变材质的物理性质能够随环境温度改变，并在改变物理性质的过程中吸收环境中的热量。可选的，相变材质可以是无机材质、有机材质及混合相变材质中任意一种材质，该相变材质的相变潜热值大于或等于120焦耳/克。第一相变结构和第二相变结构中的每个相变结构中相变材质的多少与该相变结构需要吸收的热量相关。例如，若相变结构的材质为焓值为120焦耳/克的相变材质，当需要相变结构在1分钟内吸收1瓦特的热量时，则需要使用的相变材质的质量为：1*1*60/120＝0.5克，该相变结构可以为厚度大于或等于0.1毫米的相变材质层。
本申请实施例中对第一相变结构03和第二相变结构04的个数和大小不作限定。示例的，请继续参考图1，导热组件0可以包括：两个第一相变结构03和一个第二相变结构04，且这两个第一相变结构03分别位于导热结构02的两侧(如位于导热结构02中传导件中未与中框01和热源1接触的部分的两侧)。这两个第一相变结构03均用于吸收导热结构02上的热量，以减轻该导热结构02所在的终端中侧边的发热程度；第二相变结构04可以设 置在终端的外壳内侧，且热源1位于中框01与第二相变结构04之间(此时热源1可以位于外壳中后壳的内侧)，第二相变结构04用于减轻外壳(尤其是后壳)的发热程度。
本申请实施例中的导热结构可以具有多种可实现方式，以下将对其中的几种可实现方式进行举例说明。
第一方面，导热结构的第一种可实现方式可以如图1和图2所示。
请参考图1，第一通孔A1为阶梯孔，该阶梯孔包括：靠近第二侧面M2的小孔，以及靠近第一侧面M1的大孔，且大孔和小孔之间形成有台阶，隔热件0212可以设置在台阶上。示例的，隔热件0212可以包括：设置在该台阶上的两组隔热块C1，传导件0211可以包括：热管中的至少一部分蒸发段B2(本申请实施例中以传导件包括热管中的全部蒸发段B2为例)和金属片C2。金属片C2可以搭设在这两组隔热块C1上，该至少一部分蒸发段B2可以位于这两组隔热块C1之间。金属片C2的一侧与热源1接触，金属片C2的另一侧与该至少一部分蒸发段B2接触。请参考图2，散热部022可以包括热管中的冷凝段B3。可选地，导热结构还可以包括热管中的无效段B1。
需要说明的是，热管可以包括：管壳、吸液芯以及液体，吸液芯位于管壳中，吸液芯中吸附有液体。图2为图1所示的导热组件的仰视图，如图2所示，热管可以依次划分为无效段B1、蒸发段B2和冷凝段B3。当热源发热使得蒸发段B2受热时，蒸发段B2内的液体会蒸发为水蒸气，并向冷凝段B3移动，由于冷凝段B3远离热源设置，因此冷凝段B3的温度较低，水蒸气会在冷凝段B3中进行冷凝，并且水蒸气带来的热量会在冷凝段B3导出热管。
进一步地，图1中的热源1可以通过导热接口材料(Thermal Interface Material，TIM)与金属片C2接触，该至少一部分蒸发段B2也可以通过TIM与金属片C2接触，图1中并未示出TIM。金属片C2的材质可以为铜、铜合金或不锈钢等。第一通孔A1的开口形状可以为任意形状，如：正方形、长方形、圆形等，阶梯孔中台阶的宽度可以大于或等于2毫米。隔热件中的隔热块C1可以由厚度大于或等于0.05毫米的隔热胶制成，隔热胶的导热率可以小于或等于0.2瓦/米·开尔文。图2中的热管(包括无效段B1、蒸发段B2和冷凝段B3)可以通过胶(如隔热胶，图2中未示出)粘贴在中框01的第二侧面。
第二方面，导热结构的第二种可实现方式可以如图3和图4所示。
图3为本申请实施例提供的另一种导热组件的结构示意图，图4为图3所示的导热组件中局部结构的俯视图(且图4中并未示出图3中的第二相变结构04)。请参考图3，第一通孔A1为阶梯孔，该阶梯孔包括：靠近第二侧面M2的小孔，以及靠近第一侧面M1的大孔，且大孔和小孔之间形成有台阶，隔热件0212可以设置在台阶上。隔热件0212可以包括多个隔热块C3，该传导件0211包括：热管中的至少一部分蒸发段B2和多个金属杆C4。请参考图4，散热部022可以包括热管中的冷凝段B3。可选地，导热结构还可以包括热管中的无效段B1。
请继续参考图3，每个金属杆C4的一端均固定在该至少一部分蒸发段B2上，另一端搭接在隔热件0212上。示例的，该多个隔热块C3可以与多个金属杆C4一一对应，每个金属杆C4的另一端均搭接在对应的隔热块C3上。金属杆C4的材质可以为铜、铜合金或不 锈钢等。如图4所示，金属杆C4的数量可以为四，四个金属杆C4分为两组金属杆C4，每组金属杆C4包括两个金属杆C4。这两组金属杆C4可以分别位于该至少一部分蒸发段B2的两侧，且如图4所示热源1可以位于每组金属杆C4中的两个金属杆C4之间。
图3中的热源1可以通过TIM与该至少一部分蒸发段B2连接，隔热件0212中的隔热块C3可以由厚度大于或等于0.05毫米的隔热胶制成，隔热胶的导热率可以小于或等于0.2瓦/米·开尔文。图4中的热管(包括无效段B1、蒸发段B2和冷凝段B3)可以通过胶(如隔热胶，图4中未示出)粘贴在中框01的第二侧面。
第三方面，导热结构的第三种可实现方式可以如图5所示。
图5为本申请实施例提供的又一种导热组件的结构示意图。如图5所示，该传导部021包括：热管中的至少一部分蒸发段B2，散热部022可以包括热管中的冷凝段B3，可选地，导热结构还可以包括热管中的无效段B1。
在导热结构的第二种可实现方式和第三种可实现方式中，热源直接与热管中的至少一部分蒸发段接触，因此，这两种可实现方式可以适用于第一通孔的深度较小的情况，也即适用于较薄的中框。
可选的，图1至图5所示的导热组件中，中框01上还可以设置有第一沉槽(图1至图5均未示出，第一沉槽可以位于中框中热管的无效段所在的位置)和第二沉槽(图1至图5均未示出，第二沉槽可以位于中框中散热部所在的位置)。第一沉槽、第一通孔A1、第二通孔A2和第二沉槽可以依次排布并连通。热管中无效段所在的一端铺设在第一沉槽内，热管中冷凝段所在的一端铺设在第二沉槽内。第一沉槽和第二沉槽的深度均可以大于或等于0.15毫米。
综上所述，本申请实施例提供的导热组件中，中框上开设有第一通孔，导热结构中的传导部的至少一部分固定在该第一通孔内。并且，传导部包括：能够与热源进行热传导的传导件，从而使热源产生的热量能够传导至传导件中，进而由传导件传导至散热部进行散热，实现了对热源进行散热的目的。
并且，传导件通过隔热件固定在中框上，该隔热件能够对传导件上的热量进行隔热。由于热源与传导件接触，所以减少了热源与中框的接触面积，从而减少了从热源传导至中框的热量。因此，减小了中框中靠近热源的部分的温度，减少了中框上靠近热源设置的器件受到的影响。
另外，由于中框的温度降低，因此能够降低中框所在的终端中侧边的温度。并且，在第二通孔的作用下，能够减少导热结构中框之间的热传导，进而减少中框中靠近热源设置的器件受到的影响。在第一相变结构和第二相变结构的作用下，若热源发出的热量较高，则该第一相变结构和第二相变结构能够对该热量进行吸收，以辅助导热结构对热量进行散发，从而能够降低终端背面和侧面的温度。经验证，本申请实施例中提供的导热组件能够将热源的温度降低3～5摄氏度，同时终端侧边以及热源附近外壳的温度会降低2～3摄氏度。
需要说明的是，本申请实施例中可以通过热管同时实现传导件和散热部。比如，可以将热管划分为依次排布的两段，依次排布的这两段可以称为依次排布的蒸发段和冷凝段；或者，可以将热管划分为依次排布的三段，依次排布的这三段可以称为依次排布的无效段、蒸发段和冷凝段。无效段、蒸发段和冷凝段均为热管中一个分段的名称。其中，热管的蒸发段可以用于实现上述传导件，热管的冷凝段可以用于实现上述散热部。另外，本申请实 施例提供的附图(如图2、图4和图5)仅示意性的示出了热管划分得到的无效段、蒸发段和冷凝段的位置关系，可选地，热管划分得到的无效段、蒸发段和冷凝段的位置关系还可以与本申请实施例提供的附图示出的位置关系不同。
图6为本申请实施例提供的一种终端的结构示意图，如图6所示，该终端可以包括：热源1、外壳和导热组件。该导热组件可以为图1至图5任一所述的导热组件。导热组件用于将热源发出的热量散出。
外壳可以包括前壳和后壳(图6中仅示出了后壳)，前壳和后壳固定在中框01的两侧。热源1位于前壳与中框01之间，或热源1位于后壳与中框01之间(图6中以热源1位于后壳与中框01之间为例)。
可选的，该终端6可以为手机、平板电脑或其他类型的终端。终端6还可以包括触控面板，导热组件中的中框01上还可以设置有电池仓。需要说明的是，图6中仅示出了外壳中与触控面板相对的一部分(也称为后壳)，且图6中并未示出外壳中与中框连接的部分。
热源1可以为CPU，CPU设置在印制电路板(Printed Circuit Board，PCB)上，且热源1可以位于PCB与中框01之间。可选地，热源1也可以固定在中框01上。示例地，PCB可以通过锁紧件(如螺丝)固定在中框上(图6中未示出PCB中与中框连接的部分)，又CPU设置在印制电路板(Printed Circuit Board，PCB)上，相当于CPU通过PCB固定在中框上。需要说明的是，本申请实施例中以热源1为CPU为例，可选地，热源也可以为终端中的其他结构，比如热源包括CPU和上述PCB，本申请实施例对此不作限定。
可选地，导热组件中的第二相变结构04可以设置在外壳内侧热源1可以位于第二相变结构04与中框01之间。比如，第二相变结构04可以设置在后壳的内表面，或者第二相变结构04可以设置在PCB远离CPU一侧的表面，此时，第二相变结构04位于外壳和PCB之间。
另外，热管的冷凝段外还可以覆盖具有较高导热系数的导热材料3(例如石墨或金属等)，外壳的内侧还可以贴附有防爆膜4。
可选的，该终端还可以包括至少一个网络接口、存储器、至少一个总线(图6中均未示出)，总线用于实现CPU、网络接口和存储器之间的连接通信；存储器与网络接口分别通过总线与CPU相连。CPU还可以执行存储器中存储的可执行模块，例如计算机程序。存储器可能包含高速随机存取存储器(Random Access Memory，RAM)，也可能还包括非不稳定的存储器(non-volatile memory)，例如至少一个磁盘存储器。通过至少一个网络接口(有线或者无线)实现终端与至少一个其他设备之间的通信连接。在一些实施方式中，存储器存储了程序，程序能够被CPU执行。

Claims (17)

  1. 一种导热组件，其特征在于，所述导热组件包括：中框和导热结构，
    所述中框呈板状，所述中框具有相对的第一侧面和第二侧面，所述中框上开设有连通所述第一侧面与所述第二侧面的第一通孔；
    所述导热结构包括：散热部和传导部，所述散热部固定在所述第二侧面，所述传导部伸入所述第一通孔内，所述传导部包括：传导件和隔热件，所述传导件与所述散热部连接，且所述传导件通过所述隔热件固定在所述第一通孔内，并与热源接触，所述热源靠近所述第一通孔中位于所述第一侧面的一端。
  2. 根据权利要求1所述的导热组件，其特征在于，所述隔热件设置在所述传导件的外侧，所述传导件的外侧中除与所述隔热件接触的区域之外的区域与所述第一通孔的内壁间隔设置。
  3. 根据权利要求1所述的导热组件，其特征在于，所述中框上靠近所述散热部的区域还开设有至少一个第二通孔。
  4. 根据权利要求3所述的导热组件，其特征在于，所述中框上靠近所述散热部的区域包括所述散热部在所述中框上的至少一部分正投影区域。
  5. 根据权利要求3所述的导热组件，其特征在于，所述散热部呈条状，所述第二通孔在沿着所述散热部的宽度方向上的长度为第一长度，所述第一长度大于所述散热部的宽度。
  6. 根据权利要求3所述的导热组件，其特征在于，
    所述第一通孔与所述第二通孔连通。
  7. 根据权利要求1所述的导热组件，其特征在于，所述导热组件还包括：第一相变结构，所述第一相变结构贴附在所述导热结构中未与所述中框及所述热源接触的部分的外侧，用于吸收所述导热结构中的热量。
  8. 根据权利要求1所述的导热组件，其特征在于，
    所述第一通孔为阶梯孔，所述阶梯孔包括：靠近所述第一侧面的大孔，以及靠近所述第二侧面的小孔，且所述大孔和所述小孔之间形成有台阶；所述隔热件设置在所述台阶上。
  9. 根据权利要求8所述的导热组件，其特征在于，所述传导件包括：金属片，以及热管中的至少一部分蒸发段，且所述金属片的一侧与所述热源接触，所述金属片的另一侧与所述至少一部分蒸发段接触。
  10. 根据权利要求9所述的导热组件，其特征在于，所述金属片搭接在所述隔热件上。
  11. 根据权利要求8所述的导热组件，其特征在于，所述传导件包括：热管中的至少一部分蒸发段，且所述至少一部分蒸发段与所述热源接触。
  12. 根据权利要求11所述的导热组件，其特征在于，所述传导件还包括：多个金属杆，每个所述金属杆的一端固定在所述至少一部分蒸发段上，另一端搭接在所述隔热件上。
  13. 根据权利要求12所述的导热组件，其特征在于，所述金属杆的数量为四，四个金属杆分为两组金属杆，每组金属杆包括两个金属杆；
    所述两组金属杆分别位于所述至少一部分蒸发段的两侧，且所述热源位于所述两个金属杆之间。
  14. 根据权利要求9至13任一所述的导热组件，其特征在于，所述导热结构为热管，所述热管包括无效段、蒸发段和冷凝段，并且所述蒸发段和所述冷凝段依次连接，所述散热部为所述冷凝段，所述传导部为所述蒸发段，所述无效段固定在所述第二侧面。
  15. 根据权利要求1所述的导热组件，其特征在于，所述第二侧面呈矩形，所述热源靠近所述第二侧面的任一对角线的一个端点，所述散热部靠近所述任一对角线的另一个端点。
  16. 一种终端，其特征在于，所述终端包括：热源、外壳以及权利要求1至15任一所述的导热组件，
    所述导热组件包括中框和导热结构，所述导热结构用于为所述热源散热；
    所述外壳包括前壳和后壳，所述前壳和所述后壳固定在所述中框的两侧；
    所述热源位于所述前壳与所述中框之间，或所述热源位于所述后壳与所述中框之间。
  17. 根据权利要求16所述的终端，其特征在于，所述导热组件包括中框，所述导热组件还包括第二相变结构，
    所述第二相变结构设置在所述外壳的内侧，且所述热源位于所述第二相变结构与所述中框之间。
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