WO2021083142A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2021083142A1
WO2021083142A1 PCT/CN2020/123986 CN2020123986W WO2021083142A1 WO 2021083142 A1 WO2021083142 A1 WO 2021083142A1 CN 2020123986 W CN2020123986 W CN 2020123986W WO 2021083142 A1 WO2021083142 A1 WO 2021083142A1
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WO
WIPO (PCT)
Prior art keywords
heat
cover
back cover
electronic device
middle frame
Prior art date
Application number
PCT/CN2020/123986
Other languages
English (en)
French (fr)
Inventor
李伟
余依伦
刘毅
王剑亮
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021083142A1 publication Critical patent/WO2021083142A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

Definitions

  • This application relates to an electronic device, in particular to the technical field of electronic device heat dissipation.
  • a VC is usually installed in the middle frame of the electronic device.
  • VC is a vacuum chamber with fine structure on the inner wall and filled with working fluid.
  • the commonly used material of VC is copper, and the working fluid is pure water or liquid ammonia.
  • the working principle of VC includes four processes of conduction, evaporation, convection, and solidification. The heat generated by the heat source enters the plate through thermal conduction.
  • the working fluid close to the heat source absorbs the heat and vaporizes while taking away a large amount of heat; in the VC vacuum chamber
  • the steam diffuses from the high temperature zone to the low temperature zone, and when the steam contacts the low temperature inner wall, the steam will condense into a liquid and release heat energy; the working fluid condensed into a liquid returns to the heat source by the capillary force of the fine structure, thereby completing a heat transfer Circulation, forming a circulatory system in which vapor and liquid coexist.
  • the heat sources such as SOC (System on Chip) of most electronic equipment are set to face the side of the display screen, while VC is mainly assembled or embedded in the middle frame in the electronic equipment. One side (end) of the VC and the SOC, etc.
  • the heat source is arranged in contact with each other, and the heat emitted by the heat source is transferred to the middle frame through the other side of the VC for uniform temperature and heat dissipation.
  • Some electronic devices have the SOC placed on the side facing the back cover. At this time, how to effectively solve the SOC heat dissipation of the electronic device without increasing the thickness of the electronic device and ensure the stable operation of the electronic device has become an urgent problem for those skilled in the art. .
  • the embodiment of the present invention provides an electronic device, which can improve the heat dissipation efficiency of the electronic device without increasing the thickness of the electronic device, and solve the problem that the local temperature of the electronic device is too high.
  • the technical solution of the present invention provides an electronic device, the electronic device includes: a display screen; a middle frame including a first surface facing a first direction and a second surface facing a second direction, the first The direction is opposite to the second direction, the display screen is arranged on the first side of the middle frame; the printed circuit board is arranged on the second side of the second direction of the middle frame; the electronic components are arranged on the printed circuit board, and the electronic components are Surrounded by a shielding cover mounted on the printed circuit board, thermal interface materials are arranged between the shielding cover and the electronic components; the back cover is arranged in the second direction of the middle frame, and the back cover includes the first groove of the back cover; heat dissipation
  • the device includes a first surface and a second surface, a first end and a second end, the first surface of the heat dissipating device is thermally coupled with the first shielding cover mounted on the printed circuit board through the thermal interface material, and the heat dissipating device is the second The surface
  • the heat sink is embedded in the back cover without increasing the thickness of the electronic device, and at the same time, the heat generated by the electronic components is conducted to the back cover, and the heat is evenly dissipated through the back cover to avoid excessive temperature in the area where the electronic components are located.
  • the heat sink device includes other heat sink devices such as a heat pipe, a vacuum chamber soaking plate and the like.
  • a heat sink with higher thermal conductivity is selected to conduct the heat generated by the electronic components to the back cover, and evenly dissipate heat through the back cover, so as to avoid excessive temperature in the area where the electronic components are located.
  • the second surface of the radiator element may be fixed to the first groove of the back cover by an adhesive, wherein the adhesive may include a phase change material that absorbs heat and stores heat ingredient.
  • the viscose not only serves to fix the heat sink and the first groove of the back cover, but also plays a role of heat insulation, absorbing and storing part of the heat, and avoiding the temperature of the back cover of the electronic device from being too high, which will affect the user's hand-held feeling and experience degree.
  • a first heat insulation area is provided between the radiator element and the back cover, and the first heat insulation area is provided corresponding to the position of the first shielding cover, wherein the first heat insulation area
  • One heat insulation area is set as a vacuum structure or the first heat insulation area is filled with vacuum fiber heat insulation material, aerogel and other heat transfer barrier materials.
  • the first surface of the heat dissipating device is provided with a soaking material, and the soaking material includes graphite sheets, graphene films, thermally conductive coating materials, ceramic materials, and thermally conductive gels. , One or any combination of phase change materials.
  • the heat-soaking material effectively diffuses the heat conducted by the radiator device in the back cover and other low-temperature areas of the electronic device, so as to prevent the local temperature of the back cover from being too high, thereby affecting the user's hand-holding and experience.
  • the soaking material is arranged between the display screen and the middle frame; or the soaking material is arranged on the second surface in the second direction of the middle frame and is opposite to the middle frame. fit. In this way, the soaking material effectively diffuses the heat conducted by the middle frame, and avoids the local temperature of the middle frame from being too high.
  • a back cover decorative layer is further provided on one side of the back cover, and the back cover decorative layer and the back cover are bonded by adhesive; the back cover decorative layer and the back cover A second heat-insulating area is arranged in between, wherein the second heat-insulating area is arranged corresponding to the position of the first shielding cover.
  • the second surface of the middle frame of the electronic device in the second direction is provided with a first groove of the middle frame, and a thermal conductive sheet is arranged in the first groove of the middle frame, wherein
  • the thermal conductive sheet adopts one or any combination of high thermal conductivity materials such as silver sheet, copper sheet, aluminum sheet, steel sheet, and metal alloy.
  • the thermally conductive sheet is thermally coupled with the second shielding cover mounted on the printed circuit board through the thermal interface material. In this way, the middle frame is better used for heat dissipation, and the heat generated by the electronic components is quickly transferred to the middle frame through the thermal conductive sheet, and the thickness of the electronic device is not increased.
  • the technical solution of the present invention provides an electronic device, the electronic device includes: a display screen; a middle frame including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction On the two sides, the display screen is arranged on the first side of the middle frame in the first direction; the printed circuit board is arranged on the second side of the middle frame in the second direction; the electronic components are arranged on the printed circuit board, and the electronic components are Surrounded by a shielding cover mounted on the printed circuit board, a thermal interface material is arranged between the shielding cover and the electronic components; the back cover is arranged in the second direction of the middle frame, and the back cover includes a first groove of the back cover; The first cover plate, the first cover plate is inserted into the first groove of the back cover, a first vacuum chamber is arranged between the first cover plate and the back cover, and the first vacuum chamber is provided with a capillary structure, a working fluid and a supporting column
  • the first cover plate includes a first end and a second end, wherein the first end and/or the second end of the first cover plate includes a protruding structure, and The protruding structure at the first end and/or the second end of a cover plate is used for coupling with the first groove of the back cover.
  • the convex structure of the first cover plate is better welded or bonded to the back cover, which improves the strength and stability of the VC heat dissipation structure formed between the first cover plate and the back cover.
  • the capillary structure includes other structural forms such as sintered metal powder, grooves, or metal mesh, and the capillary structure is attached to the surface of the back cover or the surface of the first cover, or Attached to the side wall of the back cover;
  • the working fluid includes one or a combination of pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds;
  • the support column is attached to the back cover and/or the first The surface of a cover. In this way, a more stable structure is selected for the capillary structure and the support column to ensure the strength and stability of the VC heat dissipation structure formed between the first cover plate and the back cover.
  • a back cover decorative layer is further provided on one side of the back cover, and the back cover decorative layer and the back cover are bonded by adhesive, wherein the adhesive includes heat absorption Heat storage phase change material composition; a first heat insulation area is provided between the decorative layer of the back cover and the back cover, the first heat insulation area is set corresponding to the position of the first shielding cover, and the first heat insulation area is set as Vacuum structure, or the first heat insulation area is filled with vacuum fiber heat insulation material, aerogel and other heat transfer barrier materials. In this way, the local temperature of the back cover is prevented from being too high, thereby affecting the user's hand-holding and experience.
  • the first surface of the first cover plate is provided with a soaking material
  • the soaking material includes graphite sheets, graphene films, thermally conductive coating materials, ceramic materials, and thermally conductive materials.
  • the soaking material is arranged between the display screen and the middle frame; or the soaking material is arranged on the second surface of the middle frame in the second direction and is attached to the middle frame.
  • the heat equalizing material effectively diffuses the heat conducted by the middle frame and the VC heat dissipation structure, and avoids the local temperature of the middle frame and the back cover from being too high.
  • the second surface in the second direction of the middle frame is provided with a first groove of the middle frame, and a heat conducting sheet is arranged in the first groove of the middle frame, wherein the heat conducting sheet adopts One or any combination of high thermal conductivity materials such as silver sheet, copper sheet, aluminum sheet, steel sheet, metal alloy, etc., the heat conduction sheet is heated between the thermal interface material and the second shielding cover mounted on the printed circuit board. coupling.
  • the middle frame is better used for heat dissipation, and the heat generated by the electronic components is quickly transferred to the middle frame through the thermal conductive sheet, and the thickness of the electronic device is not increased.
  • FIG. 1A is a schematic exploded view of the overall structure of an electronic device according to an embodiment of the present invention.
  • 1B is a schematic diagram of five sides of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a heat dissipation structure of a VC embedded in the back cover of an electronic device according to an embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional view of another VC embedded in the heat dissipation structure of the back cover of an electronic device according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a VC shape of an electronic device provided by an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a VC shape of another electronic device according to an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of another heat dissipation structure of VC embedded in the back cover of an electronic device according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of another VC embedded in the heat dissipation structure of the back cover of an electronic device according to an embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of a VC heat dissipation structure combined with a first cover plate and a rear cover of an electronic device according to an embodiment of the present invention
  • FIG. 9 is a schematic cross-sectional view of another first cover plate and a rear cover of an electronic device combined into a VC heat dissipation structure provided by an embodiment of the present invention.
  • Fig. 10 is a schematic cross-sectional view of another first cover and a rear cover of an electronic device combined to form a VC heat dissipation structure according to an embodiment of the present invention
  • FIG. 11 is a schematic cross-sectional view of another first cover plate and a rear cover of an electronic device combined into a VC heat dissipation structure provided by an embodiment of the present invention.
  • the electronic device refers to a data computing and processing function and wireless Electronic equipment with communication function.
  • Electronic devices include but are not limited to: smart phones (such as Android phones, iOS (iPhone Operating System) and other mobile phones equipped with other operating systems), tablet computers, handheld computers, portable multimedia players, electronic photo frames, electronic game consoles, notebook computers, Mobile Internet Devices, wearable devices (such as smart watches, smart bracelets, smart glasses, head-mounted devices (HMD), etc.), smart home devices, Internet of Things devices, smart cars, etc.
  • smart phones such as Android phones, iOS (iPhone Operating System) and other mobile phones equipped with other operating systems
  • tablet computers handheld computers
  • portable multimedia players electronic photo frames
  • electronic game consoles notebook computers
  • Mobile Internet Devices wearable devices (such as smart watches, smart bracelets, smart glasses, head-mounted devices (HMD), etc.), smart home devices, Internet of Things devices, smart cars, etc.
  • HMD head-mounted devices
  • the heat dissipation structure provided by the embodiments of the present invention can be installed in various electronic devices, and can evenly spread the heat generated by heating elements such as chips in the electronic device within the electronic device.
  • the specific arrangement of the heat dissipation structure in the electronic device will be described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can understand the uniform heat dissipation process of the heat dissipation structure to the heating elements in the electronic device.
  • the first embodiment of the present invention provides a heat dissipation structure of an electronic device.
  • FIG. 1A is a schematic exploded view of the overall structure of an electronic device provided by an embodiment of the present invention.
  • the electronic device includes: a display screen 1, a middle frame 2, a battery 3, and a PCB 4 (Printed Circuit Board), heating element 5, TIM6 (Thermal Interface Materials, thermal interface material), shielding cover 7, TIM8, heat spreading material 9, heat sink 10, adhesive 11, heat insulation area 12, Rear cover 13.
  • FIG. 1B is a schematic diagram of five sides of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a heat dissipation structure of a VC embedded in the back cover of an electronic device according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along the direction of the reference line L1 of FIG. 1B.
  • the middle frame 2 can be used to carry the PCB 4, the display screen 1, and the battery 3.
  • the display screen 1 and the PCB 4 can be respectively arranged on both sides of the middle frame 2, the heating element 5 is arranged on the PCB 4, and the shielding cover 7 is arranged on the PCB 4 corresponding to the heating element 5, a TIM 6 is arranged between the shielding cover 7 and the heating element 5, the back cover 13 is located on the side where the PCB 4 is located, and the back cover 13 is provided with a back cover first groove 14 for heat dissipation
  • the device 10 is arranged in the back cover 13 in a manner of being embedded in the first groove 14 of the back cover.
  • a heat-dissipating material 9 may be arranged on the heat-dissipating device 10, and the heat-dissipating part 10 may be bonded to the shielding by the heat-dissipating material 9 and TIM8.
  • the cover 7 is connected indirectly.
  • the electronic device can also be provided with a battery 3.
  • the battery 3 can be arranged between the middle frame 2 and the back cover 13, and the middle frame 2 can be used to support the battery 3. Since the battery is also a heating element, the heat sink 10 can be opposite to the shielding cover 7 and the battery 3 at the same time, so that the heat sink 10 can dissipate heat from the shielding cover 7 and the battery 3.
  • the heat generated by the heating element can be conducted along the direction indicated by the dashed line with an arrow in Figure 2, and the conduction path can be: on the one hand, the heating element 5 provided in the shield 7 generates The heat is conducted to the radiator device 10 through the shield cover 7. The heat in the portion of the radiator device 10 and the heating element 5 (or shield cover 7) directly opposite is concentrated. The radiator device 10 absorbs part of the heat through two-phase gas-liquid change, and the rest of the heat It will conduct heat to the end of the heat sink 10 away from the heating element 5, so that the heat can be effectively diffused in the back cover 13. On the other hand, the heat generated by the PCB 4 and the battery 3 can be conducted to the middle frame 2, and the Box 2 diffuses the heat away.
  • the soaking material 9 can include any one of graphite sheet, graphene film, thermally conductive coating material, ceramic material, thermally conductive gel, phase change material, or any combination of the two, and the soaking material 9 can be used as a heat sink device. 10
  • the conducted heat is evenly distributed on the back cover 13 and other low temperature places to avoid overheating at a certain point.
  • a through hole can also be provided on the heat-soaking material 9 corresponding to the position of the shielding cover 7, so that the shielding cover 7 can directly fit and contact the heat sink 10 through the TIM8.
  • FIG. 3 is a schematic cross-sectional view of another heat dissipation structure of VC embedded in the back cover of an electronic device provided by an embodiment of the present invention.
  • the heat-dissipating material 15 may be disposed in the middle frame 2 and Between the batteries 3, thereby effectively distributing the heat generated by the battery 3 on the middle frame; or the heat-dissipating material 15 can be arranged between the display screen 1 and the middle frame 2, or there can be equalizers on both sides of the middle frame 2.
  • the thermal material 15 can achieve uniform heat dissipation and avoid the local temperature of the electronic device from being too high.
  • the soaking material 9 is the same as the soaking material 15, and can include any one of graphite sheet, graphene film, thermally conductive coating material, ceramic material, thermally conductive gel, phase change material, etc. Or any combination of the two.
  • the heat sink 10 may include two-phase heat sinks such as VC (Vapor Chamber, vacuum chamber soaking plate) and heat pipe.
  • the radiator device 10 can transfer the heat generated by the heating element 5 to the low temperature area of the electronic device, effectively realizing uniform heat dissipation.
  • the heat sink device 10 may be a VC.
  • 4 and 5 are schematic diagrams of a VC shape of an electronic device provided by an embodiment of the present invention. As shown in Figure 4, the radiator device 10 may include an A terminal and a B terminal.
  • the heating element 5 (not shown) conducts heat to the shield cover 7, and conducts the heat to the end A of the radiator device 10 through the shield cover 7.
  • the radiator device 10 can conduct heat to the end B far away from the shielding cover 7 to achieve uniform heat dissipation of the electronic device; or as shown in FIG. 5, the radiator device 10 can include ends A, B and C, and a heating element 5 (not shown) The heat is conducted to the shielding cover 7, and through the shielding cover 7 to one end A of the heat sink 10, the heat sink 10 can conduct heat to one end B and the other end C away from the shielding cover 7, so as to realize uniform heat dissipation of the electronic equipment.
  • heat sink device 10 in the embodiment of the present invention can be set in different shapes, that is, the heat sink device 10 in the example of the present invention can also be set in other shapes, and the embodiment of the present invention does not constitute a modification of the shape. limit.
  • the adhesive glue 11 is provided between the radiator element 10 and the back cover 13 to play the role of adhering the radiator element 10 and the back cover 13.
  • the adhesive 11 may contain heat-absorbing and heat-storing phase change material components.
  • the adhesive 11 can absorb the back cover 13 to reduce the temperature of the back cover 13 to avoid excessively high temperature when the user holds the electronic device, thereby affecting the user experience.
  • the position of the heat insulation area 12 corresponding to the heating element 5 is arranged between the rear cover 13 and the heat sink 10.
  • the heat-insulating area 12 may be set as a vacuum layer, and the effect produced is that the heat generated by the heating element 5 corresponding to the heat-insulating area 12 will not be quickly transferred to the corresponding heating element 5 through the heat sink device 10
  • the position on the back cover 13 and the heat insulation area 12 effectively block the conduction of heat, prevent the heat generated by the heating element 5 from being locally collected in the back cover 13, and prevent the local temperature from being too high when the user holds the electronic device, thereby affecting the user experience .
  • the heat insulation area 12 can also be filled with vacuum fiber heat insulation material, aerogel and other heat transfer barrier materials to prevent the heat sink 10 from reducing the heat generated by the heating element 5 Concentrated conduction to a certain position of the rear cover 13 to avoid local overheating of the rear cover.
  • the thermal interface material TIM6 is filled between the heating element 5 and the shielding cover 7, and the thermal interface material TIM8 is disposed between the heat sink device 10 and the shielding cover 7. Since there is an air gap between the heating element 5 and the shielding cover 7 (or the radiator device 10 and the shielding cover 7), since the air conduction series is very small, the heating element 5 and the shielding cover 7 (or the radiator device 10 and the shielding cover 7) are both There will be a large contact thermal resistance between them. Use a thermal interface material with high thermal conductivity to fill these gaps, exclude the air, and establish an effective heat conduction channel between the heating element 5 and the heat sink 10, which can greatly reduce The contact thermal resistance enables the heat sink device 10 to fully play its role.
  • the TIM6 and/or TIM8 in this embodiment may include one or a combination of silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet, and thermally conductive gel.
  • the heating element 5 includes but is not limited to CPU (Central Processing Unit), AI (Artificial Intelligence) processor, SOC (System on Chip, system on chip), power management Units, or other electronic components or electronic components that require heat dissipation.
  • CPU Central Processing Unit
  • AI Artificial Intelligence
  • SOC System on Chip, system on chip
  • power management Units or other electronic components or electronic components that require heat dissipation.
  • FIG. 6 is a schematic cross-sectional view of a heat dissipation structure of a VC embedded in the back cover of an electronic device according to an embodiment of the present invention.
  • the electronic equipment includes: display screen 1, middle frame 2, battery 3, PCB4, heating element 5, TIM6, shielding cover 7, TIM8, heat spreading material 9, heat sink 10, adhesive 11 , The heat-insulating area 12, the back cover 13, the adhesive 16, the heat-insulating area 17, and the back cover decoration layer 18. It should be noted that most of the structure of the electronic device shown in FIG. 6 is similar to that in the first embodiment of the present invention.
  • a rear cover decorative layer 18 is provided behind the rear cover 13 of the electronic device, and the rear cover 13 and the rear cover decorative layer 18 are bonded by an adhesive 16, wherein
  • the materials used for the adhesive 16 and the adhesive 11 can be the same, so as to play the role of adhering the decorative layer 18 of the rear cover and the rear cover 13.
  • the adhesive 16 may include heat-absorbing and heat-storing phase change material components, and the adhesive 16 may absorb the heat conducted from the rear cover 13 to the rear cover decorative layer 18.
  • a heat insulation area 17 may also be provided between the back cover 13 and the back cover decoration layer 18, and the heat insulation area 17 is used to block the heat conducted from the back cover 13 to the back cover decoration layer 18, so as to prevent the user from holding the electronic device Sometimes the temperature is too high, which affects the user experience.
  • the heat insulation area 17 can be set as a vacuum layer, filled with vacuum fiber heat insulation material, aerogel and other heat transfer barrier materials to prevent the heat sink device 10 from concentrating the heat generated by the heating element 5 to the rear cover 13 and the rear Cover a certain position of the decorative layer 13 to avoid local overheating of the back cover.
  • the back cover 13 and the back cover decoration layer 13 belong to two different structures in the electronic device.
  • the back cover 13 is generally used as a structural protection and support strengthening component of the electronic device.
  • the cover decoration layer 13 plays the role of decoration, beauty, scratch resistance and other technical aspects.
  • the second embodiment of the present invention provides another heat dissipation structure of an electronic device.
  • FIG. 7 is a schematic cross-sectional view of another heat dissipation structure of a VC embedded in the back cover of an electronic device provided by an embodiment of the present invention.
  • the electronic device includes: a display screen 1, a middle frame 2, a battery 3, a PCB4, Heating element 5, TIM6, shielding cover 7, TIM8, heating element 9, TIM10, shielding cover 11, TIM12, middle frame first groove 13, heat conducting sheet 14, heat spreading material 15, heat sink 16, adhesive glue 17, The heat insulation area 18, the back cover 19, the adhesive glue 20, the heat insulation area 21, the rear cover decoration layer 22, the first groove 23 of the back cover, and the heat-soaking material 24.
  • the middle frame 2 can be used to carry the PCB 4, the display screen 1 and the battery 3.
  • the display screen 1 and the PCB 4 can be respectively arranged on both sides of the middle frame 2, the back cover 19 is located on the side where the PCB 4 is located, and the heating element 5 and The heating elements 9 are respectively arranged on different sides of the PCB4, the shielding cover 7 is arranged on one side of the PCB4 corresponding to the heating element 5, and the shielding cover 11 is arranged on the other side of the PCB4 corresponding to the heating element 9.
  • the shielding cover 7 and the heating element 9 are arranged on the other side of the PCB4.
  • a TIM6 is provided between the elements 5, a TIM10 is provided between the shielding cover 11 and the heating element 9, a back cover first groove 23 is provided in the back cover 19, and the heat sink 16 is arranged in a manner of being inserted into the back cover first groove 23
  • a heat-dissipating material 15 may be provided on the heat-dissipating element 16, and the heat-dissipating part 16 and the shielding cover 7 can be indirectly connected through the bonding of the heat-dissipating material 15 and the TIM 8, or in the embodiment of the present invention, the heat-dissipating element
  • the thermal material 15 is provided with a through hole corresponding to the position where the shielding cover 7 is located, so that the shielding cover 7 can directly fit and contact the heat sink 16 through the TIM8.
  • the embodiment of the present invention improves the structure of the middle frame 2 of the electronic device.
  • the side of the middle frame 2 away from the display screen 1 can be provided with a first groove 13 of the middle frame corresponding to the position of the shielding cover 11, and the first groove 13 of the middle frame is provided with a heat conduction
  • the heat-conducting sheet 14 can be in contact with the shielding cover 11 through the TIM 12, and a heat-soaking material 24 can be provided between the middle frame 2 and the display screen 1.
  • the design of the above heat dissipation structure can effectively conduct the heat generated by the heating element 9 to the heat conducting sheet 14 through the shielding cover 11, and the heat conducting sheet 14 can quickly conduct the heat to the middle frame 2, and then heat the heat through the middle frame 2.
  • the heat generated by the element 9 is effectively and evenly distributed.
  • the back cover 19 and the middle frame 2 of the electronic device can be effectively utilized for heat dissipation at the same time, and the heat dissipation performance can be greatly improved without increasing the thickness of the electronic device.
  • the thermal conductive sheet 14 may be any one or a combination of high thermal conductivity materials such as silver sheet, copper sheet, aluminum sheet, steel sheet, metal alloy, etc., which is not limited in the embodiment of the present invention.
  • TIM6, TIM8, TIM10, and TIM12 in the implementation of the present invention may include one or a combination of: silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet, and thermal conductive gel.
  • the functions of TIM6, TIM8, TIM10 and TIM12 are all to reduce the thermal resistance between components and enhance the heat conduction effect.
  • the electronic device can also be provided with a battery 3.
  • the battery 3 can be arranged between the middle frame 2 and the back cover 13, and the middle frame 2 can be used to support the battery 3. Since the battery is also a heating element, the heat sink 16 can be opposite to the shielding cover 7 and the battery 3 at the same time, so that the heat sink 16 can dissipate heat from the shielding cover 7 and the battery 3.
  • the heat generated by the heating element 5 and the heating element 9 can be conducted along the direction indicated by the dashed line with arrows in Figure 7, and the conduction path can be: on the one hand, the heat generated by the heating element 5 passes through The shielding cover 7 is conducted to the radiating element 16, where the heat in the portion facing the radiating element 16 and the heating element 5 is relatively concentrated.
  • the radiating element 16 absorbs part of the heat through the two-phase gas-liquid change, and the rest of the heat will be transferred to the radiating element 16 away from the heating element
  • the end of 5 conducts conduction, so that the heat is effectively diffused in the back cover 19; on the other hand, a shielding cover 11 is provided on the heating element 9 on the other side of the PCB 4, and the shielding cover 11 removes the heat generated by the heating element 9
  • the heat is conducted to the thermally conductive sheet 14, and then the heat is conducted to the middle frame 2 by the thermally conductive sheet 14, and then the heat is evenly diffused out through the good thermal conductivity of the middle frame 2.
  • an adhesive 17 and a heat-insulating area 18 are provided between the back cover 19 and the radiator element 16, and a back cover decorative layer 22 is provided on one side of the back cover 19, and the back cover 19 and the back cover decorative layer 22 are located between the back cover 19 and the back cover decorative layer 22.
  • the adhesive glue 20 is used for bonding, and a heat-insulating area 21 may be provided between the back cover 19 and the back-cover decorative layer 22, and the heat-insulating area 21 is arranged corresponding to the position of the heating element 5.
  • the adhesive glue 20, adhesive glue 17, heat-insulating area 18 and heat-insulating area 21 respectively correspond to the adhesive glue and heat-insulating area in the first embodiment, and the composition materials and effects are the same, so they will not be here anymore. Go into details.
  • the third embodiment of the present invention provides another heat dissipation structure of an electronic device.
  • FIG. 8 is a schematic cross-sectional view of a VC heat dissipation structure combined with a first cover and a rear cover of an electronic device according to an embodiment of the present invention.
  • the electronic device includes: a display screen 1, a middle frame 2, and a battery 3. PCB4, heating element 5, TIM6, shielding cover 7, TIM8, soaking material 9, first cover plate 10, first vacuum chamber 11, back cover first groove 12, back cover 13, adhesive 14 , Heat insulation area 15, rear cover decoration layer 16.
  • the middle frame 2 can be used to carry the PCB 4, the display screen 1 and the battery 3.
  • the display screen 1 and the PCB 4 can be respectively arranged on both sides of the middle frame 2, the heating element 5 is arranged on the PCB 4, and the shielding cover 7 is arranged on the PCB corresponding to the heating element 5, a TIM6 is arranged between the shielding cover 7 and the heating element 5, the back cover 13 is located on the side where the PCB 4 is located, and the back cover 13 is provided with a first groove of the back cover 12.
  • the first cover plate 10 is placed in the first groove 12 of the back cover, the first cover plate 10 and the back cover 13 can be connected by welding, and a first vacuum is formed between the first cover plate 10 and the back cover 13
  • the chamber 11, the first vacuum chamber 11 may be provided with a capillary structure, a working fluid and a support column (not shown), the back cover 13 may be used as a second cover plate, the first cover plate 10, the first vacuum chamber
  • the chamber 11 (including the capillary structure, the working fluid and the supporting column) and the back cover 13 (as the second cover plate) can form a VC heat dissipation structure 17, and the first cover plate 7 can be provided with a heat-dissipating material 9 through which the heat-dissipating material 9 Attaching to the TIM8 realizes the indirect connection between the first cover plate 10 and the shielding cover 7.
  • the design of the heat dissipation structure of the electronic device can transfer the heat generated by the heating element 5 to the back cover 13 through the shielding cover 7, and then evenly diffuse to the low temperature of the electronic device, effectively avoiding the local temperature of the electronic device from overheating, and at the same time effectively The thickness of the equipment is reduced, and the heat can be effectively dissipated without increasing the thickness of the equipment.
  • the electronic device may also be provided with a battery 3.
  • the battery 3 may be arranged between the middle frame 2 and the back cover 13, and the middle frame 2 may be used to support the battery 3. Since the battery is also a heating element, in this way, the VC heat dissipation structure 17 can be opposed to the shielding cover 7 and the battery 3 at the same time, so as to realize the heat dissipation of the VC heat dissipation structure 17 to the shielding cover 7 and the battery 3.
  • the heat conduction path generated by the heating element 5 in the embodiment of the present invention may include: on the one hand, the heat generated by the heating element 5 arranged in the shielding cover 7 is conducted to the first cover plate 10 through the shielding cover 7, wherein the first cover plate 10 The heat in the part directly opposite to the heating element 5 is relatively concentrated.
  • the VC heat dissipation structure 17 composed of the first cover plate 10, the first vacuum chamber 11 and the back cover 13 absorbs part of the heat through a two-phase gas-liquid change, and the rest of the heat will be transferred to
  • the VC heat dissipation structure 17 conducts away from the end of the heating element 5, so that the heat is effectively diffused in the back cover 13 of the electronic device; on the other hand, the heat generated by the PCB 4 and the battery 3 can be conducted to the middle frame 2. Use the middle frame 2 to diffuse the heat.
  • a rear cover decorative layer 16 may be provided on one side of the rear cover 13, wherein the rear cover 13 and the rear cover decorative layer 16 are bonded by bonding
  • the glue 14 is bonded, and a heat insulation area 15 is provided between the back cover 13 and the back cover decoration layer 16, and the heat insulation area 15 is set corresponding to the position of the heating element 5.
  • the adhesive 14 may contain a heat-absorbing and heat-storing phase change material component, which can absorb the heat conducted to the back cover 13 and the back cover decorative layer 16 to prevent the user from holding the electronic device from excessively high temperature, thereby affecting the user experience.
  • the heat insulation area 15 can be set as a vacuum layer, filled with vacuum fiber heat insulation material, aerogel and other heat transfer barrier materials to prevent the VC heat dissipation structure 17 from concentrating the heat generated by the heating element 5 to the back cover 13 and
  • the decorative layer 16 of the rear cover is positioned directly opposite to the heating element 5 to avoid excessive local temperature of the rear cover.
  • the soaking material 9 can be attached to the first cover plate 10 and the back cover 13 to be arranged, and contact with the shielding cover 7 through the TIM8, or a through hole can be provided on the soaking material 9 at a position facing the shielding cover 7.
  • the shielding cover 7 can be joined to the first cover plate 10 through the TIM8.
  • the soaking material 9 can include graphite sheets, graphene films, thermally conductive coating materials, ceramic materials, thermally conductive gels, phase change materials, etc.
  • the soaking material 9 can evenly distribute the heat conducted by the VC heat dissipation structure 17
  • the back cover 13 of the electronic device and other low temperature places avoid overheating at a certain point.
  • the soaking material 9 can be arranged between the middle frame 2 and the battery 3 to effectively distribute the heat generated by the battery 3 on the middle frame; or the soaking material 9 can be arranged on the display screen 1 and Between the middle frames 2 to achieve uniform heat dissipation; or, heat-dissipating materials 9 may be provided on both sides of the middle frame 2 to achieve uniform heat dissipation and avoid excessive local temperature of the electronic equipment.
  • the VC heat dissipation structure 17 in the embodiment of the present invention is composed of a first cover plate 10, a first vacuum chamber 11, and a back cover 13.
  • the materials of the first cover plate 10 and the back cover 13 can be the same or different.
  • the material of the first cover 10 and the rear cover 13 may be, but not limited to, metals such as copper, copper alloy, titanium or titanium alloy; or composed of non-metals, such as organic polymer materials or glass materials; or Materials such as composites of different metals, or composites of metals and non-metals.
  • the first cover plate 10 can be arranged at a position close to the heating element 5 relative to the rear cover 13. Referring to the cross-sectional view shown in FIG.
  • the shape of the two ends of the first cover plate 10 may be set to be convex so as to facilitate the fitting of the first cover plate 10 and the bottom of the back cover first groove 12 of the back cover 13.
  • the shape design of a cover plate 10 is beneficial to improve the welding stability of the first cover plate 10 and the rear cover 13.
  • the first cover plate 10 can be set in different shapes.
  • FIGS. 9 and 10 are respectively a schematic cross section of another first cover plate and the back cover of the electronic device provided by the embodiment of the present invention to form a VC heat dissipation structure.
  • the difference from the structure shown in Figure 8 is that the shape of the first cover plate 10 at one end close to the heating element 5 can be set in a convex shape to facilitate the first cover plate 10 and the back cover
  • the bottom of the first groove 12 is fitted, and the shape of the first cover plate 10 at the end away from the heating element 5 can be set to a flat plate shape to facilitate fitting with the side wall of the first groove 12 of the rear cover.
  • the shape design of the first cover plate 10 is beneficial to improve the welding stability of the first cover plate 10 and the rear cover 13, and effectively reduce the weight of the electronic device; or refer to the cross-sectional view shown in FIG. 10, which is similar to that of FIGS. 8 and 9.
  • the heat dissipation structure of the electronic device is shown, in which the shape of the first cover plate 10 at the end away from the heating element 5 can be set in a convex shape to facilitate the fitting between the first cover plate 10 and the bottom of the first groove 12 of the rear cover , And the shape of the first cover plate 10 at one end close to the heating element 5 can be set to a flat plate shape to facilitate fitting with the side wall of the first groove 12 of the rear cover.
  • the shape design of the first cover plate 10 is beneficial to The welding stability of the first cover 10 and the rear cover 13 is improved, and the weight of the electronic device is effectively reduced.
  • the first cover 10 can be set in different shapes to be fitted with the back cover 13 to form a VC heat dissipation structure.
  • the implementation of the present invention The shape of the first cover plate 10 listed in the example does not constitute a restriction on the shape of the first cover plate 10.
  • a capillary structure may be provided in the first vacuum chamber 11 formed by fitting the first cover plate 10 and the rear cover 13 together.
  • the capillary structure is described with a sintered powder body, but Not limited to this.
  • the capillary structure can also be selected as a groove or a metal mesh or other structural forms.
  • the capillary structure may be attached to the bottom of the first groove 12 of the back cover; or the capillary structure may be attached to the side walls at both ends of the first groove 12 of the back cover; or the capillary The structure may be attached to the first cover plate 10.
  • a support column may be provided in the first vacuum chamber 11, the support column may be provided in the first vacuum chamber 11, and the support column may be fixed to the first groove 12 of the back cover. The bottom; or the support column can be fixed on the first cover 10.
  • the upper and lower ends of the support column respectively abut the upper and lower inner walls of the first vacuum chamber 11, and the support column is used to support the VC heat dissipation structure formed by the first cover plate 10 and the rear cover 13.
  • a working fluid may be provided in the first vacuum chamber 11, and the working fluid may be pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, or organic compounds. One or more combinations. It is understandable that the embodiment of the present invention does not limit the material of the working fluid.
  • the fourth embodiment of the present invention provides another heat dissipation structure of an electronic device.
  • FIG. 11 is a schematic cross-sectional view of another first cover plate and a rear cover of an electronic device provided by an embodiment of the present invention combined into a VC heat dissipation structure.
  • the electronic device includes: a display screen 1, a middle frame 2, Battery 3, PCB4, heating element 5, TIM6, shielding cover 7, TIM8, heating element 9, TIM10, shielding cover 11, TIM12, middle frame first groove 13, thermal conductive sheet 14, heat equalizing material 15, first cover plate 16.
  • the middle frame 2 can be used to carry the PCB 4, the display screen 1, and the battery 3.
  • the display screen 1 and the PCB 4 can be respectively arranged on both sides of the middle frame 2, the heating element 5 and the heating element 9 are arranged on the PCB 4, and the shielding cover 7 is arranged on one side of the PCB 4 corresponding to the heating element 5, and the shielding cover 11 is arranged on the other side of the PCB 4 corresponding to the heating element 9; a TIM6 is provided between the shielding cover 7 and the heating element 5, the shielding cover 11 and A TIM10 is arranged between the heating elements 9, and the back cover 19 is provided with a back cover first groove 18, the first cover plate 16 is placed in the back cover first groove 18, the first cover plate 16 and the back cover 19 can be used The connection is made by welding.
  • a first vacuum chamber 17 is formed between the first cover plate 16 and the rear cover 19.
  • the first vacuum chamber 17 may be provided with a capillary structure, a working fluid, and a support column (not shown).
  • the cover 19 can be used as a second cover plate.
  • the first cover plate 16, the first vacuum chamber 17 (including the capillary structure, working fluid, and support column), and the back cover 19 (as the second cover plate) can form a VC for heat dissipation. Structure 23.
  • the first cover plate 16 can be provided with a soaking material 15, and the soaking material 15 and the TIM 8 are attached to realize the indirect connection between the first cover plate 16 and the shielding cover 7, or in the embodiment of the present invention, the soaking material can also be
  • the material 15 is provided with a through hole corresponding to the position where the shielding cover 7 is located, so that the shielding cover 7 can directly fit and contact the first cover plate 16 through the TIM8.
  • the design of the heat dissipation structure of the electronic device can transfer the heat generated by the heating element to the back cover 19 through the shielding cover 7, and then evenly diffuse to the low temperature of the electronic device, effectively avoiding the local temperature of the electronic device from overheating, and at the same time effectively The thickness of the equipment is reduced, so that the heat can be effectively dissipated without increasing the thickness of the equipment.
  • the electronic device may also be provided with a battery 3.
  • the battery 3 may be disposed between the middle frame 2 and the back cover 19, and the middle frame 2 may be used to support the battery 3. Since the battery is also a heating element, in this way, the VC heat dissipation structure 23 can be opposed to the shielding cover 7 and the battery 3 at the same time, so as to realize the heat dissipation of the VC heat dissipation structure 23 to the shielding cover 7 and the battery 3.
  • the embodiment of the present invention improves the structure of the middle frame 2 of the electronic device.
  • the side of the middle frame 2 facing away from the display screen 1 can be provided with the first groove 13 of the middle frame corresponding to the position of the shielding cover 11.
  • the first groove 13 of the middle frame is welded with heat conduction
  • the heat-conducting sheet 14 can be in contact with the shielding cover 11 through the TIM 12, and a heat-soaking material 24 can be provided between the middle frame 2 and the display screen 1.
  • the design of the above heat dissipation structure can effectively conduct the heat generated by the heating element 9 to the heat conducting sheet 14 through the shielding cover 11, and the heat conducting sheet 14 can quickly conduct the heat to the middle frame 2, and then heat the heat through the middle frame 2.
  • the heat generated by the element 9 is effectively distributed in various positions of the electronic device.
  • the back cover 19 and the middle frame 2 of the electronic device can be effectively utilized for heat dissipation at the same time, and the heat dissipation performance can be greatly improved without increasing the thickness of the electronic device.
  • the thermal conductive sheet 15 may be one or a combination of high thermal conductivity materials such as silver sheet, copper sheet, aluminum sheet, steel sheet, metal alloy, etc., which is not limited in the embodiment of the present invention.

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Abstract

本申请提供了一种电子设备，尤其涉及电子设备散热领域。所述电子设备包括：显示屏；中框，包括面向第一方向的第一面和面向第二方向的第二面，第一方向和第二方向相反，显示屏设置于中框的第一面；印刷电路板，设置在中框第二方向的第二面；电子元器件，布置在印刷电路板上，且电子元器件被安装在印刷电路板上的屏蔽罩所包围，屏蔽罩和电子元器件之间设置有热界面材料；后盖，设置在中框第二方向，后盖上包括有后盖第一凹槽；散热器件，包括第一表面和第二表面，第一端和第二端，散热器件的第一表面通过热界面材料与安装在印刷电路板上的第一屏蔽罩之间热耦合，散热器件第二表面嵌入后盖第一凹槽。

Description

一种电子设备
本申请要求在2019年10月28日提交中国国家知识产权局、申请号为201911031896.9的中国专利申请的优先权，发明名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到一种电子设备，尤其涉及到电子设备散热技术领域。
背景技术
随着手机、平板电脑等电子设备的性能越来越强，其芯片功耗和发热量也越来越高。尤其是随着5G时代的到来，功耗的继续增加，电子设备将产生更多的热量。过多的热量将会造成设备温度升高，反过来影响设备的性能和寿命。最初的电子设备散热方案多以石墨膜实现设备均热效果，现在两相散热器件热管和VC(Vapor Chamber，真空腔均热板)成为散热方案的趋势，尤其是VC因其良好的导热率往往成为电子设备的散热技术方案。
为了解决电子设备的散热问题，通常在电子设备的中框中设置VC。VC是一个内壁具有微细结构，并注入工作液的真空腔体。目前VC常用材质为铜，工作液为纯水或者液氨等。VC的工作原理包括了传导、蒸发、对流、凝固四个流程，热源产生的热量通过热传导进入板内，靠近热源位置的工作液吸收热量后即汽化，同时带走大量热量；VC真空腔体内的蒸汽由高温区扩散至低温区，且当蒸汽接触到低温内壁时，蒸汽会凝结成液体并释放出热能；凝结成液态的工作液通过微细结构的毛细力作用返回热源处，由此完成一次热传导循环，形成一个汽液两相并存的循环系统。目前，大多数电子设备的SOC(System on Chip，片上系统)等热源设置为面向显示屏一侧，而VC在电子设备中主要装配或镶嵌于中框上，VC的一面(端)与SOC等热源相对设置而接触，通过VC的另一面将热源散发的热量传递到中框上进行均温散热。
部分电子设备将SOC布局在面向后盖一侧，此时如何在不增加电子设备厚度的情况下，有效解决电子设备SOC的散热，保证电子设备运行的稳定已成为本领域技术人员亟待解决的问题。
发明内容
本发明实施例提供了一种电子设备，可以在不增加电子设备厚度的前提下，提高电子设备的散热效率，解决电子设备局部温度过高的问题。
本发明的第一方面，本发明技术方案提供了一种电子设备，该电子设备包括：显示屏；中框，包括面向第一方向的第一面和面向第二方向的第二面，第一方向和第二方向相反，显示屏设置于中框的第一面；印刷电路板，设置在中框第二方向的第二面；电子元器件，布置在印刷电路板上，且电子元器件被安装在印刷电路板上的屏蔽罩所包围，屏蔽罩和电子元器件之间设置有热界面材料；后盖，设置在中框第二方向，后盖上包括有后盖第一凹槽；散热器件，包括第一表面和第二表面，第一端和第二端，散热器件的第一表面通过热界面材料与安装在印刷电路板上的第一屏蔽罩之间热耦合，散热器件第二表面嵌入后盖第一凹槽。这样，将散热器件嵌入到后盖中，不增加电子设备的厚度，同时将发电子元器件产生的热量传导至 后盖上，通过后盖均匀散热，避免电子元器件所在的区域温度过高。
在本发明的第一方面的一种可能实现方式中，散热器件包括热管、真空腔均热板等其他散热器件。这样根据实现需要，选择导热率较高的散热器件，将发电子元器件产生的热量传导至后盖上，通过后盖均匀散热，避免电子元器件所在的区域温度过高。
在本发明的第一方面的另一种可能实现方式中，散热器件第二表面可以通过粘粘胶与后盖第一凹槽进行固定，其中粘粘胶可以包含吸热储热的相变材料成分。这样，粘粘胶不仅起到固定散热器件和后盖第一凹槽的作用，还起到隔热作用，吸收和存储部分热量，避免电子设备后盖温度过高，从而影响用户手持感和体验度。
在本发明的第一方面的另一种可能实现方式中，散热器件与后盖之间设置有第一隔热区域，第一隔热区域相对应于第一屏蔽罩的位置而设置，其中第一隔热区域设置为真空结构或者第一隔热区域填充填充真空纤维隔热材料、气凝胶等其他热传阻隔材料。这样，隔热区域有效的将电子元器件产生的热量进行阻隔，避免电子元器件所在的位置局部温度过高，从而影响用户手持感和体验度。
在本发明的第一方面的另一种可能实现方式中，散热器件的第一表面设置有均热材料，均热材料包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料中的一种或者多种的任意组合。这样，均热材料将散热器件传导的热量在后盖以及电子设备其他低温区域进行有效的扩散，以避免后盖局部温度过高，从而影响用户手持感和体验度。
在本发明的第一方面的另一种可能实现方式中，均热材料设置于显示屏和中框之间；或者均热材料设置在中框第二方向的第二面，并与中框相贴合。这样，均热材料将中框传导的热量进行有效的扩散，避免中框局部温度过高。
在本发明的第一方面的另一种可能实现方式中，后盖一侧还设置后盖装饰层，后盖装饰层与后盖之间通过粘粘胶贴合；后盖装饰层与后盖之间设置有第二隔热区域，其中第二隔热区域相对应于第一屏蔽罩的位置而设置。这样有效避免电子设备后盖温度过高，从而影响用户手持感和体验度。
在本发明的第一方面的另一种可能实现方式中，电子设备的中框第二方向的第二面设置有中框第一凹槽，中框第一凹槽内设有导热片，其中导热片采用银片、铜片、铝片、钢片、金属合金等高导热材料中的一种或者任意多种的组合。导热片通过热界面材料与安装在印刷电路板上的第二屏蔽罩之间热耦合。这样更好的利用中框进行散热，通过导热片将电子元器件产生的热量迅速传导至中框上，而且不会增加电子设备的厚度。
本发明的第二方面，本发明技术方案提供了一种电子设备，电子设备包括：显示屏；中框，包括面向第一方向的第一面和面向与第一方向相反的第二方向的第二面，显示屏设置于中框的第一方向的第一面；印刷电路板，设置在中框第二方向的第二面；电子元器件，布置在印刷电路板上，且电子元器件被安装在印刷电路板上的屏蔽罩所包围，屏蔽罩和电子元器件之间设置有热界面材料；后盖，设置在中框的第二方向，后盖上包括有后盖第一凹槽；第一盖板，第一盖板嵌入后盖第一凹槽，第一盖板和后盖之间设置有第一真空腔室，其中第一真空腔室内设有毛细结构、工作液以及支撑柱，第一盖板、后盖以及第一真空腔室构成真空腔均热板散热结构，第一盖板通过热界面材料与安装在印刷电路板上的第一屏蔽罩之间热耦合。这样利用第一盖板和后盖之间形成的VC散热结构对电子设备进行散热，在不增加电子设备厚度的前提下，提高电子设备的散热效率。
在本发明的第二方面的一种可能实现方式中，第一盖板包含第一端和第二端，其中第一盖板的第一端和/或第二端包含有凸起结构，第一盖板的第一端和/或第二端的凸起结构用于和后盖第一凹槽耦合。这样，第一盖板凸起结构更好的与后盖进行焊接或者粘合，提高了第一盖板和后盖之间形成的VC散热结构强度和稳定性。
在本发明的第二方面的另一种可能实现方式中，毛细结构包括烧结金属粉末、沟槽或者金属网等其他结构形态，毛细结构附着于后盖的表面或第一盖板的表面，或者附着于后盖侧壁；工作液包括纯水、无机化合物、醇类、酮类、液态金属、冷煤或有机化合物中的一种或者多种的组合；支撑柱附着于后盖和/或第一盖板的表面。这样为毛细结构和支撑柱选择更为稳定的结构，保证第一盖板和后盖之间形成的VC散热结构的强度和稳定性。
在本发明的第二方面的另一种可能实现方式中，后盖一侧还设置后盖装饰层，后盖装饰层与后盖之间通过粘粘胶贴合，其中粘粘胶包含吸热储热的相变材料成分；后盖装饰层与后盖之间设置有第一隔热区域，第一隔热区域相对应于第一屏蔽罩的位置而设置，其中第一隔热区域设置为真空结构，或者第一隔热区域填充真空纤维隔热材料、气凝胶等其他热传阻隔材料。这样避免后盖局部温度过高，从而影响用户手持感和体验度。
在本发明的第二方面的另一种可能实现方式中，第一盖板的第一表面设置有均热材料，均热材料包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料中的一种或者多种的任意组合。均热材料设置于显示屏和中框之间；或者均热材料设置在中框的第二方向的第二面，并与中框相贴合。这样，均热材料将中框和VC散热结构传导的热量进行有效的扩散，避免中框和后盖局部温度过高。
在本发明的第二方面的另一种可能实现方式中，中框第二方向的第二面设置有中框第一凹槽，中框第一凹槽内设有导热片，其中导热片采用银片、铜片、铝片、钢片、金属合金等高导热材料中的一种或者任意多种的组合，导热片通过热界面材料与安装在印刷电路板上的第二屏蔽罩之间热耦合。这样更好的利用中框进行散热，通过导热片将电子元器件产生的热量迅速传导至中框上，而且不会增加电子设备的厚度。
附图说明
为了更清楚的说明本发明实例中的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。
图1A为本发明实施例提供的一种电子设备的整体结构示意爆炸图；
图1B为本发明实施例提供的一种电子设备五个侧面的示意图；
图2为本发明实施例提供的一种VC嵌入电子设备后盖的散热结构示意截面图；
图3为本发明实施例提供的另一种VC嵌入电子设备后盖的散热结构示意截面图；
图4为本发明实施例提供的一种电子设备的VC形状示意图；
图5为本发明实施例提供的另一种电子设备的VC形状示意图；
图6为本发明实施例提供的另一种VC嵌入电子设备后盖的散热结构示意截面图；
图7为本发明实施例提供的另一种VC嵌入电子设备后盖的散热结构示意截面图；
图8为本发明实施例提供的一种第一盖板和电子设备后盖组合成VC散热结构示意截面图；
图9为本发明实施例提供的另一种第一盖板和电子设备后盖组合成VC散热结构示意截面图；
图10为本发明实施例提供的另一种第一盖板和电子设备后盖组合成VC散热结构示意截 面图；
图11为本发明实施例提供的另一种第一盖板和电子设备后盖组合成VC散热结构示意截面图。
具体实施方式
在下文中，将参考说明书附图用以描述本发明实施例中所提供的技术方案。其中，需要说明的是，本发明各种实施例中不限于特定的实施例，对本说明书部分描述的各种实施例进行修改、等同或/和替代。且关于说明书附图的描述，相似的组件可以用相似的附图标记来表示。
其中，需要说明的是，在本发明实施例的描述中，除非另有说明，“/”表示或的意思，例如A/B可以表示A或B；文本中的“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况，另外，在本发明实施例的描述中，“多个”是指两个或多于两个。
为了方便理解本申请实施例提供的一种电子设备散热结构，下面首先说明一下本申请实施例提供的电子设备的应用场景，在本发明实施方式中，电子设备是指具有数据计算处理功能和无线通讯功能的电子设备。电子设备包括但不限于：智能手机(如Android手机、iOS(iPhone Operating System)等搭载其他操作系统的手机)、平板电脑、掌上电脑、便携式多媒体播放器、电子相框、电子游戏机、笔记本电脑、移动互联网设备(Mobile Internet Devices)、穿戴式设备(如智能手表、智能手环、智能眼镜、头戴式设备(HMD)等)、智能家居设备、物联网设备、智能车等。以上罗列了一些电子设备的具体类型，但是本领域技术人员可以意识到，本发明实施方式并不局限于上述罗列的类型，而还可以适用于其他任意的电子设备类型和操作系统类型之中。
本发明实施例所提供的散热结构可设置于各种电子设备中，并可将电子设备中的芯片等发热元件产生的热量在电子设备内均匀传播散开。下面结合附图对该散热结构在电子设备中的具体设置方式进行详细的说明，以便于本领域技术人员对该散热结构对电子设备中的发热元件进行均匀散热过程进行理解。
本发明实施例一提供了一种电子设备散热结构。
图1A为本发明实施例提供的一种电子设备的整体结构示意爆炸图，参照图1A所示，在本申请的实施例中，电子设备包括：显示屏1、中框2、电池3，PCB4(Printed Circuit Board，印刷电路板)、发热元件5、TIM6(Thermal Interface Materials，热界面材料)、屏蔽罩7、TIM8、均热材料9、散热器件10、粘接胶11、隔热区域12、后盖13。为了从外形上更好的了解电子设备显示屏1、中框2以及后盖13的连接关系，可以参考图1B，图1B为本发明实施例提供的一种电子设备五个侧面的示意图。
为了更好的示意本发明实施例中电子设备散热结构中各个元器件的连接和位置关系，可以一并参考图2。其中，图2为本发明实施例提供的一种VC嵌入电子设备后盖的散热结构示意截面图，图2是沿图1B的参考线L1所在方向截取的截面图。参照图2所示，其中，中框2可以用来承载PCB4、显示屏1以及电池3，显示屏1和PCB4可以分别设置于中框2的两侧，发热元件5设置于PCB4上，屏蔽罩7相对应于发热元件5设置于PCB4上，屏蔽罩7和发热元件5之间设有TIM6，后盖13位于PCB4所在的一侧，后盖13中设置有后盖第一凹槽14，散热器件10以嵌入后盖第一凹槽14的方式设置于后盖13中，散热器件10上可以设置均热材料9，散热器件10可以通过均热材料9和TIM8贴合实现散热器件10与屏蔽罩7间接连接。
除了上述结构外，电子设备还可以设置有电池3，参照图1A和图2，该电池3可设置于 中框2与后盖13之间，中框2可以用于支撑电池3。由于电池也是发热元件，这样，可以使散热器件10同时与屏蔽罩7以及电池3相对，从而实现散热器件10对屏蔽罩7以及电池3的散热。
其中，如图2所示，发热元件产生的热量可以沿着图2中带箭头的虚线所示意的方向进行传导，其传导路径可以为：一方面设置于屏蔽罩7内的发热元件5产生的热量通过屏蔽罩7传导至散热器件10，其中散热器件10与发热元件5(或者屏蔽罩7)正对的部分的热量较为集中，散热器件10通过两相气液变化吸收部分热量，其余部分热量会向散热器件10远离发热元件5的端部进行传导，从而使得热量在后盖13中有效的扩散开来；另一方面，PCB4和电池3产生的热量可以传导至中框2上，利用中框2将热量扩散出去。
其中，均热材料9可以包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料中的任意一种或者任意二者的组合，均热材料9可以将散热器件10传导的热量均匀的散布于后盖13以及其他低温处，避免某一局部点过热。在本发明实施例中，还可以将均热材料9正对应于屏蔽罩7所在的位置设置一通孔，使得屏蔽罩7能够通过TIM8直接和散热器件10直接贴合接触。
图3为本发明实施例提供的另一种VC嵌入电子设备后盖的散热结构示意截面图，如图3所示，作为本发明实施例可选项，均热材料15可以设置于中框2与电池3之间，从而有效的将电池3产生的热量分布在中框上；或者均热材料15可以设置于显示屏1和中框2之间，或者可以在中框2两侧都设有均热材料15，以实现均匀散热的作用，避免电子设备局部温度过高。需要说明的是，在本发明中，均热材料9和均热材料15一样，可以包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料等中任意一种或者任意二者的组合。
其中，散热器件10可以包括VC(Vapor Chamber,真空腔均热板)、热管等两相散热器件。散热器件10可以将发热元件5产生的热量传递至电子设备的低温区域，有效的实现均匀散热作用。在本发明的一种实施例中，散热器件10可以为VC。图4和图5为本发明实施例提供的一种电子设备的VC形状示意图。如图4所示，散热器件10可以包括A端和B端，发热元件5(未示出)将热量传导至屏蔽罩7上，并通过屏蔽罩7传导至散热器件10的一端A，散热器件10可以将热量传导至远离屏蔽罩7所在的一端B，实现电子设备均匀散热；或者如图5所示，散热器件10可以包括A端、B端以及C端，发热元件5(未示出)将热量传导至屏蔽罩7上，并通过屏蔽罩7传导至散热器件10的一端A，散热器件10可以将热量传导至远离屏蔽罩7所在的一端B和另一端C，实现电子设备均匀散热。图4和图5的对比以示意本发明实施例中散热器件10可以设置成不同的形状，即本发明实例中散热器件10还可以设置为其他形状，本发明实施例并不构成对其形状的限制。
继续参照图2或者图3，其中粘接胶11设置于散热器件10和后盖13之间，以起到粘附散热器件10和后盖13的作用。在本发明的实施例中，粘接胶11可以包含有吸热储热相变材料成分，当散热器件10将发热元件5散发的热量传导至后盖13时，粘接胶11可以吸收后盖13的热量，以降低后盖13的温度，避免用户手持电子设备时温度过高，从而影响用户体验度。
继续参照图2或者图3，其中隔热区域12相对应于发热元件5的位置设置于后盖13和散热器件10之间。在本发明实施例中，隔热区域12可以设置为真空层，产生的效果为隔热区域12所对应的发热元件5所产生的热量不会迅速通过散热器件10传导至发热元件5所对应的后盖13上的位置，隔热区域12有效阻隔了热量的传导，避免了发热元件5所产生的热 量在后盖13局部聚集，避免用户手持电子设备时局部温度过高，从而影响用户体验度。需要说明的是，在本发明实施例中，隔热区域12还可以填充真空纤维隔热材料、气凝胶等其他热传阻隔材料，以起到阻碍散热器件10将发热元件5所产生的热量集中传导至后盖13某一位置，避免后盖局部温度过高。
继续参照图2或者图3，其中热界面材料TIM6填充于发热元件5和屏蔽罩7之间，热界面材料TIM8设置于散热器件10和屏蔽罩7之间。由于发热元件5和屏蔽罩7(或者散热器件10和屏蔽罩7)之间存在空气间隙，由于空气导热系列非常小，发热元件5和屏蔽罩7(或者散热器件10和屏蔽罩7)二者之间会产生较大的接触热阻，使用具有高导热性的热界面材料填充满这些间隙，排除其中的空气，在发热元件5和散热器件10之间建立有效的热传导通道，可以大幅度低接触热阻，使散热器件10的作用得到充分地发挥。在本实施例中的TIM6和/或TIM8可以包括：硅脂、硅胶、散热垫片、相变材料、相变金属片、导热凝胶中的一种或者多种的组合。
继续参照图2或者图3，其中发热元件5包括但不限于CPU(Central Processing Unit，中央处理器)、AI(Artificial Intelligence，人工智能)处理器、SOC(System on Chip，片上系统)、电源管理单元，或其它需要散热的电子元器件或者电子组件。
图6为本发明实施例提供的一种VC嵌入电子设备后盖的散热结构示意截面图。参照图6所示，所述电子设备包括：显示屏1、中框2、电池3、PCB4、发热元件5、TIM6、屏蔽罩7、TIM8、均热材料9、散热器件10、粘接胶11、隔热区域12、后盖13、粘接胶16、隔热区域17以及后盖装饰层18。其中需要说明的是，图6所示的电子设备的结构大部分内容与本发明前述实施例一中的相似。其中区分点在于，本发明实施例中，在电子设备后盖13后设置有后盖装饰层18，且所述后盖13与后盖装饰层18之间通过粘接胶16进行粘结，其中粘接胶16和粘粘胶11所用材料可以一致，以起到粘附后盖装饰层18和后盖13的作用。在本发明的实施例中，粘接胶16可以包含有吸热储热相变材料成分，粘接胶16可以吸收后盖13传导至后盖装饰层18的热量。在后盖13和后盖装饰层18之间亦可以设有隔热区域17，且所述隔热区域17用以阻隔由后盖13传导至后盖装饰层18的热量，避免用户手持电子设备时温度过高，从而影响用户体验度。隔热区域17可以设为真空层、填充真空纤维隔热材料、气凝胶等其他热传阻隔材料，以起到阻碍散热器件10将发热元件5所产生的热量集中传导至后盖13以及后盖装饰层13某一位置，避免后盖局部温度过高。其中，需要说明的是，在本发明实施例中，后盖13和后盖装饰层13属于电子设备中不同的两个结构，后盖13一般作为电子设备的结构保护和支撑强化的部件，而后盖装饰层13起到的是装饰、美观、防刮等其他工艺层面上的作用。
本发明实施例二提供了另一种电子设备散热结构。
图7为本发明实施例提供的另一种VC嵌入电子设备后盖的散热结构示意截面图，参照图7所示，所述电子设备包括：显示屏1、中框2、电池3、PCB4、发热元件5、TIM6、屏蔽罩7、TIM8、发热元件9、TIM10、屏蔽罩11、TIM12、中框第一凹槽13、导热片14、均热材料15、散热器件16、粘接胶17、隔热区域18、后盖19、粘接胶20、隔热区域21、后盖装饰层22、后盖第一凹槽23以及均热材料24。
其中，中框2可以用来承载PCB4、显示屏1以及电池3，所述显示屏1和PCB4可以分别设置于中框2的两侧，后盖19位于PCB4所在的一侧，发热元件5和发热元件9分别设置于PCB4不同面上，屏蔽罩7相对应于发热元件5设置于PCB4的一侧，而屏蔽罩11相对应 于发热元件9设置于PCB4的另一侧，屏蔽罩7和发热元件5之间设有TIM6，屏蔽罩11和发热元件9之间设有TIM10，后盖19中设置有后盖第一凹槽23，散热器件16以嵌入后盖第一凹槽23的方式设置于后盖19中，散热器件16上可以设置均热材料15，并通过均热材料15和TIM8贴合实现散热器件16与屏蔽罩7间接连接，或者在本发明实施例中，还可以将均热材料15正对应于屏蔽罩7所在的位置设置一通孔，使得屏蔽罩7能够通过TIM8直接和散热器件16直接贴合接触。
为了不增加电子设备的厚度的前提下，更好的利用中框2进行有效的均匀散热，本发明实施例对电子设备的中框2的结构进行了改善。参照图7所示的结构，可以在中框2上背离显示屏1的一侧，相对应于屏蔽罩11所在位置设置中框第一凹槽13，中框第一凹槽13中设置有导热片14，所述导热片14可以通过TIM12与屏蔽罩11接触，中框2和显示屏1之间可以设有均热材料24。上述散热结构的设计可以有效的将发热元件9所产生的热量通过屏蔽罩11传导至导热片14上，导热片14可以迅速将热量传导至中框2上，再通过中框2将所述发热元件9所产生的热量有效的均匀散布。结合前述实施例所述，这样可以有效的利用电子设备的后盖19和中框2同时进行散热，在不增加电子设备厚度的前提下，极大的提高散热性能。其中，导热片14可以采用银片、铜片、铝片、钢片、金属合金等高导热材料中的任意一种或者多种的组合，本发明实施例并不对其进行限制。其中本发明实施中的TIM6、TIM8、TIM10以及TIM12的材料可以包括：硅脂、硅胶、散热垫片、相变材料、相变金属片、导热凝胶中的一种或者多种的组合，所述TIM6、TIM8、TIM10以及TIM12的作用都是为了降低元器件之间的热阻，增强导热效果。
除了上述结构外，电子设备还可以设置有电池3，参照图1A和图7，该电池3可设置于中框2与后盖13之间，中框2可以用于支撑电池3。由于电池也是发热元件，这样，可以使散热器件16同时与屏蔽罩7以及电池3相对，从而实现散热器件16对屏蔽罩7以及电池3的散热。
这样，如图7所示，发热元件5和发热元件9产生的热量可以沿着图7中带箭头的虚线所示意的方向进行传导，其传导路径可以为：一方面发热元件5产生的热量通过屏蔽罩7传导至散热器件16，其中散热器件16与发热元件5正对的部分的热量较为集中，散热器件16通过两相气液变化吸收部分热量，其余部分热量会向散热器件16远离发热元件5的端部进行传导，从而使得热量在后盖19中有效的扩散开来；另一方面，PCB4上另一侧的发热元件9上设置有屏蔽罩11，屏蔽罩11将发热元件9产生的热量传导至导热片14，再由导热片14将热量传导至中框2，再通过中框2良好的导热性均匀的将热量扩散出去。
其中，后盖19和散热器件16之间设置有粘接胶17和隔热区域18，在后盖19的一侧设置有后盖装饰层22，其中后盖19和后盖装饰层22之间通过粘接胶20进行粘结，而且在后盖19和后盖装饰层22之间可以设有隔热区域21，且所述隔热区域21相对应发热元件5的位置而设置。所述粘接胶20、粘接胶17以及隔热区域18和隔热区域21分别与实施例一中的粘接胶和隔热区域相对应，组成材料和作用效果一致，因此此处不再赘述。
本发明实施例三提供了另一种电子设备散热结构。
图8为本发明实施例提供的一种第一盖板和电子设备后盖组合成VC散热结构示意截面图，参照图8所示，所述电子设备包括：显示屏1、中框2、电池3、PCB4、发热元件5、TIM6、屏蔽罩7、TIM8、均热材料9、第一盖板10、第一真空腔室11、后盖第一凹槽12、后盖13、 粘接胶14、隔热区域15、后盖装饰层16。
继续参考图8，其中中框2可以用来承载PCB4、显示屏1以及电池3，所述显示屏1和PCB4可以分别设置于中框2的两侧，发热元件5设置于PCB4上，屏蔽罩7相对应于发热元件5设置于PCB上，屏蔽罩7和发热元件5之间设有TIM6，后盖13位于PCB4所在的一侧，在所述后盖13上设有后盖第一凹槽12，第一盖板10置于后盖第一凹槽12中，第一盖板10和后盖13可以采用焊接的方式进行连接，第一盖板10和后盖13之间形成第一真空腔室11，第一真空腔室11内可以设有毛细结构、工作液以及支撑柱(未示出)，后盖13可以作为第二盖板，所述第一盖板10、第一真空腔室11(包含毛细结构、工作液以及支撑柱)以及后盖13(作为第二盖板)可以组成一个VC散热结构17，第一盖板7上可以设置均热材料9，通过均热材料9和TIM8贴合实现第一盖板10与屏蔽罩7的间接连接。这样电子设备散热结构的设计，可以将发热元件5产生的热量通过屏蔽罩7传递至后盖13，进而均匀的扩散至电子设备的低温处，有效的避免电子设备局部温度过热，同时也能有效的降低设备的厚度，实现在不增加设备厚度的前提下，有效的将热量散发出去。
除了上述结构外，电子设备还可以设置有电池3，参照图1A和图8，该电池3可设置于中框2与后盖13之间，中框2可以用于支撑电池3。由于电池也是发热元件，这样，可以使VC散热结构17同时与屏蔽罩7以及电池3相对，从而实现VC散热结构17对屏蔽罩7以及电池3的散热。
这样本发明实施例中发热元件5产生的热量传导路径可以包括：一方面设置于屏蔽罩7内的发热元件5产生的热量通过屏蔽罩7传导至第一盖板10，其中第一盖板10与发热元件5正对的部分的热量较为集中，第一盖板10、第一真空腔室11以及后盖13组成的VC散热结构17通过两相气液变化吸收部分热量，其余部分热量会向VC散热结构17远离发热元件5的端部进行传导，从而使得热量在电子设备的后盖13中有效的扩散开来；另一方面，PCB4和电池3产生的热量可以传导至中框2上，利用中框2将热量扩散出去。
继续参考图8，其中为了避免用户手持电子设备时感到局部温度过高，可以在后盖13的一侧设置有后盖装饰层16，其中后盖13和后盖装饰层16之间通过粘接胶14进行粘结，而且在后盖13和后盖装饰层16之间设有隔热区域15，且所述隔热区域15相对应发热元件5的位置而设置。粘接胶14可以包含有吸热储热相变材料成分，其可以吸收传导至后盖13以及后盖装饰层16的热量，避免用户手持电子设备时温度过高，从而影响用户体验度。隔热区域15可以设为真空层、填充真空纤维隔热材料、气凝胶等其他热传阻隔材料，以起到阻碍VC散热结构17将发热元件5所产生的热量集中传导至后盖13以及后盖装饰层16上正对发热元件5位置，避免后盖局部温度过高。
其中，均热材料9可以贴附于第一盖板10和后盖13而设置，并通过TIM8与屏蔽罩7相接触，或者可以在均热材料9上正对屏蔽罩7位置设一通孔，使得所述屏蔽罩7可以通过TIM8与第一盖板10所接合。其中，均热材料9可以包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料等，均热材料9可以将VC散热结构17所传导的热量均匀的散布于电子设备的后盖13以及其他低温处，避免某一局部点过热。作为本发明实施例可选项，均热材料9可以设置于中框2与电池3之间，有效的将电池3产生的热量分布在中框上；或者均热材料9可以设置于显示屏1和中框2之间，以实现均匀散热的作用；或者可以在中框2两侧都设有均热材料9，以实现均匀散热的作用，避免电子设备局部温度过高。
其中，本发明实施例中的VC散热结构17分别为第一盖板10、第一真空腔室11以及后盖13所构成，其中，第一盖板10和后盖13的材质可以相同也可不同。例如，第一盖板10 和后盖13的材质可以但不限于为铜、铜合金、钛或者钛合金等金属；或由非金属组成，例如有机高分子材料或者玻璃材料等；又或者是由不同金属复合、或金属与非金属复合等材料。在具体设置第一盖板10时，第一盖板10可相对后盖13靠近发热元件5的位置而设置。参考图8所示截面图，第一盖板10两端的形状可以设置为凸起状以便于第一盖板10和后盖13的后盖第一凹槽12的底部进行嵌合，所述第一盖板10的形状设计有利于提高第一盖板10和后盖13焊接的稳定性。本发明实施例中，第一盖板10可以设置成不同的形状，图9和图10分别为本发明实施例提供的另一种第一盖板和电子设备后盖组合成VC散热结构示意截面图，参考图9所示示意图，与图8所示的结构不同的是，其中第一盖板10在靠近发热元件5一端的形状可以设置为凸起状以便于第一盖板10和后盖第一凹槽12的底部进行嵌合，而第一盖板10在远离发热元件5一端的形状可以设置为平板状而以便于和后盖第一凹槽12的侧壁进行嵌合，所述第一盖板10的形状设计有利于提高第一盖板10和后盖13焊接的稳定性，并有效的降低电子设备的重量；或者参考图10所示的截面图，与图8和图9都不同的，所示电子设备散热结构，其中第一盖板10在远离发热元件5一端的形状可以设置为凸起状以便于第一盖板10和后盖第一凹槽12底部进行嵌合，而第一盖板10在靠近发热元件5一端的形状可以设置为平板状而以便于和后盖第一凹槽12的侧壁进行嵌合，所述第一盖板10的形状设计有利于提高第一盖板10和后盖13焊接的稳定性，并有效的降低电子设备的重量。其中，需要说明的是，本领域技术人员可以意识到，根据电子设备结构设计的需要，可以将第一盖板10设置成不同的形状与后盖13进行嵌合组成VC散热结构，本发明实施例所列举的第一盖板10的形状并不构成对第一盖板10形状的限制。
其中，本发明实施例中第一盖板10和后盖13嵌合形成的第一真空腔室11中可以设置毛细结构，所述毛细结构于该较佳实施例以烧结粉末体作为说明，但并不局限于此。在具体的实施例中，所述毛细结构亦可以选择为沟槽或者金属网或者其他结构形态。其中，本发明实施例中所述毛细结构可以附着于后盖第一凹槽12的底部；或者所述毛细结构可以附着于后盖第一凹槽12的两端的侧壁上；或者所述毛细结构可以附着于第一盖板10上。其中，在本发明实施例中，第一真空腔室11中可以设置有支撑柱，该支撑柱可以设于该第一真空腔室11内，支撑柱可以固定于后盖第一凹槽12的底部；或者支撑柱可以固定于第一盖板10上。且所述支撑柱其上、下端分别与该第一真空腔室11内的上、下内壁相抵接，该支撑柱用以支撑该第一盖板10和后盖13所形成的VC散热结构。其中，在本发明实施例中，第一真空腔室11中可以设置有工作液，所述工作液可为纯水、无机化合物、醇类、酮类、液态金属、冷煤或有机化合物中的一种或者多种的组合。可以理解的是，本发明实施例并不对工作液的材质进行限定。
本发明实施例四提供了另一种电子设备散热结构。
图11为本发明实施例提供的另一种第一盖板和电子设备后盖组合成VC散热结构示意截面图，参照图11所示，所述电子设备包括：显示屏1、中框2、电池3、PCB4、发热元件5、TIM6、屏蔽罩7、TIM8、发热元件9、TIM10、屏蔽罩11、TIM12、中框第一凹槽13、导热片14、均热材料15、第一盖板16、第一真空腔室17、后盖第一凹槽18、后盖19、粘接胶20、隔热区域21、后盖装饰层22以及均热材料24。
其中，中框2可以用来承载PCB4、显示屏1以及电池3，所述显示屏1和PCB4可以分别设置于中框2的两侧，发热元件5和发热元件9设置于PCB4上，屏蔽罩7相对应于发热元件5设置于PCB4的一侧上，屏蔽罩11相对应于发热元件9设置于PCB4的另一侧上，屏 蔽罩7和发热元件5之间设有TIM6，屏蔽罩11和发热元件9之间设有TIM10，后盖19中设置有后盖第一凹槽18，第一盖板16置于后盖第一凹槽18中，第一盖板16和后盖19可以采用焊接的方式进行连接，第一盖板16和后盖19之间形成第一真空腔室17，第一真空腔室17内可以设有毛细结构、工作液以及支撑柱(未示出)，后盖19可以作为第二盖板，所述第一盖板16、第一真空腔室17(包含毛细结构、工作液以及支撑柱)以及后盖19(作为第二盖板)可以组成一个VC散热结构23。其中，第一盖板16上可以设置均热材料15，均热材料15和TIM8贴合实现第一盖板16与屏蔽罩7的间接连接，或者在本发明实施例中，还可以将均热材料15正对应于屏蔽罩7所在的位置设置一通孔，使得屏蔽罩7能够通过TIM8直接和第一盖板16直接贴合接触。这样电子设备散热结构的设计，可以将发热元件产生的热量通过屏蔽罩7传递至后盖19，进而均匀的扩散至电子设备的低温处，有效的避免电子设备局部温度过热，同时也能有效的降低设备的厚度，实现在不增加设备厚度的前提下，有效的将热量散发出去。
除了上述结构外，电子设备还可以设置有电池3，参照图1A和图11，该电池3可设置于中框2与后盖19之间，中框2可以用于支撑电池3。由于电池也是发热元件，这样，可以使VC散热结构23同时与屏蔽罩7以及电池3相对，从而实现VC散热结构23对屏蔽罩7以及电池3的散热。
为了不增加电子设备的厚度的前提下，更好的利用中框2进行有效的均匀散热，本发明实施例对电子设备的中框2的结构进行了改善。参照图11所示的结构，可以在中框2中背离显示屏1的一侧，相对应于屏蔽罩11所在位置设置中框第一凹槽13，中框第一凹槽13中焊接有导热片14，所述导热片14可以通过TIM12与屏蔽罩11接触，中框2和显示屏1之间可以设有均热材料24。上述散热结构的设计可以有效的将发热元件9所产生的热量通过屏蔽罩11传导至导热片14上，导热片14可以迅速将热量传导至中框2上，再通过中框2将所述发热元件9所产生的热量有效的散布于电子设备的各个位置。结合前述实施例所述，这样可以有效的利用电子设备的后盖19和中框2同时进行散热，在不增加电子设备厚度的前提下，极大的提高散热性能。其中，导热片15可以采用银片、铜片、铝片、钢片、金属合金等高导热材料中的一种或者多种的组合，本发明实施例并不对其进行限制。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种电子设备，其特征在于，所述电子设备包括：
    显示屏；
    中框，包括面向第一方向的第一面和面向第二方向的第二面，所述第一方向和所述第二方向相反，所述显示屏设置于所述中框的所述第一面；
    印刷电路板，设置在所述中框第二方向的第二面；
    电子元器件，布置在所述印刷电路板上，且所述电子元器件被安装在所述印刷电路板上的屏蔽罩所包围，所述屏蔽罩和所述电子元器件之间设置有热界面材料；
    后盖，设置在所述中框第二方向，所述后盖上包括有后盖第一凹槽；
    散热器件，包括第一表面和第二表面，第一端和第二端，所述散热器件的第一表面通过热界面材料与安装在所述印刷电路板上的第一屏蔽罩之间热耦合，所述散热器件第二表面嵌入所述后盖第一凹槽。
  2. 根据权利要求1所述的电子设备，其特征在于，所述散热器件包括热管或真空腔均热板。
  3. 根据权利要求1-2任一项所述的电子设备，其特征在于，所述散热器件第二表面可以通过粘粘胶与所述后盖第一凹槽进行固定，其中所述粘粘胶可以包含吸热储热的相变材料成分。
  4. 根据权利要求1-3任一项所述的电子设备，其特征在于，所述散热器件与所述后盖之间设置有第一隔热区域，所述第一隔热区域相对应于所述第一屏蔽罩的位置而设置，其中所述第一隔热区域设置为真空结构或者所述第一隔热区域填充填充真空纤维隔热材料、气凝胶等其他热传阻隔材料。
  5. 根据权利要求1-4任一项所述的电子设备，其特征在于，所述散热器件的第一表面设置有均热材料，所述均热材料包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料中的一种或者多种的任意组合。
  6. 如权利要求1-5任一项所述的电子设备，其特征在于，所述均热材料设置于所述显示屏和所述中框之间；或者所述均热材料设置在所述中框第二方向的第二面，并与所述中框相贴合。
  7. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述后盖一侧还设置后盖装饰层，所述后盖装饰层与所述后盖之间通过粘粘胶贴合；所述后盖装饰层与所述后盖之间设置有第二隔热区域，其中所述第二隔热区域相对应于所述第一屏蔽罩的位置而设置。
  8. 根据权利要求1-7任一项所述的电子设备，其特征在于，所述电子设备的所述中框第二方向的第二面设置有中框第一凹槽，所述中框第一凹槽内设有导热片，其中所述导热片采用银片、铜片、铝片、钢片、金属合金等高导热材料中的一种或者任意多种的组合。
  9. 根据权利要求1-8任一项所述的电子设备，其特征在于，所述导热片通过热界面材料与安装在所述印刷电路板上的第二屏蔽罩之间热耦合。
  10. 一种电子设备，其特征在于，所述电子设备包括：
    显示屏；
    中框，包括面向第一方向的第一面和面向与所述第一方向相反的第二方向的第二面，所述显示屏设置于所述中框的第一方向的第一面；
    印刷电路板，设置在所述中框第二方向的第二面；
    电子元器件，布置在所述印刷电路板上，且所述电子元器件被安装在所述印刷电路板上的屏蔽罩所包围，所述屏蔽罩和所述电子元器件之间设置有热界面材料；
    后盖，设置在所述中框的第二方向，所述后盖上包括有后盖第一凹槽；
    第一盖板，所述第一盖板嵌入所述后盖第一凹槽，所述第一盖板和所述后盖之间设置有第一真空腔室，其中所述第一真空腔室内设有毛细结构、工作液以及支撑柱，所述第一盖板、所述后盖以及所述第一真空腔室构成真空腔均热板散热结构，所述第一盖板通过热界面材料与安装在所述印刷电路板上的第一屏蔽罩之间热耦合。
  11. 根据权利要求10所述的一种电子设备，其特征在于，所述第一盖板包含第一端和第二端，其中所述第一盖板的第一端和/或第二端包含有凸起结构，所述第一盖板的第一端和/或第二端的凸起结构用于和所述后盖第一凹槽耦合。
  12. 根据权利要求10-11任一项所述的电子设备，其特征在于，所述毛细结构包括烧结金属粉末、沟槽或者金属网等其他结构形态，所述毛细结构附着于所述后盖的表面或第一盖板的表面，或者附着于所述后盖侧壁；
    所述工作液包括纯水、无机化合物、醇类、酮类、液态金属、冷煤或有机化合物中的一种或者多种的组合；
    所述支撑柱附着于后盖和/或第一盖板的表面。
  13. 如权利要求10-12任一项所述的电子设备，其特征在于，所述后盖一侧还设置后盖装饰层，所述后盖装饰层与所述后盖之间通过粘粘胶贴合，其中所述粘粘胶包含吸热储热的相变材料成分；
    所述后盖装饰层与后盖之间设置有第一隔热区域，所述第一隔热区域相对应于所述第一屏蔽罩的位置而设置，其中所述第一隔热区域设置为真空结构，或者所述第一隔热区域填充真空纤维隔热材料、气凝胶等其他热传阻隔材料。
  14. 如权利要求10-13任一项所述的电子设备，其特征在于，所述第一盖板的第一表面设置有均热材料，所述均热材料包括石墨片、石墨烯薄膜、导热涂层材料、陶瓷材料、导热凝胶、相变材料中的一种或者多种的任意组合。
  15. 如权利要求10-14任一项所述的电子设备，其特征在于，所述均热材料设置于所述显示屏和所述中框之间；或者所述均热材料设置在所述中框的第二方向的第二面，并与所述中框相贴合。
  16. 如权利要求10-15任一项所述的电子设备，其特征在于，所述中框第二方向的第二面设置有中框第一凹槽，所述中框第一凹槽内设有导热片，其中所述导热片采用银片、铜片、铝片、钢片、金属合金等高导热材料中的一种或者任意多种的组合。
  17. 如权利要求10-16任一项所述的电子设备，其特征在于，所述导热片通过热界面材料与安装在所述印刷电路板上的第二屏蔽罩之间热耦合。
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