WO2020238865A1 - 一种导热件及电子设备 - Google Patents
一种导热件及电子设备 Download PDFInfo
- Publication number
- WO2020238865A1 WO2020238865A1 PCT/CN2020/092170 CN2020092170W WO2020238865A1 WO 2020238865 A1 WO2020238865 A1 WO 2020238865A1 CN 2020092170 W CN2020092170 W CN 2020092170W WO 2020238865 A1 WO2020238865 A1 WO 2020238865A1
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- WIPO (PCT)
- Prior art keywords
- plate body
- cavity
- heat
- inner layer
- conducting element
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Definitions
- This application relates to the technical field of electronic equipment, and in particular to a heat-conducting component and electronic equipment.
- Electronic devices such as processors and graphics cards
- electronic devices generate a lot of heat during operation.
- electronic devices are usually equipped with heat pipes, heat sinks, fans, etc. to dissipate the electronic devices.
- the soaking plate is a vacuum cavity with a fine structure on the inner wall, usually made of copper, and water is injected into the vacuum cavity as a cooling liquid.
- the cooling liquid in the cavity is low.
- the vaporization of the cooling liquid begins to occur in the vacuum environment after being heated. At this time, the heat energy is absorbed and the volume expands rapidly.
- the cooling medium in the gas phase quickly fills the entire cavity.
- the gas phase working fluid contacts a relatively cold area, it will produce The phenomenon of condensation, and releases the heat accumulated during evaporation, the condensed coolant will return to the heat source from the fine structure, so as to realize the heat conduction over and over again.
- the traditional heat spreading plate is made of copper, it has the disadvantage of relatively large weight, which is not conducive to realizing the lightweight design of the heat spreading plate and electronic equipment.
- the structure of the traditional heat pipe and the soaking plate are similar, and they are also made of copper, so they also have the disadvantage of relatively large weight, which is not conducive to realizing the lightweight design of the soaking plate and electronic equipment.
- the present application provides a heat-conducting component and electronic equipment with low weight and long service life.
- the present application provides a heat-conducting element
- the heat-conducting element includes a shell, a capillary structure and a coolant
- the shell includes an inner layer and an outer layer, the inner layer is surrounded by a cavity, and the outer layer is wrapped around the periphery of the inner layer
- the capillary structure is arranged in the cavity and abuts against the shell; the cooling liquid is located in the cavity; wherein the inner layer and the outer layer are made of different materials, and the material density of the outer layer is lower than that of the inner layer.
- the inner layer can be made of materials with higher density and more stable chemical properties to ensure its durability
- the outer layer can be made of materials with lower density to ensure the structural strength of the shell while reducing the shell
- the overall weight of the heat-conducting part, or the use of materials with better thermal conductivity, to improve the heat-conducting performance of the heat-conducting part; the combination of the inner layer and the outer layer can not only ensure the working stability of the heat-conducting part, but also ensure its structural strength to prevent external forces. At the same time, it can effectively reduce the weight of the shell, thereby facilitating the realization of lightweight design.
- the material of the inner layer may be copper or copper alloy; the material of the outer layer may be aluminum, titanium, aluminum alloy, titanium alloy, and the like.
- the thickness ratio of the inner layer to the outer layer can be 1:1, 1:2, 2:1, etc., that is, the thickness of the inner layer can be greater than, equal to, or less than the thickness of the outer layer; or the overall thickness in the inner layer can be The same can also be different; correspondingly, the overall thickness in the outer layer can be the same or different.
- the overall structure of the housing can be in various forms, for example, it can be plate-shaped, tubular or other shapes.
- the housing when the overall structure of the housing is plate-shaped, the housing may be formed by buckling two plate bodies; specifically, the housing may include a first plate body and a second plate body that are buckled with each other, and the inner layer They are located on the opposite board surfaces of the first board and the second board respectively, and the outer layers are respectively located on the opposite board surfaces of the first board and the second board.
- the first board and the second board are fastened to each other , The inner layer of the first plate body and the inner layer of the second plate body are combined with each other to form the cavity.
- the first plate body has a direction facing away from the second plate body.
- a recessed structure such as a recessed groove; and/or, the second plate has a recessed structure such as a groove recessed in a direction away from the first plate. The first plate body and the second plate body are buckled together to form the cavity.
- the heat-conducting element further includes at least one support column; the support column is arranged in the cavity to support the cavity and prevent the cavity from being stressed. Deformed and compressed.
- the supporting column can be an independent structural member, or it can be an integral structure with the first plate or the second plate in the housing; of course, in the specific implementation, the supporting column can be close to the middle of the cavity Setting; For example, when the cavity is cubic, the force performance of the edge part is higher than the force performance of the middle part. Therefore, when the support column is set close to the middle part of the cavity, the overall force performance of the cavity can be improved.
- a positioning groove may be provided on the first plate body and/or the second plate body; wherein the positioning groove
- the contour of ⁇ can be slightly larger than or equal to the outer peripheral contour of the support column, or the contour of the positioning groove can be slightly smaller than the outer peripheral contour of the support column, so that the positioning groove and the support column can be interference fit.
- the capillary structure may be directly formed on the inner wall of the cavity, or may be an independent structural member.
- the capillary structure when it is an independent structural member, it may specifically be a mesh structure; and the material may be copper, a copper alloy, or a structural member with a copper-plated surface.
- the present application also provides an electronic device, including a circuit board, an electrical component mounted on the circuit board, and any one of the above-mentioned heat-conducting elements, wherein the heat-conducting element is conductively connected to the electrical element.
- the heat-conducting element can be in contact with the electrical component, or a conductive connection with the electrical component can be achieved through auxiliary materials such as thermal conductive silicone grease, so that the heat generated by the electrical component can be effectively transferred to the heat-conducting element.
- Fig. 1 is a schematic structural diagram of a housing of a heat conducting element provided by an embodiment of the application;
- Fig. 2 is an exploded view of a housing of a heat conducting element provided by an embodiment of the application
- FIG. 3 is a schematic cross-sectional structure diagram of a housing of a heat conducting element provided by an embodiment of the application;
- FIG. 4 is a schematic cross-sectional structure diagram of a housing of another heat conducting element provided by an embodiment of the application.
- FIG. 5 is an exploded view from a first perspective of a first board provided by an embodiment of this application.
- FIG. 6 is an exploded view of a first board provided by an embodiment of the application from a second perspective
- FIG. 7 is an exploded view of another first board provided by an embodiment of the application.
- FIG. 8 is a schematic cross-sectional structure diagram of a housing of another heat conducting element according to an embodiment of the application.
- FIG. 9 is a schematic cross-sectional structure diagram of a housing of another heat conducting element according to an embodiment of the application.
- FIG. 10 is a schematic cross-sectional structure diagram of a support column provided by an embodiment of the application.
- FIG. 11 is a schematic cross-sectional structure diagram of another support column provided by an embodiment of the application.
- FIG. 12 is a schematic structural diagram of yet another support column provided by an embodiment of the application.
- FIG. 13 is a schematic structural diagram of a supporting column installed on a first plate body according to an embodiment of the application.
- FIG. 14 is a schematic structural diagram of a first board provided by an embodiment of the application.
- 15 is a schematic cross-sectional structure diagram of a first plate provided by an embodiment of the application.
- FIG. 16 is a schematic cross-sectional structure diagram of a heat conducting element provided by an embodiment of the application.
- FIG. 17 is a schematic structural diagram of another heat conducting element provided by an embodiment of the application.
- FIG. 18 is a schematic cross-sectional structure diagram of another heat conducting element provided by an embodiment of the application.
- FIG. 19 is a schematic cross-sectional structure diagram of another heat conducting element provided by an embodiment of the application.
- FIG. 20 is a schematic structural diagram of an electronic device provided by an embodiment of this application.
- the heat-conducting element provided in this application is used in electronic equipment to conduct and diffuse the heat generated by the heating elements in the electronic equipment.
- the electronic device may specifically be a mobile phone, a tablet computer, a notebook computer, etc.
- the main heating elements in the notebook computer generally include a processor (central processing unit, CPU), a display chip (video chipset, GPU), and so on. Since the processor or the display chip generates a lot of heat when it is running, in order to prevent the processor or the display chip from being affected by the high temperature, a heat pipe or a soaking plate will be installed as a heat conduction element in the notebook computer. The processor or display chip dissipates heat.
- the soaking plate has a plate-like structure as a whole, which mainly includes two cover plates that are closely attached to each other. A closed cavity is formed between the two cover plates. The cavity is provided with copper mesh, copper fiber, sintered copper powder, and copper. Any one or combination of felts is used as a capillary structure, and pure water is filled as a cooling liquid. In order to prevent the cover plate from being corroded by the coolant, the material of the two cover plates is usually oxygen-free copper.
- the working principle of the soaking plate mainly includes four main steps: conduction, evaporation, convection and condensation.
- the water close to the heat source (such as one of the cover plates) will quickly absorb heat and vaporize to form water vapor after being heated.
- the water vapor will diffuse in the cavity.
- the cold source (Such as the other cover)
- it will quickly condense into liquid and release heat.
- the condensed water relies on the capillary structure to flow back to the heat source, completing a heat conduction cycle.
- the two cover plates are made of oxygen-free copper, and the density of copper is relatively high, the weight of the entire heat spreader is relatively large. It is not conducive to the realization of the lightweight design of the electronic device; for portable electronic devices, this disadvantage becomes more obvious, therefore, the portability of the electronic device will be reduced, and the user experience will also be reduced.
- the working principle of the heat pipe is similar to the soaking plate.
- the heat pipe has a long tubular structure as a whole, and the heat pipe has a closed cavity.
- the cavity is also provided with a capillary structure close to the inner wall, and is filled with water, ethanol or a mixed solution of the two as the cooling liquid.
- its material is usually copper. Due to the high density of copper, the weight of the entire heat pipe is large, which is not conducive to the lightweight design of electronic equipment; for portable electronic equipment, this disadvantage becomes more obvious, therefore, it will reduce the portability of electronic equipment It also reduces the user experience.
- the embodiments of the present application provide a heat conduction element with light weight, long service life, and high structural strength.
- the heat conducting element provided by the embodiment of the present application includes a shell, a capillary structure and a cooling liquid; the shell includes an inner layer and an outer layer, the inner layer is surrounded by a cavity, and the outer layer is wrapped around the periphery of the inner layer; the capillary structure is arranged in the cavity
- the cooling fluid is located in the cavity; the inner layer and the outer layer are made of different materials, and the material density of the outer layer is lower than that of the inner layer.
- the material of the inner layer may be copper or copper alloy; the material of the outer layer may be aluminum, titanium, aluminum alloy, titanium alloy, and the like.
- the thickness ratio of the inner layer to the outer layer can be 1:1, 1:2, 2:1, etc., that is, the thickness of the inner layer can be greater than, equal to, or less than the thickness of the outer layer; or the overall thickness in the inner layer can be The same can also be different; correspondingly, the overall thickness in the outer layer can be the same or different.
- the inner layer can be made of materials with higher density and more stable chemical properties to ensure its durability
- the outer layer can be made of materials with lower density to ensure the structural strength of the shell while reducing the shell
- the overall weight of the heat-conducting part, or the use of materials with better thermal conductivity to improve the heat-conducting performance of the heat-conducting part; the combination of the inner and outer layers can not only ensure the working stability of the heat-conducting part, but also ensure its structural strength to prevent At the same time, it can effectively reduce the weight of the shell, thereby facilitating the realization of lightweight design.
- the overall structure of the housing can be in various forms, for example, it can be plate-shaped, tubular or other shapes.
- the housing has a plate-shaped structure.
- the housing may be formed by buckling two plates; please refer to FIG. 2 in combination.
- the housing may include a first plate 11 and a second plate 12 that are buckled with each other.
- the body 11 and the second plate body 12 are buckled together to form the cavity.
- both the first plate body 11 and the second plate body 12 have the aforementioned inner layer and outer layer; specifically, when the first plate body 11 and the second plate body 12 are buckled with each other, the The edge of the inner layer 111 in the one board body 11 and the edge of the inner layer 121 in the second board body 12 are closely combined to form a closed cavity 13.
- the edges of the inner layer 111 and the inner layer 121 are closely coupled, the edge of the outer layer 112 in the first board 11 and the second board The edges of the outer layer 122 in the body 12 can also be tightly joined.
- the structure and manufacturing process of the inner layer and the outer layer in the first plate body and the second plate body can be multiple.
- the inner layer 111 and the outer layer 112 may be two separate plates.
- the inner layer 111 and the outer layer 112 of the first plate body 11 may be formed separately before they are combined.
- the inner layer 111 can use a flat plate as the blank, and then press and cut the blank as needed to obtain a formed inner layer.
- a flat plate can be used as the blank, and then the blank can be stamped and cut as required to obtain a formed outer layer. Then, the formed inner layer and the formed outer layer are combined by a process such as pressing (hot pressing or cold pressing) or welding, thereby completing the preparation of the first plate body 11.
- the inner layer 111 and the outer layer 112 may be combined before the first plate body 11 is formed.
- the inner layer 111 can use a flat plate as the blank, and the outer layer 112 can also use a flat plate as the blank, and then the inner layer can be pressed by pressing (hot pressing or cold pressing) or welding. Combining with the outer layer of blank material to obtain a pre-formed first plate; then, as required, the pre-formed first plate is punched and cut to complete the preparation of the first plate 11.
- the inner layer of the first plate body and/or the inner layer of the second plate body should be A cavity structure is provided so that the first plate body and the second plate body are buckled with each other to form the cavity.
- the specific forming method of the cavity can be multiple, for example, it can be formed by stamping, or it can be formed by etching or milling.
- the cavity 113 in the first plate 11 is formed by stamping.
- the inner layer 111 and the outer layer 112 in the first plate body 11 may be firstly punched separately, and then the inner layer 111 and the outer layer 112 after the punching are combined to complete the first plate body 11. Preparation of a plate body 11.
- the inner layer 111 and the outer layer 112 in the first plate body 11 may be combined first, and then the first plate body 11 is punched by a punching process to form the cavity 113.
- the inner layer and the outer layer in the first plate body may not be two separate plates.
- the outer layer 112 of the first plate body 11 is a plate, and the inner layer 111 is directly formed on the surface of the outer layer 112 by electroplating, vapor deposition or other processes.
- the outer layer 112 may be processed by stamping, etching, milling and other processes to form the cavity 113, and then the inner layer may be directly formed on the cavity side of the outer layer 112 by means of electroplating, vapor deposition, or the like.
- the second board its specific structure and manufacturing process can be substantially the same as the first board.
- the specific structures and manufacturing processes of the first plate body and the second plate body in the same casing may be substantially the same or different.
- the structures of the first plate body and the second plate body in the housing may be substantially the same.
- the first plate body 11 and the second plate body 12 both have a cavity structure.
- the cavity structure on the first plate body 11 The cavity 13 is formed by buckling with the cavity structure on the second board 12.
- the structure of the first plate body and the second plate body in the housing may be different.
- the first plate body 11 has a cavity structure
- the second plate body 12 is not provided with a cavity structure; when the first plate body 11 and the second plate body 12 are buckled with each other, The cavity structure in the first board 11 is buckled with the second board 12 to form a cavity 13.
- the heat-conducting element further includes at least one support post; the support post is arranged in the cavity and is used to support the cavity and prevent the cavity Deformed by force and compressed.
- the support column may be an independent structural member, or may be an integral structure with the first plate body or the second plate body in the housing.
- the supporting column 14 is an independent structural member; one end of the supporting column is against the first plate 11, and the other end is against the second plate 12.
- the support column 14 may be a hollow structure with closed ends; or, as shown in FIG. 11, the support column 14 may also be a tubular structure.
- the peripheral surface of the support column 14 may also be hollow.
- a capillary structure may also be provided on the inner wall or the outer wall of the support column 14 so that the cooling liquid can use the capillary structure on the support column 14 to achieve reflux.
- the capillary structure may be an elongated groove or a rib arranged along the length direction of the support column.
- a positioning is provided on the first plate 11 Groove 114, wherein the contour of the positioning groove 114 may be slightly larger than or equal to the outer peripheral contour of the support column 14, or the contour of the positioning groove 114 may be slightly smaller than the outer peripheral contour of the support column 14, so that the positioning groove 114 and the support column 14 can be connected Interference fit.
- the first plate 11 can be placed horizontally with the inner layer 111 of the first plate 11 facing upward, and then the lower end of the support column 14 can be inserted into the positioning slot 114, and then the capillary structure can be placed, and finally The first plate body and the second plate body are buckled together so that the upper end of the support column is against the inner layer of the second plate body.
- positioning grooves may also be provided on the second plate body, or positioning grooves may be provided on both the first plate body and the second plate body to increase the positioning accuracy between the support column and the housing. Connection stability.
- the support column may also be connected to the housing.
- one end of the support column can be connected to the first plate body, and the other end can abut against the second plate body.
- one end of the support column may be connected to the second plate body, and the other end may abut the first plate body.
- the connection between the support column and the first plate body or the second plate body can be welding, plug-in connection, and the like.
- the support column and the housing may also be an integral structure.
- the supporting column may be an integrally formed structure with the first plate body, or may be an integrally formed structure with the second plate body.
- the supporting column 14 and the first plate body 11 are integrally formed.
- the first plate body 11 may be processed by a stamping process to form the support column 14. After the first plate body and the second plate body are buckled with each other, the protruding end of the support column 14 abuts against the inner layer of the second plate body.
- the capillary structure needs to be assembled between the first plate body and the second plate body before the first plate body and the second plate body are buckled together.
- an appropriate assembly method can be selected according to the specific structure of the first plate body and the second plate body.
- the capillary structure 15 can be placed on the first plate body 11 and connected with the inner layer 111 on the first plate body 11. Offset; then the second plate body 12 and the first plate body 11 are buckled and sealed.
- the connection between the first plate body 11 and the second plate body 12 may be welding, pressing, and the like.
- an opening 115 communicating with the cavity should be reserved.
- the gas in the cavity can be extracted through the opening 115 to make the cavity in a negative pressure state; at the same time, cooling liquid can also be injected into the cavity through the opening 115. After the process of vacuuming and injecting the cooling liquid is completed, the opening 115 is sealed.
- the capillary structure 15 may be any one or a combination of copper mesh, copper fiber, sintered copper powder, and copper felt; and the capillary structure may be placed in the cavity and connected to the first plate body 11 and the The two plates 12 are opposed to each other; or, the capillary structure 15 is fixedly connected to the first plate 11 and/or the second plate 12.
- the plate-like structure of the heat-conducting member 1 in the above-mentioned embodiment is used in specific applications, one of the plate surfaces is arranged close to the heat source or is in conductive contact with the heat source.
- the first plate body 11 can be in close contact with the heat source, or conductively contact with the heat source through thermally conductive silicone grease, and achieve a fixed connection between the heat conducting element 1 and the heat source;
- One side of the plate 11 forms an evaporation zone, and one side of the second plate 12 forms a condensation zone.
- the cooling liquid (liquid cooling medium) in the cavity begins to vaporize after being heated in a low vacuum environment.
- the vaporized cooling medium quickly fills the entire cavity.
- the working fluid comes into contact with the condensing zone, it will condense and release heat; the condensed coolant will flow back to the evaporation zone through the capillary structure 15, so as to realize the conduction and dissipation of heat over and over again.
- the heat-conducting member has a long tubular structure as shown in FIG. 17, one end of the heat-conducting member is in conductive contact with the heat source as the evaporation zone, and the other end is the condensation zone.
- one end of the heat-conducting member 1 is close to the heat source, or is in conductive contact with the heat source.
- one end of the heat source can be closely attached to the heat source, or conductive contact with the heat source through thermally conductive silicone grease, and a fixed connection between the heat conducting element and the heat source; at this time, the end close to the heat source forms an evaporation zone, and the other end forms Condensation zone.
- the cooling liquid (liquid cooling medium) in the cavity begins to vaporize after being heated in a low vacuum environment. The vaporized cooling medium quickly fills the entire cavity.
- the working fluid When the working fluid contacts the condensing zone, it will condense and release heat; the condensed coolant will flow back to the evaporation zone with the help of the capillary structure, so as to realize the conduction and dissipation of heat over and over again.
- the capillary structure may be a mesh structure similar to that in the above embodiment, so that the cooling liquid can flow back from the condensation zone of the heat conducting element to the evaporation zone; of course, in some embodiments, the capillary structure It can also be formed on the wall of the cavity.
- a capillary structure 15 is provided on the inner wall of the cavity.
- the capillary structure 15 may be a micro-groove, or a micro-protrusion and other structures capable of generating capillary phenomena.
- an embodiment of the present application also provides an electronic device, which includes an electrical component 20 and the heat-conducting element 1 in any of the foregoing embodiments, wherein the heat-conducting element 1 and the electrical component 20 are conductively connected.
- the electronic device may also include circuit boards, power modules, screens and other components.
- the electrical component 20 can be installed on the circuit board for signal connection with other electrical components in the electronic device; the power module can be an electrical appliance.
- the component 20 provides or transmits electric energy; the heat-conducting member 1 can abut against the electrical component 20, or realize a conductive connection with the electrical component through auxiliary materials such as thermal conductive silicone grease, so that the heat generated by the electrical component can be effectively transferred to the heat-conducting component .
- the electronic device may be a tablet computer, a notebook computer, a mobile phone, etc.
- the electrical component may be CPU, GPU, etc.
- a fan, heat dissipation fins, etc. may also be provided in the electronic device to dissipate heat for the heat conducting element, so as to improve the heat dissipation effect of the electrical components.
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Sustainable Development (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种导热件及电子设备,导热件包括:壳体,具有内层(111、121)和外层(112、122),所述内层(111、121)围成有空腔(13),所述外层(112、122)包裹于所述内层(111、121)的外围;毛细结构(15),设置于所述空腔(13)内,并与所述壳体抵接;冷却液,位于所述空腔(13)内;其中,所述内层(111、121)与所述外层(112、122)的材质不同,且所述外层(112、122)的材料密度低于所述内层(111、121)的材料密度。本导热件中,内层(111、121)可以选用密度较大且化学性质较为稳定材质制成,以保证其耐用性,外层(112、122)可以选用密度较小的材质制成,以保证壳体结构强度的同时降低壳体的整体重量;通过内层(111、121)与外层(112、122)的结合不仅能够保证导热件的工作稳定性,还能够保证其结构强度,防止外力作用下受损坏,同时,还能有效降低壳体的重量,从而有利于实现轻量化设计。
Description
相关申请的交叉引用
本申请要求在2019年05月29日提交中国专利局、申请号为201910456489.6、申请名称为“一种导热件及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及电子设备技术领域,尤其涉及一种导热件及电子设备。
电子设备中的电子器件(如处理器、显卡)在运行时会产生大量的热,为了保证其正常运行,电子设备中通常会设置热管、均热板、风扇等对电子器件进行散热。
其中,均热板是一个内壁具有微细结构的真空腔体,通常由铜制成,并在真空腔体内注入水作为冷却液,当热由热源传导至蒸发区时,腔体内的冷却液在低真空度的环境中受热后开始产生冷却液的气化现象,此时吸收热能并且体积迅速膨胀,气相的冷却介质迅速充满整个腔体,当气相工质接触到一个比较冷的区域时便会产生凝结的现象,并释放出在蒸发时积累的热,凝结后的冷却液会由微细结构回到热源处,以此周而复始的实现热的传导。
由于传统的均热板由铜制成,因此具有重量较大的劣势,不利于实现均热板以及电子设备的轻量化设计。
其中,传统的热管与均热板的结构较为相似,且也由铜制成,因此同样具有重量较大的劣势,不利于实现均热板以及电子设备的轻量化设计。
发明内容
本申请提供了一种重量较低,使用寿命长的导热件及电子设备。
一方面,本申请提供了一种导热件,该导热件包括壳体、毛细结构以及冷却液;壳体包括内层和外层,内层围成有空腔,外层包裹于内层的外围;毛细结构设置于空腔内,并与壳体抵接;冷却液位于空腔内;其中,内层与外层的材质不同,且外层的材料密度低于内层的材料密度。通过上述结构设置,内层可以选用密度较大且化学性质较为稳定材质制成,以保证其耐用性,外层可以选用密度较小的材质制成,以保证壳体结构强度的同时降低壳体的整体重量,或者选用导热性能更好的材料,以提升导热件的导热性能;通过内层与外层的结合不仅能够保证导热件的工作稳定性,还能够保证其结构强度,防止外力作用下受损坏,同时,还能有效降低壳体的重量,从而有利于实现轻量化设计。
在具体实施时,内层的材质可以为铜或者铜合金;外层的材质可以为铝、钛、铝合金以及钛合金等。另外,内层与外层的厚度比例可以为1:1,1:2,2:1等,即内层的厚度可以大于、等于或小于外层的厚度;或者内层中的整体厚度可以是相同的,也可以是不同的;相应的,外层中的整体厚度可以是相同的,也可以是不同的。
其中,壳体的整体结构形态可以为多种,例如可以为板状、管状或者其他形状。
例如,当壳体的整体结构形态为板状时,壳体可以由两个板体扣合形成;具体来说,壳体可以包括相互扣合的第一板体和第二板体,内层分别位于第一板体和第二板体的相对的板面,外层分别位于第一板体和第二板体的相背离的板面,第一板体与第二板体相互扣合后,第一板体的内层和第二板体的内层相互结合形成该空腔。通过这种结构设置,可降低壳体的制作难度,有利于降低制作成本;同时还能保证壳体的制作品质,从而有利于提升导热件的工作稳定性及使用寿命。
其中,由于壳体中的空腔是由第一板体和第二板体相互扣合后形成的,因此,在一些具体实施方式中,第一板体上具有朝背离第二板体的方向凹陷的凹槽等凹陷结构;和/或,第二板体具有朝背离第一板体的方向凹陷的凹槽等凹陷结构。以使的一板体和第二板体相互扣合后形成该空腔。
另外,为了提升导热件的结构强度,在一些具体实施方式中,导热件还包括至少一个支撑柱;该支撑柱设置在空腔内,用于对空腔起到支撑作用,防止空腔受力形变而被压缩。在具体实施时,支撑柱可以为独立的结构件,也可以与壳体中的第一板体或第二板体为一体成型结构;当然,在具体实施时,支撑柱可以靠近空腔的中部设置;例如,当空腔呈立方体时,其边缘部分的受力性能高于中部的受力性能,因此,将支撑柱靠近空腔的中部设置时,可以提升空腔的整体受力性能。
当支撑柱为独立的结构件时,为了提升支撑柱与壳体装配时的精度,在一些具体实施方式中,第一板体和/或第二板体上还可以设置定位槽;其中定位槽的轮廓可以略大于或等于支撑柱的外周轮廓,或者定位槽的轮廓可以略小于支撑柱的外周轮廓,以使定位槽与支撑柱之间能够进行过盈配合。在进行装配工序时,可将支撑柱的一端插入第一板体或第二板体的定位槽内,由此,在将第一板体和第二板体进行扣合时,支撑柱不易产生位置偏移。
另外,在一些具体实施方式中,毛细结构可以直接成型在空腔的内壁上,也可以是独立的结构件。
例如,该毛细结构为独立的结构件时,其具体可以为网状结构;且材质可以为铜、铜合金或者表面镀铜的结构件。
另一方面,本申请还提供了一种电子设备,包括电路板、安装于电路板上的电器元件以及上述任意一种的导热件,其中,导热件与电器元件传导式连接。具体来说,导热件可以与电器元件抵接,或者通过导热硅脂等辅助材料实现与电器元件的传导式连接,以使电器元件所产生的热量能够有效的传递至导热件。通过采用上述的导热件,可大大降低电子设备的重量,从而有利于提升电子设备的便携性及用户体验。
图1为本申请实施例提供的一种导热件的壳体的结构示意图;
图2为本申请实施例提供的一种导热件的壳体的分解图;
图3为本申请实施例提供的一种导热件的壳体的剖面结构示意图;
图4为本申请实施例提供的另一种导热件的壳体的剖面结构示意图;
图5为本申请实施例提供的一种第一板体的第一视角的分解图;
图6为本申请实施例提供的一种第一板体的第二视角的分解图;
图7为本申请实施例提供的另一种第一板体的分解图;
图8为本申请实施例提供的又一种导热件的壳体的剖面结构示意图;
图9为本申请实施例提供的又一种导热件的壳体的剖面结构示意图;
图10为本申请实施例提供的一种支撑柱的剖面结构示意图;
图11为本申请实施例提供的另一种支撑柱的剖面结构示意图;
图12为本申请实施例提供的又一种支撑柱的结构示意图;
图13为本申请实施例提供的支撑柱安装在第一板体上的结构示意图;
图14为本申请实施例提供的一种第一板体的结构示意图;
图15为本申请实施例提供的一种第一板体的剖面结构示意图;
图16为本申请实施例提供的一种导热件的剖面结构示意图;
图17为本申请实施例提供的另一种导热件的结构示意图;
图18为本申请实施例提供的另一种导热件的剖面结构示意图;
图19为本申请实施例提供的又一种导热件的剖面结构示意图;
图20为本申请实施例提供的一种电子设备的结构示意图。
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的,而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样,单数表达形式“一个”、“一种”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式,除非其上下文中明确地有相反指示。还应当理解,在本申请以下各实施例中,“至少一个”、“一个或多个”是指一个、两个或两个以上。术语“和/或”,用于描述关联对象的关联关系,表示可以存在三种关系;例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B的情况,其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此,在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例,而是意味着“一个或多个但不是所有的实施例”,除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”,除非是以其他方式另外特别强调。
为了方便理解本申请实施例提供的导热件,下面首先说明一下其应用场景;本申请提供的导热件应用于电子设备中,用于为电子设备中的发热元件所产生的热量进行传导、扩散,以达到散热的目的。其中,电子设备具体可以为手机、平板电脑、笔记本电脑等。
以电子设备为笔记本电脑为例,笔记本电脑中的主要发热元件一般包括处理器(central processing unit,CPU)、显示芯片(video chipset,GPU)等。由于处理器或显示芯片在运行时会产生大量的热,为了防止因温度过高而影响处理器或显示芯片的工作性能,笔记本电脑中会设置热管或均热板等作为导热件,用于为处理器或显示芯片进行散热。
其中,均热板整体呈板状结构,主要包括相互密合的两个盖板,两个盖板之间形成有密闭的空腔,空腔内设置铜网、铜纤维、烧结铜粉、铜毡中的任意一种或组合作为毛细结 构,并填充纯水作为冷却液。为了避免盖板受冷却液的侵蚀,两个盖板的材质通常为无氧铜。均热板的工作原理主要包括传导、蒸发、对流、冷凝四个主要步骤。具体来说,在均热板中,接近热源(如其中一个盖板)的水受热后会迅速吸收热量并气化形成水蒸气,水蒸气会在空腔内进行扩散,当水蒸气接近冷源(如其中另一个盖板)时,会迅速凝结成液体并放出热量。凝结的水依靠毛细结构流回至热源处,完成一个热传导循环。
但是,由于两个盖板的材质均为无氧铜,且铜的密度较大,导致整个均热板的重量较大。不利于实现电子设备的轻量化设计;对于便携式电子设备来说,这种劣势则变得更为明显,因此,会降低电子设备的便携性,同时也降低了用户的使用体验。
其中,热管的工作原理与均热板相类似。热管整体呈长条的管状结构,热管中具有密闭的空腔,空腔中同样设置有与内壁紧贴的毛细结构,并填充水、乙醇或两者的混合溶液作为冷却液。为了避免热管的管体受水的侵蚀,其材质通常为铜。由于铜的密度较大,导致整个热管的重量较大,不利于实现电子设备的轻量化设计;对于便携式电子设备来说,这种劣势则变得更为明显,因此,会降低电子设备的便携性,同时也降低了用户的使用体验。
为此,本申请实施例提供了一种重量轻、使用寿命长、结构强度高的导热件。
本申请实施例提供的导热件包括壳体、毛细结构以及冷却液;壳体包括内层和外层,内层围成有空腔,外层包裹于内层的外围;毛细结构设置于空腔内,并与壳体抵接;冷却液位于空腔内;其中,内层与外层的材质不同,且外层的材料密度低于内层的材料密度。
其中,在具体实施时,内层的材质可以为铜或者铜合金;外层的材质可以为铝、钛、铝合金以及钛合金等。另外,内层与外层的厚度比例可以为1:1,1:2,2:1等,即内层的厚度可以大于、等于或小于外层的厚度;或者内层中的整体厚度可以是相同的,也可以是不同的;相应的,外层中的整体厚度可以是相同的,也可以是不同的。
通过上述结构设置,内层可以选用密度较大且化学性质较为稳定材质制成,以保证其耐用性,外层可以选用密度较小的材质制成,以保证壳体结构强度的同时降低壳体的整体重量,或者选用导热性能更好的材料,以提升导热件的导热性能;通过内层与外层的结合不仅能够保证导热件的工作稳定性,还能够保证其结构强度,防止外力作用下受损坏,同时,还能有效降低壳体的重量,从而有利于实现轻量化设计。
在具体实施时,壳体的整体结构形态可以为多种,例如可以为板状、管状或者其他形状。
如图1所示,在本申请提供的一个实施例中,壳体呈板状结构。
在具体实施时,壳体可以由两个板体扣合形成;请结合参阅图2,具体来说,壳体可以包括相互扣合的第一板体11和第二板体12,第一板体11与第二板体12相互扣合后形成该空腔。通过这种结构设置,可降低壳体的制作难度,有利于降低制作成本;同时还能保证壳体的制作品质,从而有利于提升导热件的工作稳定性及使用寿命。
如图3所示,第一板体11和第二板体12中均具有上述的内层和外层;具体来说,当第一板体11和第二板体12相互扣合时,第一板体11中的内层111的边缘与第二板体12中的内层121的边缘紧贴结合,从而形成密闭的空腔13。当然,如图4所示,在本申请提供的另一实施例中,当内层111和内层121的边缘紧贴结合时,第一板体11中的外层112的边缘与第二板体12中的外层122的边缘也可以紧贴结合。
其中,第一板体和第二板体中内层和外层的结构及制作工艺可以为多种。
以第一板体为例,如图5所示,在本申请提供的一个实施例中。在第一板体11中,内层111和外层112可以为单独的两个板材。
在一种具体实施方式中,可以先将第一板体11的内层111和外层112分别进行成型后再将两者结合。具体来说,内层111可以选用平整的板材作为胚料,然后根据需要对该胚料进行冲压、剪裁,从而制得成型的内层。外层112可以选用平整的板材作为胚料,然后根据需要对该胚料进行冲压、剪裁,从而制得成型的外层。然后采用压合(热压或冷压)或焊接等工艺将成型的内层和成型的外层进行结合,从而完成对第一板体11的制备。
在另一种具体实施方式中,可以先将内层111和外层112进行结合后再对第一板体11进行成型。具体来说,内层111可以选用平整的板材作为胚料,外层112也可以选用平整的板材作为胚料,然后采用压合(热压或冷压)或焊接等工艺将内层的胚料和外层的胚料进行结合,从而制得预成型的第一板体;然后根据需要对预成型的第一板体进行冲压、剪裁,从而完成对第一板体11的制备。
其中,由于壳体中的空腔是由第一板体11和第二板体12相互扣合后形成的,因此,第一板体的内层和/或第二板体的内层中应设置有凹腔结构,以使的一板体和第二板体相互扣合后形成该空腔。
其中,该凹腔的具体成型方式可以为多种,例如,可以采用冲压的方式进行成型,也可以采用蚀刻、铣削的方式进行成型。
如图5和图6所示,在本申请提供的一个实施例中,第一板体11中的凹腔113采用冲压的方式制作成型。在一种具体实施方式中,可以是先分别将第一板体11中的内层111和外层112分别进行冲压,然后将冲压成型后的内层111和外层112进行结合,以完成第一板体11的制备。在另一种实施方式中,可以是先将第一板体11中的内层111和外层112进行结合,然后采用冲压工艺对第一板体11进行冲压,以形成该凹腔113。
当然,在其他实施例中,第一板体中的内层和外层也可以不是单独的两个板材。
例如,如图7所示,在本申请提供的一个实施例中,第一板体11的外层112为板材,内层111采用电镀、气相沉积或者其他工艺直接成型在外层112的表面。
在具体实施时,可以采用冲压、蚀刻、铣削等工艺对外层112进行处理以形成凹腔113,然后采用电镀、气相沉积等方式将内层直接成型在外层112的凹腔侧。
对于第二板体,其具体结构以及制作工艺可以与第一板体大致相同。其中,同一壳体中的第一板体和第二板体的具体结构及制作工艺可以大致相同也可以不同。
例如,如图3所示,在一种实施方式中,壳体中的第一板体和第二板体的结构可以大致相同。具体来说,第一板体11和第二板体12中均具有凹腔结构,当第一板体11和第二板体12相互扣合后,位于第一板体11上的凹腔结构和位于第二板体12上的凹腔结构相互扣合形成空腔13。
当然,在另一种实施方式中,壳体中的第一板体和第二板体的结构可以不同。如图8所示,具体来说,第一板体11中具有凹腔结构,第二板体12中未设置凹腔结构;当第一板体11和第二板体12相互扣合后,位于第一板体11中的凹腔结构与第二板体12扣合,形成空腔13。
另外,为了提升导热件的结构强度,在本申请提供的实施例中,导热件还包括至少一个支撑柱;该支撑柱设置在空腔内,用于对空腔起到支撑作用,防止空腔受力形变而被压缩。
在具体实施时,支撑柱可以为独立的结构件,也可以与壳体中的第一板体或第二板体为一体成型结构。
如图9所示,在本申请提供的一个实施例中,支撑柱14为独立的结构件;其一端与第一板体11相抵,另一端与第二板体12相抵。其中,为了降低支撑柱14的重量;如图10所示,支撑柱14可以为两端封闭的中空状结构;或者,如图11所示,支撑柱14也可以为管状结构。在一些实施例方式中,为了防止冷却液在支撑柱14内积存,如图12所示,支撑柱14的周面还可以设置为镂空状。当然,在其他实施方式中,支撑柱14的内壁或者外壁上也可以设置毛细结构,以使冷却液能够利用位于支撑柱14上的毛细结构实现回流。在具体实施时,该毛细结构可以为沿支撑柱的长度方向上设置的长条形凹槽或者凸棱。
其中,将支撑柱装配至壳体内时,为了防止支撑柱与壳体之间产生位置偏移;如图13所示,在本申请提供的一个实施例中,第一板体11上设置有定位槽114,其中定位槽114的轮廓可以略大于或等于支撑柱14的外周轮廓,或者定位槽114的轮廓可以略小于支撑柱14的外周轮廓,以使定位槽114与支撑柱14之间能够进行过盈配合。在进行装配工序时,可以将第一板体11水平放置,且第一板体11的内层111朝上设置,然后将支撑柱14的下端插入定位槽114内,然后放置毛细结构,最后将第一板体和第二板体进行扣合,使支撑柱的上端与第二板体的内层相抵。
当然,在另一些具体实施方式中,第二板体上也可以设置定位槽,或者第一板体和第二板体上均设置定位槽,以增加支撑柱与壳体之间的定位精度及连接稳定性。
另外,在一些具体实施方式中,支撑柱还可以与壳体进行连接。在具体实施时,支撑柱的一端可以与第一板体相连接,另一端可以与第二板体抵接。或者,支撑柱的一端可以与第二板体相连接,另一端可以与第一板体抵接。其中,支撑柱与第一板体或第二板体之间的连接方式可以采用焊接、插接等。
当然,在另一些具体实施方式中,支撑柱也可以与壳体为一体成型结构。具体来说,支撑柱可以与第一板体为一体成型结构,也可以与第二板体为一体成型结构。
如图14和图15所示,在本申请提供的一个实施例中,支撑柱14与第一板体11为一体成型结构。在具体实施时,可以采用冲压工艺对第一板体11进行处理,以形成支撑柱14。当第一板体与第二板体相互扣合后,支撑柱14的伸出端与第二板体的内层相抵接。
当然,在将第一板体与第二板体扣合之前需要将毛细结构装配在第一板体和第二板体之间。
在对导热件中的各组成组件进行装配时,可以根据第一板体、第二板体的具体结构选择合适的装配方式。
例如,如图16所示,当支撑柱14与第一板体11为一体成型结构时,可以将毛细结构15放置在第一板体11上,并与第一板体11上的内层111相抵;然后将第二板体12与第一板体11进行扣合密封。其中,第一板体11与第二板体12之间的连接方式可以为焊接、压合等。当然,为了便于对空腔进行抽真空以及注入冷却液等工序;请结合参阅图2,第一板体11与第二板体12扣合密封之后,应预留与空腔连通的开口115。在进行抽真空工序时,可通过该开口115抽取出空腔内的气体,使空腔呈负压状态;同时,也可以通过该开口115向空腔内注入冷却液。当抽真空和注入冷却液的工序完成后,将该开口115密封即可。
在具体实施时,毛细结构15可以为铜网、铜纤维、烧结铜粉、铜毡中的任意一种或 组合;且毛细结构可以是放置在空腔内,并与第一板体11和第二板体12相抵;或者,毛细结构15与第一板体11和/或第二板体12固定连接。
上述实施例中的板状结构的导热件1在进行具体应用时,其中一个板面靠近热源设置,或者与热源传导式接触。具体来说,请结合参阅图16,第一板体11可以与热源紧贴,或者通过导热硅脂与热源实现传导式接触,并实现导热件1与热源之间的固定连接;此时,第一板体11的一侧形成蒸发区,第二板体12的一侧形成冷凝区。当热由热源传导至蒸发区时,空腔内的冷却液(液态的冷却介质)在低真空度的环境中受热后开始产生气化现象,气化的冷却介质迅速充满整个空腔,当气相工质接触到冷凝区时,便会产生凝结现象,并释放出热量;凝结后的冷却液会借助毛细结构15回流至蒸发区,以此周而复始实现热量的传导及散发。
当导热件为如图17所示的长条管状结构时,其一端与热源传导式接触作为蒸发区,另一端作为冷凝区。
其中,长条管状结构的导热件1在进行具体应用时,其一端靠近热源设置,或者与热源传导式接触。具体来说,其一端可以与热源紧贴,或者通过导热硅脂与热源实现传导式接触,并实现导热件与热源之间的固定连接;此时,靠近热源的一端形成蒸发区,另一端形成冷凝区。当热由热源传导至蒸发区时,空腔内的冷却液(液态的冷却介质)在低真空度的环境中受热后开始产生气化现象,气化的冷却介质迅速充满整个空腔,当气相工质接触到冷凝区时,便会产生凝结现象,并释放出热量;凝结后的冷却液会借助毛细结构回流至蒸发区,以此周而复始实现热量的传导及散发。
其中,如图18所示,毛细结构具体可以为与上述实施例中类似的网状结构,以使冷却液能够由导热件的冷凝区回流至蒸发区;当然,在一些实施方式中,毛细结构也可以是成型在空腔的壁上。
如图19所示,在本申请提供的一个实施例中,该空腔的内壁上设有毛细结构15。在具体实施时,该毛细结构15可以是微型槽,或者微型凸起等能够产生毛细现象的结构。
另外,如图20所示,本申请实施例还提供了一种电子设备,包括电器元件20以及上述任意实施例中的导热件1,其中,导热件1与电器元件20传导式连接。具体来说,电子设备中还可以包括电路板、电源模块、屏幕等组件,其中,电器元件20可以安装在电路板中,用于与电子设备中的其他电器元件信号连接;电源模块可以为电器元件20提供或传输电能;导热件1可以与电器元件20抵接,或者通过导热硅脂等辅助材料实现与电器元件的传导式连接,以使电器元件所产生的热量能够有效的传递至导热件。
在具体实施时,该电子设备可以为平板电脑、笔记本电脑、手机等。该电器元件可以为CPU、GPU等。
另外,在一些具体实施方式中,电子设备中还可以设置风扇、散热鳍片等用于为导热件散热,以提升对于电器元件的散热效果。
以上,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以权利要求的保护范围为准。
Claims (12)
- 一种导热件,其特征在于,包括:壳体,包括内层和外层,所述内层围成有空腔,所述外层包裹于所述内层的外围;毛细结构,设置于所述空腔内,并与所述壳体抵接;冷却液,位于所述空腔内;其中,所述内层与所述外层的材质不同,且所述外层的材料密度低于所述内层的材料密度。
- 根据权利要求1所述的导热件,其特征在于,所述内层的材质为铜或铜合金。
- 根据权利要求1或2所述的导热件,其特征在于,所述外层的材质为铝、铝合金、钛、钛合金中的至少一种。
- 根据权利要求1至3中任意一项所述的导热件,其特征在于,所述壳体包括相互扣合的第一板体和第二板体;所述内层分别位于所述第一板体和所述第二板体的相对的板面,所述外层分别位于所述第一板体和所述第二板体的相背离的板面,所述空腔位于所述第一板体的内层和所述第二板体的内层之间。
- 根据权利要求4所述的导热件,其特征在于,所述第一板体具有朝背离所述第二板体的方向凹陷的凹槽;和/或,所述第二板体具有朝背离所述第一板体的方向凹陷的凹槽。
- 根据权利要求4或5所述的导热件,其特征在于,所述空腔内具有至少一个支撑柱;所述至少一个支撑柱的一端与所述第一板体的内层连接,另一端与所述第二板体的内层连接。
- 根据权利要求1至3中任意一项所述的导热件,其特征在于,所述空腔内具有至少一个支撑柱;所述至少一个支撑柱的两端分别与所述壳体连接。
- 根据权利要求6或7所述的导热件,其特征在于,所述至少一个支撑柱靠近所述空腔的中部设置。
- 根据权利要求6至8中任意一项所述的导热件,其特征在于,所述空腔的内壁具有定位槽;所述至少一个支撑柱的两端分别与所述定位槽相抵。
- 根据权利要求6至8中任意一项所述的导热件,其特征在于,所述支撑柱与所述壳体为一体成型结构。
- 根据权利要求1至10中任意一项所述的导热件,其特征在于,所述毛细结构为铜网、铜纤维、烧结铜粉、铜毡中的任意一种或组合。
- 一种电子设备,其特征在于,包括电路板、安装于所述电路板上的电器元件以及权利要求1至11中任意一项所述的导热件;其中,所述导热件与所述电器元件传导式连接。
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EP3971681A1 (en) | 2022-03-23 |
CN112015249A (zh) | 2020-12-01 |
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