JP2017511646A - モバイル端末 - Google Patents
モバイル端末 Download PDFInfo
- Publication number
- JP2017511646A JP2017511646A JP2016558074A JP2016558074A JP2017511646A JP 2017511646 A JP2017511646 A JP 2017511646A JP 2016558074 A JP2016558074 A JP 2016558074A JP 2016558074 A JP2016558074 A JP 2016558074A JP 2017511646 A JP2017511646 A JP 2017511646A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- mobile terminal
- heat pipe
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
ヒートパイプであって、ヒートパイプの一端が溝内に埋設され、ヒートパイプの他端が回路基板の側壁から突出し、又は回路基板の側壁と面一である、ヒートパイプ、
を備える。
溝内に位置する熱パッドであって、チップとヒートパイプとの間に位置する、熱パッド、
を備える。
ヒートパイプ4であって、ヒートパイプ4の一端が溝3内に埋設され、他端が回路基板1の側壁から突出する、ヒートパイプ、
を備える。
溝3内に位置する熱パッド5であって、チップ2とヒートパイプ4との間に位置する、熱パッド5、
を備えてよい。
回路基板1上に位置し、チップ2を被覆するシールドケースと、
ヒートパイプ4、シールドケース、チップ2及び回路基板1を被覆する筐体等の構造と、
を備える。
Claims (7)
- 回路基板を備えるモバイル端末であって、
前記回路基板の第1の表面上にチップが配置され、前記回路基板の第2の表面に溝が設けられ、
前記モバイル端末は更に、
前記溝内に配置されたヒートパイプであって、前記ヒートパイプの一端は前記回路基板の側壁又は前記回路基板の側壁の外にまで延在する、ヒートパイプ、
を備える、モバイル端末。 - 前記溝は前記チップの下方まで延在する、
請求項1に記載のモバイル端末。 - 前記溝の深さは、前記回路基板の厚さの半分以下である、
請求項1又は2に記載のモバイル端末。 - 前記溝内に位置する熱パッドであって、前記チップと前記ヒートパイプとの間に位置する、熱パッド、
を更に備える、請求項2に記載のモバイル端末。 - 前記ヒートパイプは矩形断面を有する、
請求項1に記載のモバイル端末。 - 前記回路基板上に位置し、前記チップを被覆するシールドケース、
を更に備える、請求項1に記載のモバイル端末。 - 前記ヒートパイプ、前記シールドケース、前記チップ及び前記回路基板を被覆する筐体、
を更に備える、請求項1に記載のモバイル端末。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2014/073784 WO2015139271A1 (zh) | 2014-03-20 | 2014-03-20 | 一种移动终端 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017511646A true JP2017511646A (ja) | 2017-04-20 |
JP6527879B2 JP6527879B2 (ja) | 2019-06-05 |
Family
ID=54143689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016558074A Active JP6527879B2 (ja) | 2014-03-20 | 2014-03-20 | モバイル端末 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9768096B2 (ja) |
EP (1) | EP3104407B1 (ja) |
JP (1) | JP6527879B2 (ja) |
CN (1) | CN105340075B (ja) |
WO (1) | WO2015139271A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601347A (zh) * | 2020-12-22 | 2021-04-02 | 京东方科技集团股份有限公司 | Pcb组件与显示模组 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102546241B1 (ko) * | 2016-10-05 | 2023-06-22 | 삼성전자주식회사 | 반도체 패키지 |
CN106714515B (zh) * | 2016-12-20 | 2023-07-25 | 深圳市欢太科技有限公司 | 移动终端 |
CN110060966B (zh) * | 2018-01-18 | 2021-09-17 | 苏州旭创科技有限公司 | 光模块 |
CN108513515B (zh) * | 2018-06-11 | 2020-10-02 | Oppo广东移动通信有限公司 | 壳体组件以及电子装置 |
CN108777255B (zh) * | 2018-06-11 | 2020-07-31 | Oppo广东移动通信有限公司 | 一种散热组件及电子设备 |
CN108617081B (zh) * | 2018-06-11 | 2019-09-20 | Oppo广东移动通信有限公司 | 一种电子装置及一种电路板组件 |
CN110798961B (zh) * | 2018-08-01 | 2022-10-21 | 苏州旭创科技有限公司 | 一种电路板及具有其的光模块 |
CN114615795A (zh) * | 2022-03-08 | 2022-06-10 | 惠科股份有限公司 | Pcba板组件、pcba板组件的制作方法及电子设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163410A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
JP2001177030A (ja) * | 1999-12-15 | 2001-06-29 | Sony Corp | 放熱装置及び放熱装置を有する電子機器 |
JP2001291806A (ja) * | 2000-04-06 | 2001-10-19 | Housen Kk | ヒートシンク |
JP2002270803A (ja) * | 2001-03-14 | 2002-09-20 | Ricoh Co Ltd | 固体撮像装置、画像読取ユニット及び画像形成装置 |
JP2004177218A (ja) * | 2002-11-26 | 2004-06-24 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2004241450A (ja) * | 2003-02-04 | 2004-08-26 | Edl:Kk | ヒートシンク |
JP2006019557A (ja) * | 2004-07-02 | 2006-01-19 | Fujikura Ltd | 発光装置とその実装方法、照明器具及びディスプレイ |
JP2006066725A (ja) * | 2004-08-27 | 2006-03-09 | Sony Corp | 放熱構造を備える半導体装置及びその組立方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2635770B2 (ja) | 1989-06-23 | 1997-07-30 | 古河電気工業株式会社 | プリント配線用基板 |
DE69211074T2 (de) | 1991-08-26 | 1996-10-02 | Sun Microsystems Inc | Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie |
JPH06244576A (ja) | 1993-02-17 | 1994-09-02 | Toshiba Corp | ヒートパイプ一体化プリント配線板 |
KR100293139B1 (ko) | 1997-03-14 | 2001-06-15 | 아사무라 타카싯 | 가스분출류에 의한 강밴드 열처리 장치 |
JPH1168371A (ja) | 1997-08-21 | 1999-03-09 | Toshiba Corp | 電子機器及びその印刷配線基板 |
DE69724972T2 (de) * | 1997-11-11 | 2004-07-22 | Lucent Technologies Inc. | Elektronisches Gerät |
US6122167A (en) * | 1998-06-02 | 2000-09-19 | Dell Usa, L.P. | Integrated hybrid cooling with EMI shielding for a portable computer |
CN100444364C (zh) | 2005-09-02 | 2008-12-17 | 富准精密工业(深圳)有限公司 | 热管散热装置 |
KR100653605B1 (ko) * | 2005-11-15 | 2006-12-06 | 삼성전자주식회사 | 메탈 코어 히트싱크를 구비하는 반도체 칩 패키지와 그를포함하는 반도체 모듈 |
CN101374395B (zh) | 2007-08-24 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101384152B (zh) | 2007-09-07 | 2011-07-27 | 富准精密工业(深圳)有限公司 | 散热装置 |
JP5848874B2 (ja) * | 2011-01-07 | 2016-01-27 | 日本発條株式会社 | 温度調節装置およびこの温度調節装置の製造方法 |
CN202362724U (zh) | 2011-11-28 | 2012-08-01 | 双鸿科技股份有限公司 | 嵌入式散热器 |
-
2014
- 2014-03-20 US US15/123,484 patent/US9768096B2/en active Active
- 2014-03-20 JP JP2016558074A patent/JP6527879B2/ja active Active
- 2014-03-20 CN CN201480036435.XA patent/CN105340075B/zh active Active
- 2014-03-20 WO PCT/CN2014/073784 patent/WO2015139271A1/zh active Application Filing
- 2014-03-20 EP EP14886216.2A patent/EP3104407B1/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163410A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
JP2001177030A (ja) * | 1999-12-15 | 2001-06-29 | Sony Corp | 放熱装置及び放熱装置を有する電子機器 |
JP2001291806A (ja) * | 2000-04-06 | 2001-10-19 | Housen Kk | ヒートシンク |
JP2002270803A (ja) * | 2001-03-14 | 2002-09-20 | Ricoh Co Ltd | 固体撮像装置、画像読取ユニット及び画像形成装置 |
JP2004177218A (ja) * | 2002-11-26 | 2004-06-24 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2004241450A (ja) * | 2003-02-04 | 2004-08-26 | Edl:Kk | ヒートシンク |
JP2006019557A (ja) * | 2004-07-02 | 2006-01-19 | Fujikura Ltd | 発光装置とその実装方法、照明器具及びディスプレイ |
JP2006066725A (ja) * | 2004-08-27 | 2006-03-09 | Sony Corp | 放熱構造を備える半導体装置及びその組立方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601347A (zh) * | 2020-12-22 | 2021-04-02 | 京东方科技集团股份有限公司 | Pcb组件与显示模组 |
Also Published As
Publication number | Publication date |
---|---|
EP3104407A1 (en) | 2016-12-14 |
CN105340075B (zh) | 2019-09-13 |
EP3104407B1 (en) | 2020-09-09 |
US9768096B2 (en) | 2017-09-19 |
US20170077010A1 (en) | 2017-03-16 |
WO2015139271A1 (zh) | 2015-09-24 |
CN105340075A (zh) | 2016-02-17 |
EP3104407A4 (en) | 2017-03-08 |
JP6527879B2 (ja) | 2019-06-05 |
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