CN105340075A - 一种移动终端 - Google Patents

一种移动终端 Download PDF

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Publication number
CN105340075A
CN105340075A CN201480036435.XA CN201480036435A CN105340075A CN 105340075 A CN105340075 A CN 105340075A CN 201480036435 A CN201480036435 A CN 201480036435A CN 105340075 A CN105340075 A CN 105340075A
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CN
China
Prior art keywords
circuit board
chip
mobile terminal
heat pipe
groove
Prior art date
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Granted
Application number
CN201480036435.XA
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English (en)
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CN105340075B (zh
Inventor
颜龙平
魏孔刚
李华林
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Huawei Device Co Ltd
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Huawei Device Co Ltd
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Publication of CN105340075A publication Critical patent/CN105340075A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明实施例公开了一种移动终端，涉及终端技术领域，能够提高芯片的散热效果，降低芯片的温度。该种移动终端，包括电路板，所述电路板的第一面设置有芯片，所述电路板的第二面开设有凹槽，所述移动终端还包括：热管，所述凹槽中设置有所述热管，所述热管的一端延伸至所述电路板的侧壁或所述电路板的侧壁之外。

Description

PCT国内申请，说明书已公开。

Claims (1)

  1. PCT国内申请，权利要求书已公开。
CN201480036435.XA 2014-03-20 2014-03-20 一种移动终端 Active CN105340075B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/073784 WO2015139271A1 (zh) 2014-03-20 2014-03-20 一种移动终端

Publications (2)

Publication Number Publication Date
CN105340075A true CN105340075A (zh) 2016-02-17
CN105340075B CN105340075B (zh) 2019-09-13

Family

ID=54143689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480036435.XA Active CN105340075B (zh) 2014-03-20 2014-03-20 一种移动终端

Country Status (5)

Country Link
US (1) US9768096B2 (zh)
EP (1) EP3104407B1 (zh)
JP (1) JP6527879B2 (zh)
CN (1) CN105340075B (zh)
WO (1) WO2015139271A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714515A (zh) * 2016-12-20 2017-05-24 广东欧珀移动通信有限公司 移动终端
CN108513515A (zh) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN108777255A (zh) * 2018-06-11 2018-11-09 Oppo广东移动通信有限公司 一种散热组件及电子设备
CN110060966A (zh) * 2018-01-18 2019-07-26 苏州旭创科技有限公司 光模块
CN110798961A (zh) * 2018-08-01 2020-02-14 苏州旭创科技有限公司 一种电路板及具有其的光模块
CN114615795A (zh) * 2022-03-08 2022-06-10 惠科股份有限公司 Pcba板组件、pcba板组件的制作方法及电子设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102546241B1 (ko) 2016-10-05 2023-06-22 삼성전자주식회사 반도체 패키지
CN108617081B (zh) * 2018-06-11 2019-09-20 Oppo广东移动通信有限公司 一种电子装置及一种电路板组件
CN112601347B (zh) * 2020-12-22 2023-04-11 京东方科技集团股份有限公司 Pcb组件与显示模组

Citations (14)

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US5268812A (en) * 1991-08-26 1993-12-07 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JPH06244576A (ja) * 1993-02-17 1994-09-02 Toshiba Corp ヒートパイプ一体化プリント配線板
JPH1168371A (ja) * 1997-08-21 1999-03-09 Toshiba Corp 電子機器及びその印刷配線基板
EP0917418A1 (en) * 1997-11-11 1999-05-19 Lucent Technologies Inc. Electronic apparatus
JPH11163410A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
US6122167A (en) * 1998-06-02 2000-09-19 Dell Usa, L.P. Integrated hybrid cooling with EMI shielding for a portable computer
JP2001177030A (ja) * 1999-12-15 2001-06-29 Sony Corp 放熱装置及び放熱装置を有する電子機器
JP2004241450A (ja) * 2003-02-04 2004-08-26 Edl:Kk ヒートシンク
JP2006019557A (ja) * 2004-07-02 2006-01-19 Fujikura Ltd 発光装置とその実装方法、照明器具及びディスプレイ
CN1925143A (zh) * 2005-09-02 2007-03-07 富准精密工业(深圳)有限公司 热管散热装置
CN101374395A (zh) * 2007-08-24 2009-02-25 富准精密工业(深圳)有限公司 散热装置
CN101384152A (zh) * 2007-09-07 2009-03-11 富准精密工业(深圳)有限公司 散热装置
CN202362724U (zh) * 2011-11-28 2012-08-01 双鸿科技股份有限公司 嵌入式散热器
US20130284406A1 (en) * 2011-01-07 2013-10-31 Nhk Spring Co., Ltd. Temperature control device and method of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635770B2 (ja) * 1989-06-23 1997-07-30 古河電気工業株式会社 プリント配線用基板
TW404982B (en) 1997-03-14 2000-09-11 Nippon Steel Corp A heat treatment apparatus for a steel sheet by a gas jet system
JP2001291806A (ja) * 2000-04-06 2001-10-19 Housen Kk ヒートシンク
JP2002270803A (ja) * 2001-03-14 2002-09-20 Ricoh Co Ltd 固体撮像装置、画像読取ユニット及び画像形成装置
JP2004177218A (ja) * 2002-11-26 2004-06-24 Matsushita Electric Works Ltd 半導体加速度センサ
JP2006066725A (ja) * 2004-08-27 2006-03-09 Sony Corp 放熱構造を備える半導体装置及びその組立方法
KR100653605B1 (ko) * 2005-11-15 2006-12-06 삼성전자주식회사 메탈 코어 히트싱크를 구비하는 반도체 칩 패키지와 그를포함하는 반도체 모듈

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268812A (en) * 1991-08-26 1993-12-07 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JPH06244576A (ja) * 1993-02-17 1994-09-02 Toshiba Corp ヒートパイプ一体化プリント配線板
JPH1168371A (ja) * 1997-08-21 1999-03-09 Toshiba Corp 電子機器及びその印刷配線基板
EP0917418A1 (en) * 1997-11-11 1999-05-19 Lucent Technologies Inc. Electronic apparatus
JPH11163410A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
US6122167A (en) * 1998-06-02 2000-09-19 Dell Usa, L.P. Integrated hybrid cooling with EMI shielding for a portable computer
JP2001177030A (ja) * 1999-12-15 2001-06-29 Sony Corp 放熱装置及び放熱装置を有する電子機器
JP2004241450A (ja) * 2003-02-04 2004-08-26 Edl:Kk ヒートシンク
JP2006019557A (ja) * 2004-07-02 2006-01-19 Fujikura Ltd 発光装置とその実装方法、照明器具及びディスプレイ
CN1925143A (zh) * 2005-09-02 2007-03-07 富准精密工业(深圳)有限公司 热管散热装置
CN101374395A (zh) * 2007-08-24 2009-02-25 富准精密工业(深圳)有限公司 散热装置
CN101374395B (zh) * 2007-08-24 2012-05-16 富准精密工业(深圳)有限公司 散热装置
CN101384152A (zh) * 2007-09-07 2009-03-11 富准精密工业(深圳)有限公司 散热装置
CN101384152B (zh) * 2007-09-07 2011-07-27 富准精密工业(深圳)有限公司 散热装置
US20130284406A1 (en) * 2011-01-07 2013-10-31 Nhk Spring Co., Ltd. Temperature control device and method of manufacturing the same
CN202362724U (zh) * 2011-11-28 2012-08-01 双鸿科技股份有限公司 嵌入式散热器

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714515A (zh) * 2016-12-20 2017-05-24 广东欧珀移动通信有限公司 移动终端
CN110060966A (zh) * 2018-01-18 2019-07-26 苏州旭创科技有限公司 光模块
CN110060966B (zh) * 2018-01-18 2021-09-17 苏州旭创科技有限公司 光模块
CN108513515A (zh) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN108777255A (zh) * 2018-06-11 2018-11-09 Oppo广东移动通信有限公司 一种散热组件及电子设备
CN110798961A (zh) * 2018-08-01 2020-02-14 苏州旭创科技有限公司 一种电路板及具有其的光模块
CN110798961B (zh) * 2018-08-01 2022-10-21 苏州旭创科技有限公司 一种电路板及具有其的光模块
CN114615795A (zh) * 2022-03-08 2022-06-10 惠科股份有限公司 Pcba板组件、pcba板组件的制作方法及电子设备

Also Published As

Publication number Publication date
CN105340075B (zh) 2019-09-13
EP3104407B1 (en) 2020-09-09
EP3104407A4 (en) 2017-03-08
EP3104407A1 (en) 2016-12-14
US20170077010A1 (en) 2017-03-16
JP2017511646A (ja) 2017-04-20
JP6527879B2 (ja) 2019-06-05
WO2015139271A1 (zh) 2015-09-24
US9768096B2 (en) 2017-09-19

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Effective date of registration: 20171108

Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop

Applicant after: HUAWEI terminal (Dongguan) Co., Ltd.

Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No.

Applicant before: Huawei Device Co., Ltd.

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Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province

Applicant after: Huawei Device Co., Ltd.

Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province

Applicant before: HUAWEI terminal (Dongguan) Co., Ltd.

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