JP6376788B2 - 半導体装置およびその作製方法 - Google Patents
半導体装置およびその作製方法 Download PDFInfo
- Publication number
- JP6376788B2 JP6376788B2 JP2014055989A JP2014055989A JP6376788B2 JP 6376788 B2 JP6376788 B2 JP 6376788B2 JP 2014055989 A JP2014055989 A JP 2014055989A JP 2014055989 A JP2014055989 A JP 2014055989A JP 6376788 B2 JP6376788 B2 JP 6376788B2
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- Prior art keywords
- layer
- transistor
- oxide
- oxide semiconductor
- film
- Prior art date
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/441—Deposition of conductive or insulating materials for electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014055989A JP6376788B2 (ja) | 2013-03-26 | 2014-03-19 | 半導体装置およびその作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013064522 | 2013-03-26 | ||
| JP2013064522 | 2013-03-26 | ||
| JP2014055989A JP6376788B2 (ja) | 2013-03-26 | 2014-03-19 | 半導体装置およびその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014209596A JP2014209596A (ja) | 2014-11-06 |
| JP2014209596A5 JP2014209596A5 (enExample) | 2017-04-20 |
| JP6376788B2 true JP6376788B2 (ja) | 2018-08-22 |
Family
ID=51619930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014055989A Active JP6376788B2 (ja) | 2013-03-26 | 2014-03-19 | 半導体装置およびその作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US9496409B2 (enExample) |
| JP (1) | JP6376788B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6542243B2 (ja) * | 2014-09-18 | 2019-07-10 | 国立研究開発法人科学技術振興機構 | 発光素子、表示装置および照明装置 |
| US20160155803A1 (en) * | 2014-11-28 | 2016-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device, Method for Manufacturing the Semiconductor Device, and Display Device Including the Semiconductor Device |
| JP6436531B2 (ja) * | 2015-01-30 | 2018-12-12 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| KR102871323B1 (ko) * | 2015-03-03 | 2025-10-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 그 제작 방법, 또는 그를 포함하는 표시 장치 |
| JP6683503B2 (ja) | 2015-03-03 | 2020-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9806192B2 (en) * | 2015-06-24 | 2017-10-31 | Qorvo Us, Inc. | Suppression of back-gate transistors in RF CMOS switches built on an SOI substrate |
| JP2017022377A (ja) | 2015-07-14 | 2017-01-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20170221899A1 (en) * | 2016-01-29 | 2017-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Microcontroller System |
| US9905579B2 (en) * | 2016-03-18 | 2018-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| JP6668455B2 (ja) | 2016-04-01 | 2020-03-18 | 株式会社半導体エネルギー研究所 | 酸化物半導体膜の作製方法 |
| US10177199B2 (en) * | 2016-05-03 | 2019-01-08 | Tsinghua University | Method for making three dimensional complementary metal oxide semiconductor carbon nanotube thin film transistor circuit |
| WO2021048696A1 (ja) * | 2019-09-13 | 2021-03-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN116190431A (zh) * | 2023-03-13 | 2023-05-30 | 中国科学院微电子研究所 | 一种短沟道双栅igzo薄膜晶体管及其制备方法 |
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| US10056475B2 (en) | 2018-08-21 |
| US9496409B2 (en) | 2016-11-15 |
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