JP6366590B2 - エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置 - Google Patents

エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置 Download PDF

Info

Publication number
JP6366590B2
JP6366590B2 JP2015536583A JP2015536583A JP6366590B2 JP 6366590 B2 JP6366590 B2 JP 6366590B2 JP 2015536583 A JP2015536583 A JP 2015536583A JP 2015536583 A JP2015536583 A JP 2015536583A JP 6366590 B2 JP6366590 B2 JP 6366590B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
parts
biphenol
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015536583A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2015037584A1 (ja
Inventor
政隆 中西
政隆 中西
篤彦 長谷川
篤彦 長谷川
昌照 木村
昌照 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of JPWO2015037584A1 publication Critical patent/JPWO2015037584A1/ja
Application granted granted Critical
Publication of JP6366590B2 publication Critical patent/JP6366590B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
JP2015536583A 2013-09-10 2014-09-09 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置 Active JP6366590B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013186859 2013-09-10
JP2013186859 2013-09-10
JP2014143791 2014-07-14
JP2014143791 2014-07-14
PCT/JP2014/073807 WO2015037584A1 (ja) 2013-09-10 2014-09-09 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2015037584A1 JPWO2015037584A1 (ja) 2017-03-02
JP6366590B2 true JP6366590B2 (ja) 2018-08-01

Family

ID=52665687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015536583A Active JP6366590B2 (ja) 2013-09-10 2014-09-09 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置

Country Status (5)

Country Link
JP (1) JP6366590B2 (zh)
KR (1) KR20160053907A (zh)
CN (1) CN105531297A (zh)
TW (1) TWI638850B (zh)
WO (1) WO2015037584A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106536589A (zh) 2014-07-22 2017-03-22 沙特基础工业全球技术有限公司 高热单体及其使用的方法
WO2016031643A1 (ja) * 2014-08-26 2016-03-03 日本化薬株式会社 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物
JP6428147B2 (ja) * 2014-10-22 2018-11-28 味の素株式会社 樹脂組成物
CN107406577A (zh) * 2015-03-18 2017-11-28 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂片和印刷电路板
JP2017071706A (ja) * 2015-10-08 2017-04-13 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
CN109563237A (zh) * 2016-09-26 2019-04-02 沙特基础工业全球技术有限公司 高热和高韧性环氧组合物、制品及其用途
WO2018057056A1 (en) * 2016-09-26 2018-03-29 Sabic Global Technologies B.V. Homogeneous amorphous high heat epoxy blends, articles, and uses thereof
US20190270844A1 (en) * 2016-09-26 2019-09-05 Sabic Global Technologies B.V. Homogeneous amorphous high heat epoxy blend composite compositions, articles, and uses thereof
CN109790278A (zh) * 2016-09-26 2019-05-21 沙特基础工业全球技术有限公司 高热复合材料组合物、制品及其用途
KR102040296B1 (ko) * 2016-12-19 2019-11-04 삼성에스디아이 주식회사 필름형 반도체 밀봉 부재, 이를 이용하여 제조된 반도체 패키지 및 그 제조 방법
JP2020026439A (ja) * 2016-12-22 2020-02-20 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物および硬化物
WO2018199309A1 (ja) * 2017-04-28 2018-11-01 日立化成株式会社 封止用フィルム及び封止構造体、並びにこれらの製造方法
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
WO2020175037A1 (ja) * 2019-02-28 2020-09-03 日本ゼオン株式会社 樹脂組成物、電子部品、及び、樹脂膜の製造方法
JP7439818B2 (ja) 2019-02-28 2024-02-28 日本ゼオン株式会社 樹脂組成物、樹脂膜、及び、電子部品
KR102696450B1 (ko) * 2019-12-05 2024-08-16 주식회사 두산 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법
JP7290205B2 (ja) * 2020-12-03 2023-06-13 Dic株式会社 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム
JP2024010251A (ja) * 2020-12-03 2024-01-24 Dic株式会社 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム
CN112831270B (zh) * 2021-02-02 2022-04-15 上海创林新材料技术有限公司 一种耐高温高湿高压、耐酸碱高附着力滚喷涂料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH496021A (de) * 1966-03-10 1970-09-15 Ciba Geigy Verfahren zur Herstellung von neuen Polyglycidyläthern
JPH01108218A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JPH01108217A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JP2004099744A (ja) * 2002-09-10 2004-04-02 Mitsui Chemicals Inc エポキシ樹脂の精製方法
JP5273762B2 (ja) * 2007-01-26 2013-08-28 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
WO2011142466A1 (ja) * 2010-05-14 2011-11-17 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
TW201522486A (zh) 2015-06-16
WO2015037584A1 (ja) 2015-03-19
CN105531297A (zh) 2016-04-27
KR20160053907A (ko) 2016-05-13
JPWO2015037584A1 (ja) 2017-03-02
TWI638850B (zh) 2018-10-21

Similar Documents

Publication Publication Date Title
JP6366590B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP6366504B2 (ja) エポキシ樹脂、エポキシ樹脂組成物および硬化物
KR101229854B1 (ko) 에폭시 수지, 이를 함유하는 경화성 수지 조성물 및 그용도
TWI618744B (zh) 環氧樹脂混合物、環氧樹脂組成物、硬化物及半導體裝置
JP2017071706A (ja) エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
JP5127160B2 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP5322143B2 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP6688805B2 (ja) 置換アリルエーテル樹脂、メタリルエーテル樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP6302280B2 (ja) エポキシ樹脂、硬化性樹脂組成物および硬化物
JP2010235823A (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP5220488B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP5040404B2 (ja) 封止材用エポキシ樹脂組成物、その硬化体および半導体装置
JP6239599B2 (ja) フェノール樹脂、該フェノール樹脂を含有するエポキシ樹脂組成物、およびその硬化物
JP6544815B2 (ja) エポキシ樹脂、硬化性樹脂組成物および硬化物
JP4942384B2 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP2010053293A (ja) エポキシ樹脂組成物
JP4776446B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
WO2018135588A1 (ja) エポキシ樹脂の製造方法、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2018117150A1 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物
JP2018065941A (ja) 置換アリルエーテル樹脂、メタリルエーテル樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170316

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180124

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180626

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180703

R150 Certificate of patent or registration of utility model

Ref document number: 6366590

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250