JP6348419B2 - 感光性樹脂組成物 - Google Patents
感光性樹脂組成物 Download PDFInfo
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- JP6348419B2 JP6348419B2 JP2014536842A JP2014536842A JP6348419B2 JP 6348419 B2 JP6348419 B2 JP 6348419B2 JP 2014536842 A JP2014536842 A JP 2014536842A JP 2014536842 A JP2014536842 A JP 2014536842A JP 6348419 B2 JP6348419 B2 JP 6348419B2
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- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
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- QJOOZNCPHALTKK-UHFFFAOYSA-N trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC QJOOZNCPHALTKK-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
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- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
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- C08G8/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with monohydric phenols having only one hydrocarbon substituent ortho on para to the OH group, e.g. p-tert.-butyl phenol
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
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- C08G8/24—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups C08G8/10 - C08G8/20
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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JP2014059463A (ja) * | 2012-09-18 | 2014-04-03 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
CN106715597B (zh) * | 2014-10-06 | 2022-03-01 | 东丽株式会社 | 树脂组合物、耐热性树脂膜的制造方法及显示装置 |
JP6697222B2 (ja) * | 2015-03-04 | 2020-05-20 | 太陽インキ製造株式会社 | エッチングレジスト組成物およびドライフィルム |
US20190033714A1 (en) * | 2016-03-28 | 2019-01-31 | Toray Industries, Inc. | Resin composition, cured relief pattern thereof, and method for manufacturing semiconductor electronic component or semiconductor equipment using the same |
CN105801787B (zh) * | 2016-04-25 | 2018-05-22 | 宋芳 | 一种大分子结构光敏剂及其制备方法和用该光敏剂制备的光刻胶 |
KR102654926B1 (ko) * | 2016-08-10 | 2024-04-05 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 이를 이용한 금속 패턴의 형성 방법 |
CN106977421A (zh) * | 2017-02-16 | 2017-07-25 | 蚁术新材料科技(上海)有限公司 | 一种制备重氮萘醌型光敏剂的方法 |
CN112424289A (zh) * | 2018-08-01 | 2021-02-26 | 东丽株式会社 | 树脂组合物、树脂片、固化膜、固化膜的制造方法、半导体装置及显示装置 |
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US6534235B1 (en) * | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
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JP2011095705A (ja) * | 2009-09-30 | 2011-05-12 | Fujifilm Corp | 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板 |
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JP6007510B2 (ja) * | 2012-02-27 | 2016-10-12 | 住友ベークライト株式会社 | 感光性樹脂組成物、保護膜および半導体装置 |
JP2013205553A (ja) * | 2012-03-28 | 2013-10-07 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
JP2014059463A (ja) * | 2012-09-18 | 2014-04-03 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
WO2014069091A1 (ja) * | 2012-10-30 | 2014-05-08 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置 |
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KR101900636B1 (ko) | 2018-09-19 |
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JP6587661B2 (ja) | 2019-10-09 |
KR20170084364A (ko) | 2017-07-19 |
TWI559089B (zh) | 2016-11-21 |
CN104641293A (zh) | 2015-05-20 |
KR20150042820A (ko) | 2015-04-21 |
CN104641293B (zh) | 2019-04-19 |
JP2018022171A (ja) | 2018-02-08 |
WO2014046062A1 (ja) | 2014-03-27 |
KR101781702B1 (ko) | 2017-09-25 |
TW201421161A (zh) | 2014-06-01 |
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