JP6338348B2 - フレキシブルプリント基板及び電子機器 - Google Patents

フレキシブルプリント基板及び電子機器 Download PDF

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Publication number
JP6338348B2
JP6338348B2 JP2013223342A JP2013223342A JP6338348B2 JP 6338348 B2 JP6338348 B2 JP 6338348B2 JP 2013223342 A JP2013223342 A JP 2013223342A JP 2013223342 A JP2013223342 A JP 2013223342A JP 6338348 B2 JP6338348 B2 JP 6338348B2
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Japan
Prior art keywords
flexible printed
printed circuit
circuit board
pattern
copper foil
Prior art date
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Active
Application number
JP2013223342A
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English (en)
Japanese (ja)
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JP2014143395A (ja
JP2014143395A5 (enExample
Inventor
晋作 渡辺
晋作 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013223342A priority Critical patent/JP6338348B2/ja
Priority to US14/136,957 priority patent/US9380696B2/en
Priority to CN201310740698.6A priority patent/CN103906343B/zh
Publication of JP2014143395A publication Critical patent/JP2014143395A/ja
Publication of JP2014143395A5 publication Critical patent/JP2014143395A5/ja
Application granted granted Critical
Publication of JP6338348B2 publication Critical patent/JP6338348B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2013223342A 2012-12-26 2013-10-28 フレキシブルプリント基板及び電子機器 Active JP6338348B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013223342A JP6338348B2 (ja) 2012-12-26 2013-10-28 フレキシブルプリント基板及び電子機器
US14/136,957 US9380696B2 (en) 2012-12-26 2013-12-20 Flexible printed circuit board and electronic device
CN201310740698.6A CN103906343B (zh) 2012-12-26 2013-12-26 挠性印刷电路板及电子装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012282789 2012-12-26
JP2012282789 2012-12-26
JP2013223342A JP6338348B2 (ja) 2012-12-26 2013-10-28 フレキシブルプリント基板及び電子機器

Publications (3)

Publication Number Publication Date
JP2014143395A JP2014143395A (ja) 2014-08-07
JP2014143395A5 JP2014143395A5 (enExample) 2016-12-08
JP6338348B2 true JP6338348B2 (ja) 2018-06-06

Family

ID=50973352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013223342A Active JP6338348B2 (ja) 2012-12-26 2013-10-28 フレキシブルプリント基板及び電子機器

Country Status (3)

Country Link
US (1) US9380696B2 (enExample)
JP (1) JP6338348B2 (enExample)
CN (1) CN103906343B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5966875B2 (ja) * 2012-11-16 2016-08-10 富士通株式会社 コネクタ及びフレキシブルプリント基板
JP6396707B2 (ja) * 2014-07-22 2018-09-26 クラリオン株式会社 静電サージ防止構造
JP2017022173A (ja) * 2015-07-07 2017-01-26 日本メクトロン株式会社 伸縮性導電基板及び伸縮性導電積層体
CN106470523B (zh) * 2015-08-19 2019-04-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
JP7674835B2 (ja) 2017-11-15 2025-05-12 スミス アンド ネフュー ピーエルシー 統合センサ対応型創傷モニタリングおよび／または治療被覆材ならびにシステム
JP2019175943A (ja) * 2018-03-27 2019-10-10 シャープ株式会社 フレキシブルプリント基板、積層体、およびフレキシブルプリント基板の製造方法
JP6679662B2 (ja) * 2018-06-25 2020-04-15 キヤノン株式会社 撮像装置
JP2020003526A (ja) * 2018-06-25 2020-01-09 堺ディスプレイプロダクト株式会社 表示装置
CN110177434B (zh) * 2019-02-20 2021-11-23 淳华科技(昆山)有限公司 软性线路板揭盖设备
JP7404634B2 (ja) * 2019-03-28 2023-12-26 大日本印刷株式会社 配線基板および素子付配線基板
CN110831339A (zh) * 2019-11-14 2020-02-21 江苏上达电子有限公司 一种避免油墨气泡的图形设计方法
US11533807B2 (en) * 2020-01-03 2022-12-20 Aptiv Technologies Limited Integral features providing improved flexible printed circuit folding and connection capability
CN111465175B (zh) * 2020-04-23 2022-08-12 京东方科技集团股份有限公司 电路板及其制备方法、电子设备
US12418979B2 (en) * 2020-12-14 2025-09-16 Aptiv Technologies AG Integral features providing improved flexible printed circuit folding and connection capability
JP7439001B2 (ja) * 2021-02-19 2024-02-27 矢崎総業株式会社 フレキシブルプリント基板、フレキシブルプリント基板の製造方法
CN115226289A (zh) * 2022-06-14 2022-10-21 景旺电子科技(龙川)有限公司 双面贴合黑色覆盖膜的柔性电路板及制备、压合检测方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3420391B2 (ja) * 1995-06-20 2003-06-23 キヤノン株式会社 電気回路基板におけるアライメントマーク構造
JPH09205261A (ja) 1996-01-26 1997-08-05 Canon Inc フレキシブルプリント基板
JP3513569B2 (ja) * 1997-02-05 2004-03-31 日本航空電子工業株式会社 可撓性プリント基板およびその製造方法
JP3492350B2 (ja) * 2002-04-12 2004-02-03 新藤電子工業株式会社 回路基板および回路基板の製造方法
JP2005340641A (ja) * 2004-05-28 2005-12-08 Nippon Mektron Ltd 可撓性回路基板
JP2006245325A (ja) * 2005-03-03 2006-09-14 Fuji Photo Film Co Ltd 積層基板、積層体及びその製造方法
CN102265249B (zh) * 2008-12-26 2014-03-12 日本写真印刷株式会社 电子设备显示窗的带触摸输入功能的保护面板及其制造方法
WO2011046770A1 (en) * 2009-10-14 2011-04-21 Lockheed Martin Corporation Serviceable conformal em shield
JP5528273B2 (ja) * 2010-09-16 2014-06-25 日東電工株式会社 配線回路基板、配線回路基板集合体シートおよびその製造方法

Also Published As

Publication number Publication date
CN103906343B (zh) 2017-03-01
CN103906343A (zh) 2014-07-02
JP2014143395A (ja) 2014-08-07
US20140174796A1 (en) 2014-06-26
US9380696B2 (en) 2016-06-28

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