JP6332668B2 - 配線基板及びその製造方法と半導体装置 - Google Patents

配線基板及びその製造方法と半導体装置 Download PDF

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JP6332668B2
JP6332668B2 JP2014056218A JP2014056218A JP6332668B2 JP 6332668 B2 JP6332668 B2 JP 6332668B2 JP 2014056218 A JP2014056218 A JP 2014056218A JP 2014056218 A JP2014056218 A JP 2014056218A JP 6332668 B2 JP6332668 B2 JP 6332668B2
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seed layer
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solder
pad
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JP2015179730A5 (enExample
JP2015179730A (ja
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浩志 種子田
浩志 種子田
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014056218A 2014-03-19 2014-03-19 配線基板及びその製造方法と半導体装置 Active JP6332668B2 (ja)

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JP2014056218A JP6332668B2 (ja) 2014-03-19 2014-03-19 配線基板及びその製造方法と半導体装置

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JP2014056218A JP6332668B2 (ja) 2014-03-19 2014-03-19 配線基板及びその製造方法と半導体装置

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JP2015179730A JP2015179730A (ja) 2015-10-08
JP2015179730A5 JP2015179730A5 (enExample) 2017-01-12
JP6332668B2 true JP6332668B2 (ja) 2018-05-30

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6778667B2 (ja) * 2017-08-30 2020-11-04 京セラ株式会社 印刷配線板およびその製造方法
KR102501905B1 (ko) * 2017-11-09 2023-02-21 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP7257175B2 (ja) * 2019-02-15 2023-04-13 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP7411354B2 (ja) * 2019-08-30 2024-01-11 イビデン株式会社 プリント配線板およびその製造方法
US11688840B2 (en) * 2019-12-28 2023-06-27 Seoul Viosys Co., Ltd. Light emitting device and led display apparatus having the same
KR20230040814A (ko) * 2021-09-16 2023-03-23 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
CN115394738A (zh) * 2022-09-13 2022-11-25 广东省科学院半导体研究所 键合焊点制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252436A (ja) * 1988-08-17 1990-02-22 Shimadzu Corp ハンダバンプ製造方法
JP2004111656A (ja) * 2002-09-18 2004-04-08 Nec Electronics Corp 半導体装置及び半導体装置の製造方法
JP4049127B2 (ja) * 2004-06-11 2008-02-20 ヤマハ株式会社 半導体装置の製造方法
JP2006030971A (ja) * 2004-06-15 2006-02-02 Techno Network Shikoku Co Ltd フォトリソグラフィー方法
JP4702827B2 (ja) * 2004-12-24 2011-06-15 ローム株式会社 半導体装置およびその製造方法
KR20110070987A (ko) * 2008-10-21 2011-06-27 아토테크더치랜드게엠베하 기판 상에 땜납 용착물을 형성하는 방법
JP2010165779A (ja) * 2009-01-14 2010-07-29 Sharp Corp 固体撮像装置およびその製造方法
JP6087061B2 (ja) * 2012-04-12 2017-03-01 新光電気工業株式会社 バンプ及びバンプ形成方法

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