JP6325975B2 - リードフレーム、半導体装置 - Google Patents

リードフレーム、半導体装置 Download PDF

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Publication number
JP6325975B2
JP6325975B2 JP2014257463A JP2014257463A JP6325975B2 JP 6325975 B2 JP6325975 B2 JP 6325975B2 JP 2014257463 A JP2014257463 A JP 2014257463A JP 2014257463 A JP2014257463 A JP 2014257463A JP 6325975 B2 JP6325975 B2 JP 6325975B2
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Japan
Prior art keywords
lead
semiconductor device
frame
resin
terminal
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JP2014257463A
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Japanese (ja)
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JP2016119366A5 (enExample
JP2016119366A (ja
Inventor
哲一郎 笠原
哲一郎 笠原
正幸 大串
正幸 大串
直也 坂井
直也 坂井
秀基 小林
秀基 小林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2014257463A priority Critical patent/JP6325975B2/ja
Priority to KR1020150164526A priority patent/KR102452097B1/ko
Priority to US14/955,117 priority patent/US9698084B2/en
Priority to TW104140272A priority patent/TWI668826B/zh
Priority to CN201510882130.7A priority patent/CN105720034B/zh
Publication of JP2016119366A publication Critical patent/JP2016119366A/ja
Publication of JP2016119366A5 publication Critical patent/JP2016119366A5/ja
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Publication of JP6325975B2 publication Critical patent/JP6325975B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
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    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2014257463A 2014-12-19 2014-12-19 リードフレーム、半導体装置 Active JP6325975B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014257463A JP6325975B2 (ja) 2014-12-19 2014-12-19 リードフレーム、半導体装置
KR1020150164526A KR102452097B1 (ko) 2014-12-19 2015-11-24 리드 프레임 및 반도체 장치
US14/955,117 US9698084B2 (en) 2014-12-19 2015-12-01 Semiconductor device and lead frame having two leads welded together
TW104140272A TWI668826B (zh) 2014-12-19 2015-12-02 Lead frame, semiconductor device
CN201510882130.7A CN105720034B (zh) 2014-12-19 2015-12-03 引线框架、半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014257463A JP6325975B2 (ja) 2014-12-19 2014-12-19 リードフレーム、半導体装置

Publications (3)

Publication Number Publication Date
JP2016119366A JP2016119366A (ja) 2016-06-30
JP2016119366A5 JP2016119366A5 (enExample) 2017-08-31
JP6325975B2 true JP6325975B2 (ja) 2018-05-16

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JP2014257463A Active JP6325975B2 (ja) 2014-12-19 2014-12-19 リードフレーム、半導体装置

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US (1) US9698084B2 (enExample)
JP (1) JP6325975B2 (enExample)
KR (1) KR102452097B1 (enExample)
CN (1) CN105720034B (enExample)
TW (1) TWI668826B (enExample)

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JP6325975B2 (ja) * 2014-12-19 2018-05-16 新光電気工業株式会社 リードフレーム、半導体装置
JP6577373B2 (ja) * 2016-01-18 2019-09-18 新光電気工業株式会社 リードフレーム及びその製造方法、半導体装置
JP6788509B2 (ja) * 2017-01-17 2020-11-25 株式会社三井ハイテック リードフレームの製造方法およびリードフレーム
JP6661565B2 (ja) * 2017-03-21 2020-03-11 株式会社東芝 半導体装置及びその製造方法
DE102017120747B4 (de) * 2017-09-08 2020-07-30 Infineon Technologies Austria Ag SMD-Gehäuse mit Oberseitenkühlung und Verfahren zu seiner Bereitstellung
RU180407U1 (ru) * 2018-02-06 2018-06-13 Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Выводная рамка корпуса интегральной микросхемы
DE102018217659B4 (de) 2018-10-15 2022-08-04 Vitesco Technologies GmbH Anordnung und Verfahren zur Herstellung einer elektrisch leitfähigen Verbindung zwischen zwei Substraten
JP7271337B2 (ja) * 2019-06-27 2023-05-11 新光電気工業株式会社 電子部品装置及び電子部品装置の製造方法
JP7467214B2 (ja) * 2020-04-22 2024-04-15 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法
KR102514564B1 (ko) * 2021-06-28 2023-03-29 해성디에스 주식회사 홈이 형성된 리드를 포함하는 리드 프레임
JP7763055B2 (ja) * 2021-08-23 2025-10-31 株式会社ディスコ パッケージ基板、パッケージ基板の加工方法及びパッケージ基板の製造方法
CN114121853B (zh) * 2022-01-27 2022-05-24 深圳中科四合科技有限公司 大尺寸芯片适配小尺寸封装体的封装结构

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TWI668826B (zh) 2019-08-11
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US9698084B2 (en) 2017-07-04
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