JP6301031B1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6301031B1 JP6301031B1 JP2017557016A JP2017557016A JP6301031B1 JP 6301031 B1 JP6301031 B1 JP 6301031B1 JP 2017557016 A JP2017557016 A JP 2017557016A JP 2017557016 A JP2017557016 A JP 2017557016A JP 6301031 B1 JP6301031 B1 JP 6301031B1
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- circuit board
- printed circuit
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000007789 sealing Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 5
- 230000032798 delamination Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00012—Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
図1は、本発明の実施の形態1に係る半導体装置の断面模式図である。図2は、実施の形態1に係る半導体装置の上面図である。半導体装置20は、抵抗、コンデンサ、集積回路(Integrated Circuit, IC)、フォトカプラといった電気部品である部品3が実装されたプリント基板2と、電力用半導体素子であるパワー素子7とが封止樹脂10によってモールドされて封止されている。パワー素子7は、絶縁ゲートバイポーラトランジスタ及びダイオードを例示できるが、これらに限定はされない。パワー素子7は、リードフレーム1の表面に搭載されており、金属ワイヤ6を介してプリント基板2のボンディングパッド5に接続されている。パワー素子7が搭載されたリードフレーム1は、パワー素子7が搭載された面の反対側の面である裏面に、絶縁シート8を介して金属ベース9が配置されている。金属ベース9は、封止樹脂10の外部に露出しており、パワー素子7で発生した熱は、絶縁シート8及び金属ベース9を介して半導体装置20の外に放熱される。
図5は、本発明の実施の形態2に係る半導体装置の上面図である。実施の形態2に係る半導体装置20は、プリント基板2が矩形状ではなく、面内方向に張り出す凸部2aを有する外形である点で実施の形態1に係る半導体装置20と相違する。実施の形態2では、凸部2aに貫通孔4を形成する。それ以外は実施の形態1と同様である。
Claims (5)
- 複数の貫通孔が外周に沿って基板厚さの4倍以下の間隔で形成されたプリント基板と、
該プリント基板と電気的に接続された半導体素子と、
前記プリント基板及び前記半導体素子を封止する封止樹脂とを備え、
前記プリント基板は、外周に凸部を有する外形形状であり、該凸部に前記貫通孔が形成されており、
複数の前記貫通孔に前記封止樹脂が充填されていることを特徴とする半導体装置。 - 複数の前記貫通孔は、前記プリント基板の外周から基板厚さの2倍以下の距離の位置に形成されていることを特徴とする請求項1に記載の半導体装置。
- 前記プリント基板は、複数の前記貫通孔で囲まれる領域内だけに配線パターンが形成されていることを特徴とする請求項1に記載の半導体装置。
- 前記プリント基板の基材のガラス転移温度と、前記封止樹脂のガラス転移温度との差が、30℃以内であることを特徴とする請求項1又は2に記載の半導体装置。
- 前記封止樹脂は、無機材料粒子である充填剤を含み、
前記貫通孔の口径は、前記充填剤の平均粒径の10倍以上であることを特徴とする請求項1から4のいずれか1項に記載の半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/016015 WO2018193614A1 (ja) | 2017-04-21 | 2017-04-21 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6301031B1 true JP6301031B1 (ja) | 2018-03-28 |
JPWO2018193614A1 JPWO2018193614A1 (ja) | 2019-06-27 |
Family
ID=61756590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017557016A Expired - Fee Related JP6301031B1 (ja) | 2017-04-21 | 2017-04-21 | 半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10615093B2 (ja) |
JP (1) | JP6301031B1 (ja) |
CN (1) | CN109104878B (ja) |
DE (1) | DE112017000347B4 (ja) |
TW (1) | TWI672773B (ja) |
WO (1) | WO2018193614A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03205857A (ja) * | 1990-01-06 | 1991-09-09 | Fujitsu Ltd | 樹脂封止型電子部品 |
JP2012255147A (ja) * | 2011-05-19 | 2012-12-27 | Sumitomo Bakelite Co Ltd | 半導体モジュール部品及び液状封止用樹脂組成物 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264730A (en) * | 1990-01-06 | 1993-11-23 | Fujitsu Limited | Resin mold package structure of integrated circuit |
JPH06224325A (ja) | 1993-01-26 | 1994-08-12 | Matsushita Electric Works Ltd | 半導体装置 |
DE10162676B4 (de) | 2001-12-19 | 2005-06-02 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben |
JP2008205308A (ja) * | 2007-02-21 | 2008-09-04 | Sanyo Electric Co Ltd | 半導体装置 |
CN102474976B (zh) * | 2009-07-27 | 2015-05-20 | 株式会社丰田自动织机 | 布线基板以及布线基板的制造方法 |
KR101678052B1 (ko) * | 2010-02-25 | 2016-11-22 | 삼성전자 주식회사 | 단층 배선 패턴을 포함한 인쇄회로기판(pcb), pcb를 포함한 반도체 패키지, 반도체 패키지를 포함한 전기전자장치, pcb제조방법, 및 반도체 패키지 제조방법 |
JP5518000B2 (ja) | 2011-06-10 | 2014-06-11 | 三菱電機株式会社 | パワーモジュールとその製造方法 |
CN104067502B (zh) * | 2012-03-21 | 2016-08-24 | 富士电机株式会社 | 功率转换装置 |
CN104620372B (zh) * | 2012-12-28 | 2017-10-24 | 富士电机株式会社 | 半导体装置 |
JP6164364B2 (ja) * | 2014-04-01 | 2017-07-19 | 富士電機株式会社 | 半導体装置 |
JP2017022346A (ja) * | 2015-07-15 | 2017-01-26 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
US10368448B2 (en) * | 2017-11-11 | 2019-07-30 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a component carrier |
-
2017
- 2017-04-21 US US16/074,013 patent/US10615093B2/en not_active Expired - Fee Related
- 2017-04-21 DE DE112017000347.4T patent/DE112017000347B4/de active Active
- 2017-04-21 JP JP2017557016A patent/JP6301031B1/ja not_active Expired - Fee Related
- 2017-04-21 WO PCT/JP2017/016015 patent/WO2018193614A1/ja active Application Filing
- 2017-04-21 CN CN201780011070.9A patent/CN109104878B/zh not_active Expired - Fee Related
-
2018
- 2018-03-28 TW TW107110699A patent/TWI672773B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03205857A (ja) * | 1990-01-06 | 1991-09-09 | Fujitsu Ltd | 樹脂封止型電子部品 |
JP2012255147A (ja) * | 2011-05-19 | 2012-12-27 | Sumitomo Bakelite Co Ltd | 半導体モジュール部品及び液状封止用樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
DE112017000347B4 (de) | 2021-08-05 |
DE112017000347T5 (de) | 2018-12-06 |
JPWO2018193614A1 (ja) | 2019-06-27 |
TWI672773B (zh) | 2019-09-21 |
WO2018193614A1 (ja) | 2018-10-25 |
CN109104878A (zh) | 2018-12-28 |
CN109104878B (zh) | 2020-01-21 |
US20190393115A1 (en) | 2019-12-26 |
US10615093B2 (en) | 2020-04-07 |
TW201903987A (zh) | 2019-01-16 |
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