JP6300751B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6300751B2
JP6300751B2 JP2015062241A JP2015062241A JP6300751B2 JP 6300751 B2 JP6300751 B2 JP 6300751B2 JP 2015062241 A JP2015062241 A JP 2015062241A JP 2015062241 A JP2015062241 A JP 2015062241A JP 6300751 B2 JP6300751 B2 JP 6300751B2
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JP
Japan
Prior art keywords
electrode lead
semiconductor device
resin case
parallel
lead portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015062241A
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English (en)
Japanese (ja)
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JP2016181649A5 (enExample
JP2016181649A (ja
Inventor
塚本　英樹
英樹 塚本
田畑　光晴
光晴 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2015062241A priority Critical patent/JP6300751B2/ja
Priority to US14/926,805 priority patent/US9627284B2/en
Priority to DE102015222826.6A priority patent/DE102015222826B4/de
Priority to CN201610177520.9A priority patent/CN106024748B/zh
Publication of JP2016181649A publication Critical patent/JP2016181649A/ja
Publication of JP2016181649A5 publication Critical patent/JP2016181649A5/ja
Application granted granted Critical
Publication of JP6300751B2 publication Critical patent/JP6300751B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
JP2015062241A 2015-03-25 2015-03-25 半導体装置 Active JP6300751B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015062241A JP6300751B2 (ja) 2015-03-25 2015-03-25 半導体装置
US14/926,805 US9627284B2 (en) 2015-03-25 2015-10-29 Semiconductor device
DE102015222826.6A DE102015222826B4 (de) 2015-03-25 2015-11-19 Halbleitervorrichtung
CN201610177520.9A CN106024748B (zh) 2015-03-25 2016-03-25 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015062241A JP6300751B2 (ja) 2015-03-25 2015-03-25 半導体装置

Publications (3)

Publication Number Publication Date
JP2016181649A JP2016181649A (ja) 2016-10-13
JP2016181649A5 JP2016181649A5 (enExample) 2017-06-29
JP6300751B2 true JP6300751B2 (ja) 2018-03-28

Family

ID=56890275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015062241A Active JP6300751B2 (ja) 2015-03-25 2015-03-25 半導体装置

Country Status (4)

Country Link
US (1) US9627284B2 (enExample)
JP (1) JP6300751B2 (enExample)
CN (1) CN106024748B (enExample)
DE (1) DE102015222826B4 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399962B2 (ja) * 2015-04-16 2018-10-03 三菱電機株式会社 半導体装置
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
JP1585831S (enExample) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1603980S (enExample) * 2017-09-07 2018-05-14
JP1603793S (enExample) * 2017-09-29 2018-05-14
JP1632173S (enExample) * 2018-06-01 2019-05-27
JP1659675S (enExample) 2019-08-29 2020-05-18
JP1659673S (enExample) 2019-08-29 2020-05-18
JP1659677S (enExample) 2019-08-29 2020-05-18
JP1659678S (enExample) 2019-08-29 2020-05-18
JP1659716S (enExample) 2019-08-29 2020-05-18
JP1659676S (enExample) 2019-08-29 2020-05-18
JP1659674S (enExample) 2019-08-29 2020-05-18
JP1659672S (enExample) * 2019-08-29 2020-05-18
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
DE102020124149A1 (de) 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Leistungsmodul

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523620A (en) * 1994-02-14 1996-06-04 Delco Electronics Corporation Coplanar linear dual switch module
JPH0783087B2 (ja) 1994-04-19 1995-09-06 富士電機株式会社 半導体装置
JP3997730B2 (ja) * 2001-06-20 2007-10-24 株式会社日立製作所 電力変換装置及びそれを備えた移動体
JP4081611B2 (ja) 2003-11-19 2008-04-30 株式会社豊田自動織機 半導体装置
JP4566678B2 (ja) * 2004-10-04 2010-10-20 日立オートモティブシステムズ株式会社 パワーモジュール
JP4660214B2 (ja) * 2005-01-26 2011-03-30 日本インター株式会社 電力用半導体装置
JP4603956B2 (ja) * 2005-08-26 2010-12-22 日立オートモティブシステムズ株式会社 電力変換装置
JP4410241B2 (ja) * 2006-12-27 2010-02-03 三菱電機株式会社 電子制御装置
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法
EP3633723B1 (en) * 2009-05-14 2023-02-22 Rohm Co., Ltd. Semiconductor device
WO2011016360A1 (ja) * 2009-08-03 2011-02-10 株式会社安川電機 電力変換装置
JP5418668B2 (ja) * 2010-03-16 2014-02-19 富士電機株式会社 半導体装置
JP5555206B2 (ja) 2011-07-11 2014-07-23 株式会社 日立パワーデバイス 半導体パワーモジュール
CN103733333B (zh) * 2011-09-28 2017-04-12 富士电机株式会社 半导体装置以及半导体装置的制造方法
CN104303297B (zh) * 2012-05-16 2017-05-17 松下知识产权经营株式会社 电力用半导体模块
JP2014086506A (ja) * 2012-10-22 2014-05-12 Toyota Motor Corp 半導体装置

Also Published As

Publication number Publication date
US20160284618A1 (en) 2016-09-29
US9627284B2 (en) 2017-04-18
CN106024748B (zh) 2018-11-23
DE102015222826A1 (de) 2016-09-29
JP2016181649A (ja) 2016-10-13
DE102015222826B4 (de) 2021-08-12
CN106024748A (zh) 2016-10-12

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