JP1659673S - - Google Patents

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Publication number
JP1659673S
JP1659673S JPD2019-19212F JP2019019212F JP1659673S JP 1659673 S JP1659673 S JP 1659673S JP 2019019212 F JP2019019212 F JP 2019019212F JP 1659673 S JP1659673 S JP 1659673S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-19212F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-19212F priority Critical patent/JP1659673S/ja
Priority to US29/725,414 priority patent/USD934189S1/en
Application granted granted Critical
Publication of JP1659673S publication Critical patent/JP1659673S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-19212F 2019-08-29 2019-08-29 Active JP1659673S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-19212F JP1659673S (enExample) 2019-08-29 2019-08-29
US29/725,414 USD934189S1 (en) 2019-08-29 2020-02-25 Circuit board for power semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-19212F JP1659673S (enExample) 2019-08-29 2019-08-29

Publications (1)

Publication Number Publication Date
JP1659673S true JP1659673S (enExample) 2020-05-18

Family

ID=70682134

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-19212F Active JP1659673S (enExample) 2019-08-29 2019-08-29

Country Status (2)

Country Link
US (1) USD934189S1 (enExample)
JP (1) JP1659673S (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1659676S (enExample) * 2019-08-29 2020-05-18
JP1659678S (enExample) * 2019-08-29 2020-05-18
JP1659675S (enExample) * 2019-08-29 2020-05-18
JP1725943S (ja) * 2022-03-04 2022-09-29 回路基板
JP1758412S (ja) * 2023-03-28 2023-11-29 回路基板
USD1055007S1 (en) * 2024-01-31 2024-12-24 Haoyang LIU Laptop motherboard

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USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
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USD775091S1 (en) 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
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USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
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JP1551316S (enExample) 2015-09-30 2016-06-13
JP6682824B2 (ja) 2015-11-25 2020-04-15 富士電機株式会社 半導体装置
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JP1585831S (enExample) 2017-01-05 2017-09-11
JP1585830S (enExample) 2017-01-05 2017-09-11
JP1585962S (enExample) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
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TWD203975S (zh) * 2018-10-17 2020-04-11 大陸商歐品電子（昆山）有限公司 電路板（一）
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USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

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