CN106024748B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN106024748B
CN106024748B CN201610177520.9A CN201610177520A CN106024748B CN 106024748 B CN106024748 B CN 106024748B CN 201610177520 A CN201610177520 A CN 201610177520A CN 106024748 B CN106024748 B CN 106024748B
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CN
China
Prior art keywords
electrode lead
semiconductor device
resin case
parallel
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610177520.9A
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English (en)
Chinese (zh)
Other versions
CN106024748A (zh
Inventor
塚本英树
田畑光晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN106024748A publication Critical patent/CN106024748A/zh
Application granted granted Critical
Publication of CN106024748B publication Critical patent/CN106024748B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
CN201610177520.9A 2015-03-25 2016-03-25 半导体装置 Active CN106024748B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015062241A JP6300751B2 (ja) 2015-03-25 2015-03-25 半導体装置
JP2015-062241 2015-03-25

Publications (2)

Publication Number Publication Date
CN106024748A CN106024748A (zh) 2016-10-12
CN106024748B true CN106024748B (zh) 2018-11-23

Family

ID=56890275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610177520.9A Active CN106024748B (zh) 2015-03-25 2016-03-25 半导体装置

Country Status (4)

Country Link
US (1) US9627284B2 (enExample)
JP (1) JP6300751B2 (enExample)
CN (1) CN106024748B (enExample)
DE (1) DE102015222826B4 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399962B2 (ja) * 2015-04-16 2018-10-03 三菱電機株式会社 半導体装置
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1585831S (enExample) 2017-01-05 2017-09-11
JP1603980S (enExample) * 2017-09-07 2018-05-14
JP1603793S (enExample) * 2017-09-29 2018-05-14
JP1632173S (enExample) * 2018-06-01 2019-05-27
JP1659674S (enExample) 2019-08-29 2020-05-18
JP1659673S (enExample) 2019-08-29 2020-05-18
JP1659675S (enExample) 2019-08-29 2020-05-18
JP1659677S (enExample) 2019-08-29 2020-05-18
JP1659676S (enExample) 2019-08-29 2020-05-18
JP1659716S (enExample) 2019-08-29 2020-05-18
JP1659678S (enExample) 2019-08-29 2020-05-18
JP1659672S (enExample) * 2019-08-29 2020-05-18
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
DE102020124149A1 (de) 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Leistungsmodul

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1758522A (zh) * 2004-10-04 2006-04-12 株式会社日立制作所 逆变器装置以及使用它的车辆驱动装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523620A (en) * 1994-02-14 1996-06-04 Delco Electronics Corporation Coplanar linear dual switch module
JPH0783087B2 (ja) 1994-04-19 1995-09-06 富士電機株式会社 半導体装置
JP3997730B2 (ja) * 2001-06-20 2007-10-24 株式会社日立製作所 電力変換装置及びそれを備えた移動体
JP4081611B2 (ja) 2003-11-19 2008-04-30 株式会社豊田自動織機 半導体装置
JP4660214B2 (ja) * 2005-01-26 2011-03-30 日本インター株式会社 電力用半導体装置
JP4603956B2 (ja) * 2005-08-26 2010-12-22 日立オートモティブシステムズ株式会社 電力変換装置
JP4410241B2 (ja) * 2006-12-27 2010-02-03 三菱電機株式会社 電子制御装置
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法
WO2010131679A1 (ja) * 2009-05-14 2010-11-18 ローム株式会社 半導体装置
CN102484109B (zh) * 2009-08-03 2014-12-10 株式会社安川电机 电力变换装置
JP5418668B2 (ja) * 2010-03-16 2014-02-19 富士電機株式会社 半導体装置
JP5555206B2 (ja) 2011-07-11 2014-07-23 株式会社 日立パワーデバイス 半導体パワーモジュール
EP2725610B1 (en) * 2011-09-28 2020-06-03 Fuji Electric Co., Ltd. Semiconductor device and method for producing semiconductor device
CN104303297B (zh) * 2012-05-16 2017-05-17 松下知识产权经营株式会社 电力用半导体模块
JP2014086506A (ja) * 2012-10-22 2014-05-12 Toyota Motor Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1758522A (zh) * 2004-10-04 2006-04-12 株式会社日立制作所 逆变器装置以及使用它的车辆驱动装置

Also Published As

Publication number Publication date
DE102015222826A1 (de) 2016-09-29
DE102015222826B4 (de) 2021-08-12
US9627284B2 (en) 2017-04-18
CN106024748A (zh) 2016-10-12
JP2016181649A (ja) 2016-10-13
JP6300751B2 (ja) 2018-03-28
US20160284618A1 (en) 2016-09-29

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