DE102015222826B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102015222826B4
DE102015222826B4 DE102015222826.6A DE102015222826A DE102015222826B4 DE 102015222826 B4 DE102015222826 B4 DE 102015222826B4 DE 102015222826 A DE102015222826 A DE 102015222826A DE 102015222826 B4 DE102015222826 B4 DE 102015222826B4
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DE
Germany
Prior art keywords
semiconductor device
electrode connection
resin case
parallel
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102015222826.6A
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German (de)
English (en)
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DE102015222826A1 (de
Inventor
Hideki Tsukamoto
Mituharu Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of DE102015222826A1 publication Critical patent/DE102015222826A1/de
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Publication of DE102015222826B4 publication Critical patent/DE102015222826B4/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
DE102015222826.6A 2015-03-25 2015-11-19 Halbleitervorrichtung Active DE102015222826B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-062241 2015-03-25
JP2015062241A JP6300751B2 (ja) 2015-03-25 2015-03-25 半導体装置

Publications (2)

Publication Number Publication Date
DE102015222826A1 DE102015222826A1 (de) 2016-09-29
DE102015222826B4 true DE102015222826B4 (de) 2021-08-12

Family

ID=56890275

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102015222826.6A Active DE102015222826B4 (de) 2015-03-25 2015-11-19 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US9627284B2 (enExample)
JP (1) JP6300751B2 (enExample)
CN (1) CN106024748B (enExample)
DE (1) DE102015222826B4 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399962B2 (ja) * 2015-04-16 2018-10-03 三菱電機株式会社 半導体装置
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
JP1585831S (enExample) 2017-01-05 2017-09-11
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1603980S (enExample) * 2017-09-07 2018-05-14
JP1603793S (enExample) * 2017-09-29 2018-05-14
JP1632173S (enExample) * 2018-06-01 2019-05-27
JP1659675S (enExample) 2019-08-29 2020-05-18
JP1659673S (enExample) 2019-08-29 2020-05-18
JP1659677S (enExample) 2019-08-29 2020-05-18
JP1659678S (enExample) 2019-08-29 2020-05-18
JP1659716S (enExample) 2019-08-29 2020-05-18
JP1659676S (enExample) 2019-08-29 2020-05-18
JP1659674S (enExample) 2019-08-29 2020-05-18
JP1659672S (enExample) * 2019-08-29 2020-05-18
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
DE102020124149A1 (de) 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Leistungsmodul

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050104189A1 (en) 2003-11-19 2005-05-19 Koichi Akagawa Semiconductor device
JP2013021107A (ja) 2011-07-11 2013-01-31 Hitachi Ltd 半導体パワーモジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523620A (en) * 1994-02-14 1996-06-04 Delco Electronics Corporation Coplanar linear dual switch module
JPH0783087B2 (ja) 1994-04-19 1995-09-06 富士電機株式会社 半導体装置
JP3997730B2 (ja) * 2001-06-20 2007-10-24 株式会社日立製作所 電力変換装置及びそれを備えた移動体
JP4566678B2 (ja) * 2004-10-04 2010-10-20 日立オートモティブシステムズ株式会社 パワーモジュール
JP4660214B2 (ja) * 2005-01-26 2011-03-30 日本インター株式会社 電力用半導体装置
JP4603956B2 (ja) * 2005-08-26 2010-12-22 日立オートモティブシステムズ株式会社 電力変換装置
JP4410241B2 (ja) * 2006-12-27 2010-02-03 三菱電機株式会社 電子制御装置
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法
EP3633723B1 (en) * 2009-05-14 2023-02-22 Rohm Co., Ltd. Semiconductor device
WO2011016360A1 (ja) * 2009-08-03 2011-02-10 株式会社安川電機 電力変換装置
JP5418668B2 (ja) * 2010-03-16 2014-02-19 富士電機株式会社 半導体装置
CN103733333B (zh) * 2011-09-28 2017-04-12 富士电机株式会社 半导体装置以及半导体装置的制造方法
CN104303297B (zh) * 2012-05-16 2017-05-17 松下知识产权经营株式会社 电力用半导体模块
JP2014086506A (ja) * 2012-10-22 2014-05-12 Toyota Motor Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050104189A1 (en) 2003-11-19 2005-05-19 Koichi Akagawa Semiconductor device
JP2013021107A (ja) 2011-07-11 2013-01-31 Hitachi Ltd 半導体パワーモジュール

Also Published As

Publication number Publication date
US20160284618A1 (en) 2016-09-29
US9627284B2 (en) 2017-04-18
CN106024748B (zh) 2018-11-23
DE102015222826A1 (de) 2016-09-29
JP2016181649A (ja) 2016-10-13
CN106024748A (zh) 2016-10-12
JP6300751B2 (ja) 2018-03-28

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Ipc: H10W0072000000