JP6300525B2 - 焼結材料およびこれを用いた取付方法 - Google Patents
焼結材料およびこれを用いた取付方法 Download PDFInfo
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- JP6300525B2 JP6300525B2 JP2013537790A JP2013537790A JP6300525B2 JP 6300525 B2 JP6300525 B2 JP 6300525B2 JP 2013537790 A JP2013537790 A JP 2013537790A JP 2013537790 A JP2013537790 A JP 2013537790A JP 6300525 B2 JP6300525 B2 JP 6300525B2
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Classifications
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Description
1つ以上の局面は、概して、さまざまな構成要素を取付けるための方法に関し、より特定的には、このような取付けに用いられる焼結材料および技術に関する。
焼結は、従来の半田付けの代替技術として現われた。焼結には、典型的には、組立品のさまざまな構成要素を取付けるための高温および高圧処理が含まれる。
1つ以上の実施例に従うと、組成物は、約0.001マイクロメートル〜約10マイクロメートルのd50範囲を有し、約30wt%〜約95wt%のペーストを含む金属粉と、約50°C〜約170°Cの軟化点を有し、約0.1wt%〜約5wt%のペーストを含むバインダと、少なくともバインダを溶解するのに十分な量の溶剤とを含み得る。
少なくとも1つの実施例のさまざまな局面を添付の図面に関連付けて以下に説明するが、これらは縮尺通りに描かれるよう意図されたものではない。図は、さまざまな局面および実施例を例示しかつさらに理解させるために含まれるものであり、この明細書に組込まれてその一部を構成するが、本発明の限定を規定するものとして意図されたものではない。図、詳細な説明またはいずれかの請求項における技術的特徴に参照符号が付されているが、参照符号は、単に図および記載の明瞭性を高めるだけの目的で含まれている。図においては、さまざまな図に示される同一またはほぼ同一の構成要素は同様の数字で表わされる。明瞭にする目的で、すべての図においてすべての構成要素に標示がなされていない可能性がある。
1つ以上の実施例に従うと、第1の構成要素は、第2の構成要素に確実に取付けられ得る。いくつかの実施例は、従来の焼結プロセスに比べて比較的低い圧力および比較的低い温度での焼結を含み得るが、実質的に同じ結果を達成し得る。いくつかの実施例においては、電子部品が取付けられてもよい。他の実施例においては、非電子部品が取付けられてもよい。高い信頼性と適応性のあるボンド線厚とを有する高熱伝導性および高導電性ボンドが提供され得る。1つ以上の実施例は、焼結後にボンド線厚が実質的に均一になるよう促進し得る。多孔性、熱的特性および機械的特性も実質的に均一になり得る。いくつかの非限定的な実施例においては、約2ミクロン〜約100ミクロンの厚さを有するボンド線が達成され得る。広い区域および小さい区域の両方にわたってボンド線厚が制御され、かつ均一にされ得る。いくつかの実施例においては、処理中の材料の損失が少なくなる可能性があり、結果として、従来の取付けプロセスと比べて全体的に少なくとも約15%〜約20%のコスト削減となり得る。実施例はまた、資本コストをより低下させ得る。後の洗浄が不要となり得るように有機残留物も有益に低減され得る。いくつかの実施例においては、無鉛のボンドが金属間化合物なしで形成される。高歩留まりおよび高スループットの製造プロセスを可能にする1つ以上の実施例に従うと、処理の容易さも認識され得る。圧力および熱を加えるためのさまざまなプロセスが可能になり得る。1つ以上の実施例に従った焼結材料および技術により、ハイブリッド電気自動車、風力発電、および太陽電池を含む太陽光発電、輸送、産業上の利用、家電および電気通信を含むさまざまな産業界での適用可能性を見出すことができる。
図13は、100ミクロン厚のステンシルを用いてナノ銀ペーストで印刷されたリードフレームの例を示す。ステンシル厚によってボンド線厚が概ね規定され得る。印刷後、リードフレームをオーブンで130°Cで30分間乾燥させた。プロセスを例証するのに用いられる機器は、ESEC(スイス)から市販されている軟質はんだダイボンダであった。標準的な機器はピックアップアームに加熱用オプションを設けるよう変更された。図14は、リードフレームの温度が150°C未満で維持されているさまざまな区域において用いられた温度設定を示す。加熱区域1〜6における温度は、ペーストを過熱したり予焼結したりしないように150°C未満に設定された。取付けプロセスが行なわれた区域7における温度は約300°C〜約400°Cに設定され、区域8は同じ温度に設定された。印刷されたリードフレームを搭載した機械が、0.5秒〜1秒のボンディング時間をもたらすような速度で、加熱区域を通じて、これらリードフレームを割出した。図15は、ダイが取付けられたリードフレームを示す。軟質はんだボンダにおいてダイを取付けた後、リードフレームのうちのいくらかをオーブンで300°Cで約10分間熱処理(後焼結)して、リードフレームに対するダイの接着性を高めた。典型的なダイせん断力は約20MPaであった。
1つ以上の実施例に従うと、分配後にダイを取付けるためのプロセスは、ダイサイズおよび機器に応じて異なり得る。第1のプロセスにおいては、ペーストを分配し、さらに、テフロン(登録商標)パッドなどのこびりつかない表面を用いて平らにし得る。次いで、ペーストを、たとえば約130°Cで約30分にわたって乾燥させてもよい。次いで、ダイを配置し、約250°C〜300°Cの温度などで焼結し得る。第2のプロセスにおいては、ペーストを分配し、ダイを最低限の力で湿潤表面に配置し得る。次いで、ペーストを、たとえば約130°Cで約20分〜30分にわたって乾燥させ得る。次いで、ダイを配置し、約250°C〜300°Cで焼結させ得る。図18は、この第2のプロセスによって取付けられたダイを示す。第3のプロセスにおいては、ペーストを分配し、次いで、ペーストを柔らかくしておくように部分的に乾燥させ得る。いくつかの非限定的な実施例においては、部分的な乾燥を約70°Cで約5分にわたって行い得る。次いで、ダイを配置し、部分的に乾燥させた後、約250°C〜300°Cで焼結させ得る。図19は、この第3のプロセスによって取付けられたダイを示す。
ウェハ積層プロセスを行なった。裏面が銀で金属被覆された円形のシリコーンウェハをアルミニウム板に配置した。焼結膜の薄板をウェハ上に配置し、シリコーンゴムパッドを焼結膜上に配置した。次いで、シリコーンゴムパッドをテフロン(登録商標)フォイルで覆った。結果として得られる組立品を、予加熱されたプラテン(130°C)間に配置し、約1MPaの圧力を約3分間加えた。積層後のウェハおよび膜を図20Aに示す。次いで、この焼結膜の薄板を図20Bに図示のとおりウェハから取外した。膜の円形部分をシリコーンウェハに積層し、これにより、薄板上で裏当て層の一部を露出させ、焼結膜の残余部分は裏当て層に残した。積層されたウェハを図20Cに示す。次いで、積層されたウェハを約130°Cで約1時間焼成した。
1つ以上の実施例に従ってペースト状および膜状の同じ焼結材料を用いてダイを基板に焼結させた。ペーストおよび膜の両方で焼結させるためのプロセス条件は、空気中、10MPaで約250°Cであった。約40秒、60秒および80秒の焼結時間にわたってデータを収集した。ペーストおよび膜の両方を用いて形成されて結果として生じるボンドに関して、ダイのせん断力試験を行った。結果を図21に示し、両方の構成での比較結果を反映させる。
以下の機器パラメータのさまざまに組合せを用いて、小型ダイおよび大型ダイの両方について、1つ以上の実施例に従った焼結膜を用いるピック−スタンピングプロセスを行った。
ダイを、1つ以上の実施例に従って焼結膜で金基板およびDBC基板に取付けた。曲げ試験前の画像を図22Aに示し、曲げ試験後の画像を図22Bに示す。曲げ試験では、金表面およびDBC表面からのダイの分離は示されなかった。図23Aは熱衝撃前のCSAM画像を示す。図23Bは、−50°C〜165°Cでの500サイクルの液体間熱衝撃後の超音波顕微鏡画像を示す。層間剥離またはボンド劣化は示されず、ボンドが損なわれていないことが示された。
Claims (15)
- 取付けのための方法であって、
基板に組成物の層を含む膜を塗布するステップと、
前記膜上に、ポリマーおよび/または樹脂からなる保護塗膜を形成するステップと、
前記保護塗膜上にダイを配置して組立品を形成するステップと、
組立品に40MPa未満の圧力を加えるステップと、
175°C〜400°Cの温度で0.25秒〜30分にわたって組立品を焼結するステップとを含み、
前記組成物は、
0.001マイクロメートル〜10マイクロメートルのd 50 範囲を有し、ペーストの30wt%〜95wt%を構成する金属粉と、
50°C〜170°Cの軟化点を有し、ペーストの0.1wt%〜5wt%を構成するバインダと、
少なくともバインダを溶解するのに十分な量の溶剤と、
を含み、
前記ポリマーおよび/または樹脂は、前記焼結するステップ中に分解可能なものである、方法。 - 0.5MPa〜20MPaの圧力が加えられる、請求項1に記載の方法。
- 2.0MPa〜10MPaの圧力が加えられる、請求項2に記載の方法。
- 取付けのための方法であって、
ウェハの裏面に組成物の層を含む膜を塗布するステップと、
前記膜上に、ポリマーおよび/または樹脂からなる保護塗膜を形成するステップと、
ウェハをダイシングして複数のダイを形成するステップと、
基板上に少なくとも1つのダイを配置して組立品を形成するステップと、
組立品に40MPa未満の圧力を加えるステップと、
175°C〜400°Cの温度で0.25秒〜30分にわたって組立品を焼結するステップとを含み、
前記組成物は、
0.001マイクロメートル〜10マイクロメートルのd 50 範囲を有し、ペーストの30wt%〜95wt%を構成する金属粉と、
50°C〜170°Cの軟化点を有し、ペーストの0.1wt%〜5wt%を構成するバインダと、
少なくともバインダを溶解するのに十分な量の溶剤と、
を含み、
前記ポリマーおよび/または樹脂は、前記焼結するステップ中に分解可能なものである、方法。 - 2.0MPa〜10MPaの圧力が加えられる、請求項4に記載の方法。
- 取付けのための方法であって、
ダイの裏面に組成物の層を含む膜を塗布するステップと、
前記膜上に、ポリマーおよび/または樹脂からなる保護塗膜を形成するステップと、
基板上にダイを配置して組立品を形成するステップと、
組立品に40MPa未満の圧力を加えるステップと、
175°C〜400°Cの温度で0.25秒〜30分にわたって組立品を焼結するステップとを含み、
前記組成物は、
0.001マイクロメートル〜10マイクロメートルのd 50 範囲を有し、ペーストの30wt%〜95wt%を構成する金属粉と、
50°C〜170°Cの軟化点を有し、ペーストの0.1wt%〜5wt%を構成するバインダと、
少なくともバインダを溶解するのに十分な量の溶剤と、
を含み、
前記ポリマーおよび/または樹脂は、前記焼結するステップ中に分解可能なものである、方法。 - 2.0MPa〜10MPaの圧力が加えられる、請求項6に記載の方法。
- 前記金属粉は、金、パラジウム、銀、銅、アルミニウム、銀−パラジウム合金、または金−パラジウム合金を含む、請求項1、4または6に記載の方法。
- 前記金属粉は銀粒子を含む、請求項8に記載の方法。
- 前記金属粉はナノ粒子を含む、請求項8に記載の方法。
- 前記金属粉はコーティングされた金属粒子を含む、請求項1、4または6に記載の方法。
- 前記膜は、5ミクロン〜300ミクロンの乾燥厚を有する、請求項1、4または6に記載の方法。
- 前記基板は、高分子基板、ガラス基板、金属基板またはセラミック基板である、請求項1に記載の方法。
- 前記高分子基板は、ポリエステルを含む、請求項13に記載の方法。
- 前記高分子基板は、剥離コーティングを含む、請求項13に記載の方法。
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KR20210117357A (ko) | 2021-09-28 |
KR20200057116A (ko) | 2020-05-25 |
KR20190141033A (ko) | 2019-12-20 |
US10535628B2 (en) | 2020-01-14 |
CN108766891B (zh) | 2022-11-11 |
EP2636043A2 (en) | 2013-09-11 |
KR20230074824A (ko) | 2023-05-31 |
KR102305501B1 (ko) | 2021-09-27 |
EP2636043B1 (en) | 2020-09-09 |
JP2014503936A (ja) | 2014-02-13 |
US20120114927A1 (en) | 2012-05-10 |
KR102531070B1 (ko) | 2023-05-09 |
CN103262172A (zh) | 2013-08-21 |
KR20130129965A (ko) | 2013-11-29 |
KR102114489B1 (ko) | 2020-05-22 |
CN108766891A (zh) | 2018-11-06 |
EP3796336A1 (en) | 2021-03-24 |
SG10201509037SA (en) | 2015-12-30 |
SG190123A1 (en) | 2013-06-28 |
SG10201913296SA (en) | 2020-02-27 |
ES2833274T3 (es) | 2021-06-14 |
WO2012061511A3 (en) | 2012-10-26 |
CN103262172B (zh) | 2018-05-15 |
US20160225737A1 (en) | 2016-08-04 |
WO2012061511A2 (en) | 2012-05-10 |
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