SG10201913296SA - Sintering materials and attachment methods using same - Google Patents

Sintering materials and attachment methods using same

Info

Publication number
SG10201913296SA
SG10201913296SA SG10201913296SA SG10201913296SA SG10201913296SA SG 10201913296S A SG10201913296S A SG 10201913296SA SG 10201913296S A SG10201913296S A SG 10201913296SA SG 10201913296S A SG10201913296S A SG 10201913296SA SG 10201913296S A SG10201913296S A SG 10201913296SA
Authority
SG
Singapore
Prior art keywords
same
attachment methods
sintering materials
sintering
materials
Prior art date
Application number
SG10201913296SA
Other languages
English (en)
Inventor
Oscar Khaselev
Bawa Singh
Bin Mo
Michael T Marczi
Monnir Boureghda
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Publication of SG10201913296SA publication Critical patent/SG10201913296SA/en

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
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  • Spectroscopy & Molecular Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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