SG11201601437UA - Composite and multilayered silver films for joining electrical and mechanical components - Google Patents
Composite and multilayered silver films for joining electrical and mechanical componentsInfo
- Publication number
- SG11201601437UA SG11201601437UA SG11201601437UA SG11201601437UA SG11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA
- Authority
- SG
- Singapore
- Prior art keywords
- composite
- mechanical components
- silver films
- joining electrical
- multilayered silver
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/08—Reinforcements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/02—Noble metals
- B32B2311/08—Silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/2908—Plural core members being stacked
- H01L2224/29083—Three-layer arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
- Y10T428/12056—Entirely inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
- Y10T428/12076—Next to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12139—Nonmetal particles in particulate component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361871435P | 2013-08-29 | 2013-08-29 | |
PCT/US2014/053489 WO2015031801A2 (en) | 2013-08-29 | 2014-08-29 | Composite and multilayered silver films for joining electrical and mechanical components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601437UA true SG11201601437UA (en) | 2016-03-30 |
Family
ID=52587497
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601437UA SG11201601437UA (en) | 2013-08-29 | 2014-08-29 | Composite and multilayered silver films for joining electrical and mechanical components |
SG10201801481SA SG10201801481SA (en) | 2013-08-29 | 2014-08-29 | Composite and multilayered silver films for joining electrical and mechanical components |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201801481SA SG10201801481SA (en) | 2013-08-29 | 2014-08-29 | Composite and multilayered silver films for joining electrical and mechanical components |
Country Status (8)
Country | Link |
---|---|
US (2) | US10710336B2 (en) |
EP (1) | EP3038824B1 (en) |
JP (1) | JP6639394B2 (en) |
KR (2) | KR102342255B1 (en) |
CN (2) | CN105492198A (en) |
FI (1) | FI3038824T3 (en) |
SG (2) | SG11201601437UA (en) |
WO (1) | WO2015031801A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3038824B1 (en) * | 2013-08-29 | 2024-03-13 | Alpha Assembly Solutions Inc. | Multilayered silver films for joining electrical and mechanical components |
CN109317683B (en) * | 2018-10-30 | 2021-09-07 | 西安理工大学 | Preparation method of carbide-reinforced multilayer board for chute |
CN109967747B (en) * | 2019-04-03 | 2021-02-19 | 深圳第三代半导体研究院 | Multi-layer metal film and preparation method thereof |
CN109979905B (en) * | 2019-04-03 | 2021-07-30 | 深圳第三代半导体研究院 | Nano metal film prefabricated module and preparation method thereof |
CN110071050B (en) * | 2019-04-24 | 2021-09-24 | 深圳第三代半导体研究院 | Chip interconnection structure and preparation method thereof |
NL2027463B1 (en) * | 2021-01-29 | 2022-09-02 | Chip Integration Tech Centre | Integrated circuit |
TW202335556A (en) | 2022-01-20 | 2023-09-01 | 美商阿爾發金屬化工公司 | Method of joining electrical and mechanical components using laminated modular preforms |
WO2023174581A1 (en) | 2022-03-15 | 2023-09-21 | Alpha Assembly Solutions Inc. | Sinter ready multilayer wire/ribbon bond pads and method for die top attachment |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
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US4492730A (en) * | 1982-03-26 | 1985-01-08 | Showa Denko Kabushiki Kaisha | Substrate of printed circuit |
US4429344A (en) * | 1982-05-14 | 1984-01-31 | Sangamo Weston, Inc. | Conductive foils for solid dielectric capacitor |
US4761224A (en) * | 1986-03-10 | 1988-08-02 | Quantum Materials Inc. | Silver-glass paste with poly-modal flake size distribution and quick dry vehicle |
DE4111683A1 (en) * | 1991-04-10 | 1992-10-22 | Duerrwaechter E Dr Doduco | MATERIAL FOR ELECTRICAL CONTACTS MADE OF SILVER WITH CARBON |
US7625420B1 (en) * | 1997-02-24 | 2009-12-01 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
JP2002368422A (en) * | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | Multilayer ceramic board and its manufacturing method |
JP4006227B2 (en) | 2001-12-18 | 2007-11-14 | アルプス電気株式会社 | Conductive resin composition, electrode substrate using the same, and method for producing electrode substrate |
JP2003268567A (en) * | 2002-03-19 | 2003-09-25 | Hitachi Cable Ltd | Electrically conductive material-coated corrosion resistant metallic material |
WO2004026526A1 (en) * | 2002-09-18 | 2004-04-01 | Ebara Corporation | Bonding material and bonding method |
JP4635230B2 (en) * | 2005-01-20 | 2011-02-23 | 日産自動車株式会社 | Joining method and joining structure |
JP2007149522A (en) * | 2005-11-29 | 2007-06-14 | Sumitomo Metal Mining Co Ltd | Conductive resin paste composition containing silver and carbon nanotube, and semiconductor device using this |
JP2008044009A (en) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | Method of joining members having different thermal expansion coefficients |
US7887927B2 (en) * | 2007-03-09 | 2011-02-15 | Nanotek Instruments, Inc. | Highly conductive, multi-layer composite precursor composition to fuel cell flow field plate or bipolar plate |
US7763187B1 (en) | 2007-08-23 | 2010-07-27 | Oceanit Laboratories, Inc. | Carbon nanotubes-reinforced conductive silver ink |
KR101476424B1 (en) * | 2008-06-23 | 2014-12-29 | 서울반도체 주식회사 | Thermal interface material and its forming method |
WO2010057939A1 (en) | 2008-11-20 | 2010-05-27 | Ceramtec Ag | Multi-layered actuator with external electrodes made of a metallic, porous, expandable conductive layer |
DE102008055137A1 (en) | 2008-12-23 | 2010-07-01 | Robert Bosch Gmbh | Electrical or electronic composite component and method for producing an electrical or electronic composite component |
DE102009000192A1 (en) * | 2009-01-14 | 2010-07-15 | Robert Bosch Gmbh | Sintered material, sintered compound and method for producing a sintered compound |
JP5611537B2 (en) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | Conductive bonding material, bonding method using the same, and semiconductor device bonded thereby |
JP2010267579A (en) * | 2009-05-18 | 2010-11-25 | Mitsubishi Electric Corp | Conductive adhesive, method of manufacturing semiconductor device using the same, and semiconductor device |
US20100316821A1 (en) * | 2009-06-12 | 2010-12-16 | Sunny General International Co., Ltd. | Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs |
JP5580562B2 (en) * | 2009-09-09 | 2014-08-27 | 地方独立行政法人 大阪市立工業研究所 | Silver-copper mixed powder and bonding method using the same |
CN101944397A (en) * | 2010-06-29 | 2011-01-12 | 福达合金材料股份有限公司 | Silver-based ceramic electric contact material and preparation method thereof |
DE102010044329A1 (en) * | 2010-09-03 | 2012-03-08 | Heraeus Materials Technology Gmbh & Co. Kg | Contacting agent and method for contacting electrical components |
DE102010044709B4 (en) * | 2010-09-08 | 2015-07-02 | Vincotech Holdings S.à.r.l. | Power semiconductor module with metal sintered connections and manufacturing process |
EP3796336A1 (en) | 2010-11-03 | 2021-03-24 | Alpha Assembly Solutions Inc. | Sintering materials and attachment methods using same |
CN102810524B (en) * | 2011-05-31 | 2016-12-14 | 三菱综合材料株式会社 | Power model and the manufacture method of power model |
JP5966379B2 (en) * | 2011-05-31 | 2016-08-10 | 三菱マテリアル株式会社 | Power module and method for manufacturing power module |
CN102294485B (en) * | 2011-08-25 | 2013-01-30 | 哈尔滨东大高新材料股份有限公司 | Composite electric contact material and preparation method thereof |
CN103170617B (en) * | 2011-12-23 | 2016-04-27 | 比亚迪股份有限公司 | The sintering method that a kind of modification Ag cream and application thereof and power model chips are connected with matrix |
EP3038824B1 (en) * | 2013-08-29 | 2024-03-13 | Alpha Assembly Solutions Inc. | Multilayered silver films for joining electrical and mechanical components |
-
2014
- 2014-08-29 EP EP14841100.2A patent/EP3038824B1/en active Active
- 2014-08-29 US US14/915,067 patent/US10710336B2/en active Active
- 2014-08-29 FI FIEP14841100.2T patent/FI3038824T3/en active
- 2014-08-29 CN CN201480047357.3A patent/CN105492198A/en active Pending
- 2014-08-29 JP JP2016537908A patent/JP6639394B2/en active Active
- 2014-08-29 KR KR1020167005409A patent/KR102342255B1/en active IP Right Grant
- 2014-08-29 SG SG11201601437UA patent/SG11201601437UA/en unknown
- 2014-08-29 SG SG10201801481SA patent/SG10201801481SA/en unknown
- 2014-08-29 KR KR1020217041415A patent/KR20210157914A/en not_active Application Discontinuation
- 2014-08-29 CN CN202211402403.XA patent/CN115610041A/en active Pending
- 2014-08-29 WO PCT/US2014/053489 patent/WO2015031801A2/en active Application Filing
-
2020
- 2020-07-13 US US16/927,444 patent/US11390054B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2015031801A2 (en) | 2015-03-05 |
KR20160048797A (en) | 2016-05-04 |
EP3038824A4 (en) | 2017-05-10 |
SG10201801481SA (en) | 2018-04-27 |
US20160207286A1 (en) | 2016-07-21 |
JP6639394B2 (en) | 2020-02-05 |
US11390054B2 (en) | 2022-07-19 |
CN115610041A (en) | 2023-01-17 |
US10710336B2 (en) | 2020-07-14 |
US20200338859A1 (en) | 2020-10-29 |
JP2016536461A (en) | 2016-11-24 |
FI3038824T3 (en) | 2024-04-04 |
CN105492198A (en) | 2016-04-13 |
EP3038824B1 (en) | 2024-03-13 |
KR20210157914A (en) | 2021-12-29 |
WO2015031801A3 (en) | 2015-11-19 |
EP3038824A2 (en) | 2016-07-06 |
KR102342255B1 (en) | 2021-12-21 |
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