SG11201601437UA - Composite and multilayered silver films for joining electrical and mechanical components - Google Patents

Composite and multilayered silver films for joining electrical and mechanical components

Info

Publication number
SG11201601437UA
SG11201601437UA SG11201601437UA SG11201601437UA SG11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA SG 11201601437U A SG11201601437U A SG 11201601437UA
Authority
SG
Singapore
Prior art keywords
composite
mechanical components
silver films
joining electrical
multilayered silver
Prior art date
Application number
SG11201601437UA
Inventor
Oscar Khaselev
Bin Mo
Monnir Boureghda
Michael T Marczi
Bawa Singh
Original Assignee
Alpha Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals filed Critical Alpha Metals
Publication of SG11201601437UA publication Critical patent/SG11201601437UA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C49/00Alloys containing metallic or non-metallic fibres or filaments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/08Reinforcements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/30Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/02Noble metals
    • B32B2311/08Silver
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612Auxiliary members for layer connectors, e.g. spacers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29075Plural core members
    • H01L2224/29076Plural core members being mutually engaged together, e.g. through inserts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29075Plural core members
    • H01L2224/2908Plural core members being stacked
    • H01L2224/29083Three-layer arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8384Sintering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049Nonmetal component
    • Y10T428/12056Entirely inorganic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • Y10T428/12069Plural nonparticulate metal components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • Y10T428/12069Plural nonparticulate metal components
    • Y10T428/12076Next to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063Nonparticulate metal component
    • Y10T428/12139Nonmetal particles in particulate component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
SG11201601437UA 2013-08-29 2014-08-29 Composite and multilayered silver films for joining electrical and mechanical components SG11201601437UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361871435P 2013-08-29 2013-08-29
PCT/US2014/053489 WO2015031801A2 (en) 2013-08-29 2014-08-29 Composite and multilayered silver films for joining electrical and mechanical components

Publications (1)

Publication Number Publication Date
SG11201601437UA true SG11201601437UA (en) 2016-03-30

Family

ID=52587497

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201601437UA SG11201601437UA (en) 2013-08-29 2014-08-29 Composite and multilayered silver films for joining electrical and mechanical components
SG10201801481SA SG10201801481SA (en) 2013-08-29 2014-08-29 Composite and multilayered silver films for joining electrical and mechanical components

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201801481SA SG10201801481SA (en) 2013-08-29 2014-08-29 Composite and multilayered silver films for joining electrical and mechanical components

Country Status (8)

Country Link
US (2) US10710336B2 (en)
EP (1) EP3038824B1 (en)
JP (1) JP6639394B2 (en)
KR (2) KR102342255B1 (en)
CN (2) CN105492198A (en)
FI (1) FI3038824T3 (en)
SG (2) SG11201601437UA (en)
WO (1) WO2015031801A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3038824B1 (en) * 2013-08-29 2024-03-13 Alpha Assembly Solutions Inc. Multilayered silver films for joining electrical and mechanical components
CN109317683B (en) * 2018-10-30 2021-09-07 西安理工大学 Preparation method of carbide-reinforced multilayer board for chute
CN109967747B (en) * 2019-04-03 2021-02-19 深圳第三代半导体研究院 Multi-layer metal film and preparation method thereof
CN109979905B (en) * 2019-04-03 2021-07-30 深圳第三代半导体研究院 Nano metal film prefabricated module and preparation method thereof
CN110071050B (en) * 2019-04-24 2021-09-24 深圳第三代半导体研究院 Chip interconnection structure and preparation method thereof
NL2027463B1 (en) * 2021-01-29 2022-09-02 Chip Integration Tech Centre Integrated circuit
TW202335556A (en) 2022-01-20 2023-09-01 美商阿爾發金屬化工公司 Method of joining electrical and mechanical components using laminated modular preforms
WO2023174581A1 (en) 2022-03-15 2023-09-21 Alpha Assembly Solutions Inc. Sinter ready multilayer wire/ribbon bond pads and method for die top attachment

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
US4429344A (en) * 1982-05-14 1984-01-31 Sangamo Weston, Inc. Conductive foils for solid dielectric capacitor
US4761224A (en) * 1986-03-10 1988-08-02 Quantum Materials Inc. Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
DE4111683A1 (en) * 1991-04-10 1992-10-22 Duerrwaechter E Dr Doduco MATERIAL FOR ELECTRICAL CONTACTS MADE OF SILVER WITH CARBON
US7625420B1 (en) * 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
JP2002368422A (en) * 2001-04-04 2002-12-20 Murata Mfg Co Ltd Multilayer ceramic board and its manufacturing method
JP4006227B2 (en) 2001-12-18 2007-11-14 アルプス電気株式会社 Conductive resin composition, electrode substrate using the same, and method for producing electrode substrate
JP2003268567A (en) * 2002-03-19 2003-09-25 Hitachi Cable Ltd Electrically conductive material-coated corrosion resistant metallic material
WO2004026526A1 (en) * 2002-09-18 2004-04-01 Ebara Corporation Bonding material and bonding method
JP4635230B2 (en) * 2005-01-20 2011-02-23 日産自動車株式会社 Joining method and joining structure
JP2007149522A (en) * 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd Conductive resin paste composition containing silver and carbon nanotube, and semiconductor device using this
JP2008044009A (en) * 2006-07-19 2008-02-28 Honda Motor Co Ltd Method of joining members having different thermal expansion coefficients
US7887927B2 (en) * 2007-03-09 2011-02-15 Nanotek Instruments, Inc. Highly conductive, multi-layer composite precursor composition to fuel cell flow field plate or bipolar plate
US7763187B1 (en) 2007-08-23 2010-07-27 Oceanit Laboratories, Inc. Carbon nanotubes-reinforced conductive silver ink
KR101476424B1 (en) * 2008-06-23 2014-12-29 서울반도체 주식회사 Thermal interface material and its forming method
WO2010057939A1 (en) 2008-11-20 2010-05-27 Ceramtec Ag Multi-layered actuator with external electrodes made of a metallic, porous, expandable conductive layer
DE102008055137A1 (en) 2008-12-23 2010-07-01 Robert Bosch Gmbh Electrical or electronic composite component and method for producing an electrical or electronic composite component
DE102009000192A1 (en) * 2009-01-14 2010-07-15 Robert Bosch Gmbh Sintered material, sintered compound and method for producing a sintered compound
JP5611537B2 (en) * 2009-04-28 2014-10-22 日立化成株式会社 Conductive bonding material, bonding method using the same, and semiconductor device bonded thereby
JP2010267579A (en) * 2009-05-18 2010-11-25 Mitsubishi Electric Corp Conductive adhesive, method of manufacturing semiconductor device using the same, and semiconductor device
US20100316821A1 (en) * 2009-06-12 2010-12-16 Sunny General International Co., Ltd. Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs
JP5580562B2 (en) * 2009-09-09 2014-08-27 地方独立行政法人 大阪市立工業研究所 Silver-copper mixed powder and bonding method using the same
CN101944397A (en) * 2010-06-29 2011-01-12 福达合金材料股份有限公司 Silver-based ceramic electric contact material and preparation method thereof
DE102010044329A1 (en) * 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Contacting agent and method for contacting electrical components
DE102010044709B4 (en) * 2010-09-08 2015-07-02 Vincotech Holdings S.à.r.l. Power semiconductor module with metal sintered connections and manufacturing process
EP3796336A1 (en) 2010-11-03 2021-03-24 Alpha Assembly Solutions Inc. Sintering materials and attachment methods using same
CN102810524B (en) * 2011-05-31 2016-12-14 三菱综合材料株式会社 Power model and the manufacture method of power model
JP5966379B2 (en) * 2011-05-31 2016-08-10 三菱マテリアル株式会社 Power module and method for manufacturing power module
CN102294485B (en) * 2011-08-25 2013-01-30 哈尔滨东大高新材料股份有限公司 Composite electric contact material and preparation method thereof
CN103170617B (en) * 2011-12-23 2016-04-27 比亚迪股份有限公司 The sintering method that a kind of modification Ag cream and application thereof and power model chips are connected with matrix
EP3038824B1 (en) * 2013-08-29 2024-03-13 Alpha Assembly Solutions Inc. Multilayered silver films for joining electrical and mechanical components

Also Published As

Publication number Publication date
WO2015031801A2 (en) 2015-03-05
KR20160048797A (en) 2016-05-04
EP3038824A4 (en) 2017-05-10
SG10201801481SA (en) 2018-04-27
US20160207286A1 (en) 2016-07-21
JP6639394B2 (en) 2020-02-05
US11390054B2 (en) 2022-07-19
CN115610041A (en) 2023-01-17
US10710336B2 (en) 2020-07-14
US20200338859A1 (en) 2020-10-29
JP2016536461A (en) 2016-11-24
FI3038824T3 (en) 2024-04-04
CN105492198A (en) 2016-04-13
EP3038824B1 (en) 2024-03-13
KR20210157914A (en) 2021-12-29
WO2015031801A3 (en) 2015-11-19
EP3038824A2 (en) 2016-07-06
KR102342255B1 (en) 2021-12-21

Similar Documents

Publication Publication Date Title
EP2962835A4 (en) Lamination method and laminate
SG11201601437UA (en) Composite and multilayered silver films for joining electrical and mechanical components
EP3045489A4 (en) Thermoplastic prepreg and laminate
EP2993042A4 (en) Heat-shrinkable multilayer film
EP3088181A4 (en) Multilayered film and method for manufacturing same
EP3027409C0 (en) Multilayer film with enhanced interlayer adhesion
EP2999594A4 (en) Multi-layer barrier adhesive film
ZA201509146B (en) Aluminium composite material having an internal solder layer
EP3045308A4 (en) Metal/resin composite structure
EP3034301A4 (en) Multilayer structure
EP2991105A4 (en) Composite laminate and electronic device
SG11201604642YA (en) Transparent conductive multilayer assembly
EP2966042A4 (en) Bismuth-vanadate-laminate manufacturing method and bismuth-vanadate laminate
EP2943336A4 (en) Triaxial fiber-reinforced composite laminate
GB2510133B (en) Conductive bonded composites
EP2970611A4 (en) Thermoplastic composite
EP3007211A4 (en) Electronic member peeling method and laminated body
HK1207466A1 (en) Composite resin and electronic device
EP2985147A4 (en) Scratch-resistant matte laminating film and manufacturing method therefor
EP2998109A4 (en) Multilayer composite interior component
EP2969564A4 (en) Multilayer composite
EP2963079A4 (en) Film, and manufacturing method therefor, composite, film laminate, and etching method
EP2993041A4 (en) Heat-shrinkable multilayer film
EP2969328A4 (en) High performance thermoplastic composite laminates and composite structures made therefrom
EP3083234A4 (en) Multilayer composite article