IN168174B - - Google Patents

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Publication number
IN168174B
IN168174B IN195/CAL/87A IN195CA1987A IN168174B IN 168174 B IN168174 B IN 168174B IN 195CA1987 A IN195CA1987 A IN 195CA1987A IN 168174 B IN168174 B IN 168174B
Authority
IN
India
Application number
IN195/CAL/87A
Other languages
English (en)
Inventor
Herbert Dr Schwarzbauer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN168174B publication Critical patent/IN168174B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S148/00—Metal treatment
    • Y10S148/012—Bonding, e.g. electrostatic for strain gauges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/054—Flat sheets-substrates
IN195/CAL/87A 1986-04-22 1987-03-10 IN168174B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3613572 1986-04-22

Publications (1)

Publication Number Publication Date
IN168174B true IN168174B (ja) 1991-02-16

Family

ID=6299247

Family Applications (1)

Application Number Title Priority Date Filing Date
IN195/CAL/87A IN168174B (ja) 1986-04-22 1987-03-10

Country Status (6)

Country Link
US (1) US4810672A (ja)
EP (1) EP0242626B1 (ja)
JP (1) JP2515708B2 (ja)
BR (1) BR8701876A (ja)
DE (1) DE3770683D1 (ja)
IN (1) IN168174B (ja)

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EP0460286A3 (en) * 1990-06-06 1992-02-26 Siemens Aktiengesellschaft Method and arrangement for bonding a semiconductor component to a substrate or for finishing a semiconductor/substrate connection by contactless pressing
EP0477600A1 (de) * 1990-09-26 1992-04-01 Siemens Aktiengesellschaft Verfahren zum Befestigen eines mit wenigstens einem Halbleiterbauelement versehenen Halbleiterkörpers auf einem Substrat
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BR8701876A (pt) 1988-01-26
JP2515708B2 (ja) 1996-07-10
JPS62254439A (ja) 1987-11-06
EP0242626A2 (de) 1987-10-28
EP0242626A3 (en) 1989-01-25
DE3770683D1 (de) 1991-07-18
US4810672A (en) 1989-03-07
EP0242626B1 (de) 1991-06-12

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