JP6296793B2 - エピタキシャル構造、その形成方法、および、それを含むデバイス - Google Patents

エピタキシャル構造、その形成方法、および、それを含むデバイス Download PDF

Info

Publication number
JP6296793B2
JP6296793B2 JP2013503882A JP2013503882A JP6296793B2 JP 6296793 B2 JP6296793 B2 JP 6296793B2 JP 2013503882 A JP2013503882 A JP 2013503882A JP 2013503882 A JP2013503882 A JP 2013503882A JP 6296793 B2 JP6296793 B2 JP 6296793B2
Authority
JP
Japan
Prior art keywords
poly
film
ink
substrate
silane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013503882A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013524537A (ja
JP2013524537A5 (https=
Inventor
ロッケンバーガー、イエルク
チェルシェ、ファビオ
真穂 高島
真穂 高島
Original Assignee
シン フィルム エレクトロニクス エーエスエー
シン フィルム エレクトロニクス エーエスエー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シン フィルム エレクトロニクス エーエスエー, シン フィルム エレクトロニクス エーエスエー filed Critical シン フィルム エレクトロニクス エーエスエー
Publication of JP2013524537A publication Critical patent/JP2013524537A/ja
Publication of JP2013524537A5 publication Critical patent/JP2013524537A5/ja
Application granted granted Critical
Publication of JP6296793B2 publication Critical patent/JP6296793B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/14Photovoltaic cells having only PN homojunction potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • H10F77/311Coatings for devices having potential barriers for photovoltaic cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/265Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2924Structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2924Structures
    • H10P14/2925Surface structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242Structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3451Structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
    • H10P14/3602In-situ cleaning
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/16Diffusion of dopants within, into or out of semiconductor bodies or layers between a solid phase and a liquid phase
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Chemical & Material Sciences (AREA)
  • Thin Film Transistor (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
JP2013503882A 2010-04-06 2011-04-06 エピタキシャル構造、その形成方法、および、それを含むデバイス Active JP6296793B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32145810P 2010-04-06 2010-04-06
US61/321,458 2010-04-06
PCT/US2011/031392 WO2011127147A1 (en) 2010-04-06 2011-04-06 Epitaxial structures, methods of forming the same, and devices including the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016257028A Division JP2017085146A (ja) 2010-04-06 2016-12-28 エピタキシャル構造、その形成方法、および、それを含むデバイス

Publications (3)

Publication Number Publication Date
JP2013524537A JP2013524537A (ja) 2013-06-17
JP2013524537A5 JP2013524537A5 (https=) 2017-11-24
JP6296793B2 true JP6296793B2 (ja) 2018-03-20

Family

ID=44708589

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013503882A Active JP6296793B2 (ja) 2010-04-06 2011-04-06 エピタキシャル構造、その形成方法、および、それを含むデバイス
JP2016257028A Pending JP2017085146A (ja) 2010-04-06 2016-12-28 エピタキシャル構造、その形成方法、および、それを含むデバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016257028A Pending JP2017085146A (ja) 2010-04-06 2016-12-28 エピタキシャル構造、その形成方法、および、それを含むデバイス

Country Status (7)

Country Link
US (1) US8900915B2 (https=)
EP (1) EP2556539A4 (https=)
JP (2) JP6296793B2 (https=)
KR (1) KR20130038829A (https=)
CN (1) CN102822985B (https=)
TW (1) TWI559372B (https=)
WO (1) WO2011127147A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017085146A (ja) * 2010-04-06 2017-05-18 シン フィルム エレクトロニクス エーエスエー エピタキシャル構造、その形成方法、および、それを含むデバイス

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8815104B2 (en) 2008-03-21 2014-08-26 Alliance For Sustainable Energy, Llc Copper-assisted, anti-reflection etching of silicon surfaces
GB0809721D0 (en) * 2008-05-28 2008-07-02 Univ Bath Improvements in or relating to joints and/or implants
US8518170B2 (en) 2008-12-29 2013-08-27 Honeywell International Inc. Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks
US8828765B2 (en) * 2010-06-09 2014-09-09 Alliance For Sustainable Energy, Llc Forming high efficiency silicon solar cells using density-graded anti-reflection surfaces
DE102010024309A1 (de) * 2010-06-18 2011-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer photovoltaischen Solarzelle
KR20120064364A (ko) * 2010-12-09 2012-06-19 삼성전자주식회사 태양 전지의 제조 방법
JP5677469B2 (ja) * 2011-01-27 2015-02-25 京セラ株式会社 太陽電池素子の製造方法、太陽電池素子、および太陽電池モジュール
US10011920B2 (en) 2011-02-23 2018-07-03 International Business Machines Corporation Low-temperature selective epitaxial growth of silicon for device integration
US11251318B2 (en) 2011-03-08 2022-02-15 Alliance For Sustainable Energy, Llc Efficient black silicon photovoltaic devices with enhanced blue response
US20120312361A1 (en) * 2011-06-08 2012-12-13 International Business Machines Corporation Emitter structure and fabrication method for silicon heterojunction solar cell
US8871620B2 (en) * 2011-07-28 2014-10-28 International Business Machines Corporation III-V photovoltaic elements
US8629294B2 (en) 2011-08-25 2014-01-14 Honeywell International Inc. Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants
US8852989B2 (en) * 2011-10-27 2014-10-07 Intermolecular, Inc. Back-contact for thin film solar cells optimized for light trapping for ultrathin absorbers
US8975170B2 (en) 2011-10-24 2015-03-10 Honeywell International Inc. Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions
US20150056743A1 (en) * 2012-03-12 2015-02-26 Mitsubishi Electric Corporation Manufacturing method of solar cell
WO2013141561A1 (ko) * 2012-03-19 2013-09-26 서울옵토디바이스주식회사 에피층과 성장 기판 분리 방법 및 이를 이용한 반도체 소자
CN103367525B (zh) * 2012-03-30 2016-12-14 清华大学 太阳能电池的制备方法
CN103367477A (zh) * 2012-03-30 2013-10-23 清华大学 太阳能电池
US9508887B2 (en) 2012-10-25 2016-11-29 Tetrasun, Inc. Methods of forming solar cells
US9059212B2 (en) 2012-10-31 2015-06-16 International Business Machines Corporation Back-end transistors with highly doped low-temperature contacts
US8912071B2 (en) 2012-12-06 2014-12-16 International Business Machines Corporation Selective emitter photovoltaic device
US8642378B1 (en) 2012-12-18 2014-02-04 International Business Machines Corporation Field-effect inter-digitated back contact photovoltaic device
BR112015015027A2 (pt) 2012-12-20 2017-07-11 3M Innovative Properties Co impressão de múltiplas tintas para conseguir registro de precisão durante processamento subsequente
NL2010713C2 (en) * 2013-04-26 2014-10-29 Univ Delft Tech Method of forming silicon on a substrate.
DE102013219603A1 (de) * 2013-09-27 2015-04-02 International Solar Energy Research Center Konstanz E.V. Verfahren zur Herstellung einer Solarzelle
DE102014208054A1 (de) * 2014-04-29 2015-10-29 Evonik Degussa Gmbh Verfahren zur Erzeugung unterschiedlich dotierter Halbleiter
KR102399443B1 (ko) * 2014-06-20 2022-05-19 쓰리엠 이노베이티브 프로퍼티즈 캄파니 후속 처리 동안 정밀 정합을 달성하기 위한 다수의 잉크들의 인쇄
WO2016001454A1 (es) * 2014-06-30 2016-01-07 Oxolutia, S. L. Método de fabricación de láminas delgadas de óxidos epitaxiales mediante impresión de chorro de tinta
DE102014223465A1 (de) * 2014-11-18 2016-05-19 Evonik Degussa Gmbh Verfahren zur Erzeugung von dotierten, polykristallinen Halbleiterschichten
US9997397B2 (en) * 2015-02-13 2018-06-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and manufacturing method thereof
US9673341B2 (en) 2015-05-08 2017-06-06 Tetrasun, Inc. Photovoltaic devices with fine-line metallization and methods for manufacture
JP6564874B2 (ja) * 2015-11-04 2019-08-21 株式会社カネカ 結晶シリコン系太陽電池の製造方法および結晶シリコン系太陽電池モジュールの製造方法
US9453190B1 (en) 2015-11-12 2016-09-27 International Business Machines Corporation Surface treatment of textured silicon
KR101959378B1 (ko) * 2016-08-26 2019-03-19 한국과학기술연구원 3족-5족 화합물 반도체 소자 제조 방법 및 그 반도체 소자
KR102599917B1 (ko) * 2016-10-05 2023-11-09 신에쓰 가가꾸 고교 가부시끼가이샤 고광전변환효율 태양전지의 제조방법 및 고광전변환효율 태양전지
CN109983586B (zh) 2016-11-03 2024-03-12 道达尔销售服务公司 太阳能电池的表面处理
US10043970B2 (en) 2016-12-15 2018-08-07 Taiwan Semiconductor Manufacturing Co., Ltd. Determining a characteristic of a monitored layer on an integrated chip
DE102017118899B4 (de) 2016-12-15 2020-06-18 Taiwan Semiconductor Manufacturing Co. Ltd. Dichtungsringstrukturen und Verfahren zu ihrer Herstellung
US10453832B2 (en) 2016-12-15 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Seal ring structures and methods of forming same
US10163974B2 (en) 2017-05-17 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming absorption enhancement structure for image sensor
US10438980B2 (en) * 2017-05-31 2019-10-08 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor with a high absorption layer
WO2018232698A1 (zh) * 2017-06-22 2018-12-27 深圳市柔宇科技有限公司 阵列基板的制作设备及阵列基板的制作方法
US10559563B2 (en) 2017-06-26 2020-02-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing monolithic three-dimensional (3D) integrated circuits
US11404270B2 (en) 2018-11-30 2022-08-02 Texas Instruments Incorporated Microelectronic device substrate formed by additive process
US10910465B2 (en) 2018-12-28 2021-02-02 Texas Instruments Incorporated 3D printed semiconductor package
US10861715B2 (en) 2018-12-28 2020-12-08 Texas Instruments Incorporated 3D printed semiconductor package
WO2020159854A1 (en) * 2019-01-28 2020-08-06 Tokyo Electron Limited Photo-assisted chemical vapor etch for selective removal of ruthenium
TWI705572B (zh) * 2019-07-03 2020-09-21 太極能源科技股份有限公司 具有氮氧化矽鈍化層的太陽電池及其製造方法
TWI725583B (zh) * 2019-10-22 2021-04-21 國立勤益科技大學 可撓式可見光檢測器
US11189565B2 (en) 2020-02-19 2021-11-30 Nanya Technology Corporation Semiconductor device with programmable anti-fuse feature and method for fabricating the same
US20220157604A1 (en) * 2020-11-16 2022-05-19 Applied Materials, Inc. Apparatus, systems, and methods of using atomic hydrogen radicals with selective epitaxial deposition
TWI768801B (zh) * 2021-03-31 2022-06-21 世界先進積體電路股份有限公司 半導體結構及其製作方法
US12027413B2 (en) 2021-08-22 2024-07-02 Vanguard International Semiconductor Corporation Semiconductor structure and method of fabricating the same
WO2023140840A1 (en) * 2022-01-20 2023-07-27 Applied Materials, Inc. Methods for near surface work function engineering
CN115513309B (zh) * 2022-08-31 2025-04-04 隆基绿能科技股份有限公司 背接触太阳能电池及其制备方法
CN116606166B (zh) * 2023-04-26 2024-05-24 贵州省紫安新材料科技有限公司 一种快速制备碳化硅非晶涂层的方法
JP7501766B1 (ja) 2023-10-03 2024-06-18 信越半導体株式会社 エピタキシャル基板上への塗布膜形成方法及び接合型ウェーハの製造方法
WO2025221932A1 (en) * 2024-04-19 2025-10-23 Lam Research Corporation Remote plasma-based deposition
CN119967912B (zh) * 2025-04-08 2025-07-22 金阳(泉州)新能源科技有限公司 背接触电池及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893218A (ja) * 1981-11-30 1983-06-02 Toshiba Corp 半導体薄膜構造の製造方法
JP4092541B2 (ja) * 2000-12-08 2008-05-28 ソニー株式会社 半導体薄膜の形成方法及び半導体装置の製造方法
JP2002314115A (ja) * 2001-04-13 2002-10-25 Daido Steel Co Ltd 太陽電池セル
JP2004134440A (ja) * 2002-10-08 2004-04-30 Okutekku:Kk シリコン膜の形態学的変化法
US7540920B2 (en) 2002-10-18 2009-06-02 Applied Materials, Inc. Silicon-containing layer deposition with silicon compounds
US7879696B2 (en) 2003-07-08 2011-02-01 Kovio, Inc. Compositions and methods for forming a semiconducting and/or silicon-containing film, and structures formed therefrom
US7498015B1 (en) 2004-02-27 2009-03-03 Kovio, Inc. Method of making silane compositions
JP2006012913A (ja) * 2004-06-22 2006-01-12 Sharp Corp 太陽電池セルの製造方法
US7314513B1 (en) * 2004-09-24 2008-01-01 Kovio, Inc. Methods of forming a doped semiconductor thin film, doped semiconductor thin film structures, doped silane compositions, and methods of making such compositions
US7674926B1 (en) 2004-10-01 2010-03-09 Kovio, Inc. Dopant group-substituted semiconductor precursor compounds, compositions containing the same, and methods of making such compounds and compositions
US7485691B1 (en) 2004-10-08 2009-02-03 Kovio, Inc Polysilane compositions, methods for their synthesis and films formed therefrom
US8461628B2 (en) * 2005-03-18 2013-06-11 Kovio, Inc. MOS transistor with laser-patterned metal gate, and method for making the same
US7619248B1 (en) 2005-03-18 2009-11-17 Kovio, Inc. MOS transistor with self-aligned source and drain, and method for making the same
KR101506136B1 (ko) 2006-10-24 2015-03-26 다우 코닝 코포레이션 네오펜타실란을 포함하는 조성물 및 이의 제조 방법
US7776724B2 (en) 2006-12-07 2010-08-17 Innovalight, Inc. Methods of filling a set of interstitial spaces of a nanoparticle thin film with a dielectric material
WO2008076744A1 (en) * 2006-12-13 2008-06-26 Innovalight, Inc. Methods of forming an epitaxial layer on a group iv semiconductor substrate
EP1936698A1 (en) * 2006-12-18 2008-06-25 BP Solar Espana, S.A. Unipersonal Process for manufacturing photovoltaic cells
US7718707B2 (en) 2006-12-21 2010-05-18 Innovalight, Inc. Method for preparing nanoparticle thin films
EP2140483A1 (en) 2007-04-04 2010-01-06 Innovalight, Inc. Methods for optimizing thin film formation with reactive gases
US8530589B2 (en) 2007-05-04 2013-09-10 Kovio, Inc. Print processing for patterned conductor, semiconductor and dielectric materials
KR20090029494A (ko) * 2007-09-18 2009-03-23 엘지전자 주식회사 비정질 실리콘 및 나노 결정질 실리콘의 복합 박막을이용한 태양전지 및 그 제조방법
JP2011503910A (ja) * 2007-11-19 2011-01-27 アプライド マテリアルズ インコーポレイテッド パターン付きエッチング剤を用いた太陽電池コンタクト形成プロセス
US20090242019A1 (en) * 2007-12-19 2009-10-01 Silexos, Inc Method to create high efficiency, low cost polysilicon or microcrystalline solar cell on flexible substrates using multilayer high speed inkjet printing and, rapid annealing and light trapping
US7851336B2 (en) 2008-03-13 2010-12-14 Innovalight, Inc. Method of forming a passivated densified nanoparticle thin film on a substrate
US8361834B2 (en) 2008-03-18 2013-01-29 Innovalight, Inc. Methods of forming a low resistance silicon-metal contact
US7704866B2 (en) 2008-03-18 2010-04-27 Innovalight, Inc. Methods for forming composite nanoparticle-metal metallization contacts on a substrate
CN102047389B (zh) * 2008-04-25 2013-06-19 英诺瓦莱特公司 使用ⅳ族纳米颗粒在晶片基底上形成结区
US7897489B2 (en) 2008-06-17 2011-03-01 Innovalight, Inc. Selective activation of hydrogen passivated silicon and germanium surfaces
KR20110046439A (ko) * 2008-07-24 2011-05-04 코비오 인코포레이티드 알루미늄 잉크 및 이의 제조 방법, 알루미늄 잉크 증착 방법 및 알루미늄 잉크의 인쇄 및/또는 증착에 의해 형성된 필름
US7615393B1 (en) 2008-10-29 2009-11-10 Innovalight, Inc. Methods of forming multi-doped junctions on a substrate
US8420517B2 (en) 2009-07-02 2013-04-16 Innovalight, Inc. Methods of forming a multi-doped junction with silicon-containing particles
US20110003466A1 (en) 2009-07-02 2011-01-06 Innovalight, Inc. Methods of forming a multi-doped junction with porous silicon
US8138070B2 (en) 2009-07-02 2012-03-20 Innovalight, Inc. Methods of using a set of silicon nanoparticle fluids to control in situ a set of dopant diffusion profiles
TWI559372B (zh) * 2010-04-06 2016-11-21 薄膜電子Asa公司 磊晶結構、其形成方法及含此結構之元件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017085146A (ja) * 2010-04-06 2017-05-18 シン フィルム エレクトロニクス エーエスエー エピタキシャル構造、その形成方法、および、それを含むデバイス

Also Published As

Publication number Publication date
TWI559372B (zh) 2016-11-21
EP2556539A4 (en) 2014-08-06
WO2011127147A1 (en) 2011-10-13
CN102822985B (zh) 2016-08-03
US8900915B2 (en) 2014-12-02
TW201203320A (en) 2012-01-16
US20110240997A1 (en) 2011-10-06
JP2017085146A (ja) 2017-05-18
EP2556539A1 (en) 2013-02-13
JP2013524537A (ja) 2013-06-17
CN102822985A (zh) 2012-12-12
KR20130038829A (ko) 2013-04-18

Similar Documents

Publication Publication Date Title
JP6296793B2 (ja) エピタキシャル構造、その形成方法、および、それを含むデバイス
CA2701412C (en) Profile engineered thin film devices and structures
CN1199241C (zh) 硅膜成形方法
CN107658212B (zh) 半导体层叠体、半导体装置,以及它们的制造方法
JP4075308B2 (ja) 薄膜トランジスタの製造方法
KR100676341B1 (ko) 실란 조성물, 실리콘막의 형성법 및 태양 전지의 제조법
US20130105806A1 (en) Structures incorporating silicon nanoparticle inks, densified silicon materials from nanoparticle silicon deposits and corresponding methods
JPWO2000059014A1 (ja) シリコン膜形成方法およびインクジェット用インク組成物
JPWO2000059041A1 (ja) 薄膜トランジスタの製造方法
US8962459B2 (en) Diffusion sources from liquid precursors
WO2007020833A1 (ja) マスキングペースト、その製造方法およびマスキングペーストを用いた太陽電池の製造方法
CN104813482B (zh) 用于cigs光伏器件的钼基材
US20150249164A1 (en) Method of forming functional coatings on silicon substrates
CN102347391B (zh) 晶圆型太阳能电池及其制造方法
WO2014044923A1 (en) A method of passivating a silicon substrate for use in a photovoltaic device
CN102959126B (zh) 得自含硅烷的配制品的硅层的改性
KR20170085079A (ko) 도핑된 다결정 반도체 층들을 제조하기 위한 방법
HK1191447A (en) Semiconductor laminate, semiconductor device, and production method thereof
HK1186295A (en) Semiconductor laminate, semiconductor device, method for producing semiconductor laminate, and method for manufacturing semiconductor device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140328

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20150323

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160223

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160830

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161228

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20170112

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20170331

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20171010

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180220

R150 Certificate of patent or registration of utility model

Ref document number: 6296793

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250