JP6279598B2 - 銅めっき浴組成物 - Google Patents

銅めっき浴組成物 Download PDF

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Publication number
JP6279598B2
JP6279598B2 JP2015543389A JP2015543389A JP6279598B2 JP 6279598 B2 JP6279598 B2 JP 6279598B2 JP 2015543389 A JP2015543389 A JP 2015543389A JP 2015543389 A JP2015543389 A JP 2015543389A JP 6279598 B2 JP6279598 B2 JP 6279598B2
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Japan
Prior art keywords
aqueous acidic
electroplating bath
group
copper electroplating
acidic copper
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JP2015543389A
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English (en)
Japanese (ja)
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JP2016503461A (ja
JP2016503461A5 (enExample
Inventor
ブルナー ハイコ
ブルナー ハイコ
レルフス ベアント
レルフス ベアント
ヴィチャク アグニエシュカ
ヴィチャク アグニエシュカ
コールマン ラース
コールマン ラース
マン オリヴィエ
マン オリヴィエ
オーデ クリスティアン
オーデ クリスティアン
バンゲアター ティモ
バンゲアター ティモ
フェッロ アンゲロ
フェッロ アンゲロ
キアプス アンドレアス
キアプス アンドレアス
シュメーケル アンドレ
シュメーケル アンドレ
ローデ ディアク
ローデ ディアク
アッカーマン シュテファニー
アッカーマン シュテファニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
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Publication of JP2016503461A publication Critical patent/JP2016503461A/ja
Publication of JP2016503461A5 publication Critical patent/JP2016503461A5/ja
Application granted granted Critical
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2015543389A 2012-11-26 2013-11-12 銅めっき浴組成物 Active JP6279598B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12194261.9 2012-11-26
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition
PCT/EP2013/073629 WO2014079737A2 (en) 2012-11-26 2013-11-12 Copper plating bath composition

Publications (3)

Publication Number Publication Date
JP2016503461A JP2016503461A (ja) 2016-02-04
JP2016503461A5 JP2016503461A5 (enExample) 2016-11-04
JP6279598B2 true JP6279598B2 (ja) 2018-02-14

Family

ID=47226032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015543389A Active JP6279598B2 (ja) 2012-11-26 2013-11-12 銅めっき浴組成物

Country Status (8)

Country Link
US (1) US9551080B2 (enExample)
EP (2) EP2735627A1 (enExample)
JP (1) JP6279598B2 (enExample)
KR (1) KR102193485B1 (enExample)
CN (1) CN104854265B (enExample)
PH (1) PH12015501137B1 (enExample)
TW (1) TWI600802B (enExample)
WO (1) WO2014079737A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
ES2639300T3 (es) * 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
WO2016169952A1 (en) 2015-04-20 2016-10-27 Atotech Deutschland Gmbh Electrolytic copper plating bath compositions and a method for their use
TWI662161B (zh) * 2015-08-31 2019-06-11 德商德國艾托特克公司 水性銅電鍍浴及沉積銅或銅合金於基板上之方法
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
TWI713737B (zh) 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
WO2018033461A1 (en) 2016-08-15 2018-02-22 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
PT3508620T (pt) 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN118812171A (zh) * 2023-04-17 2024-10-22 财团法人工业技术研究院 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
DE4126502C1 (enExample) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6800188B2 (en) 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
CN1410601A (zh) 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
KR100598994B1 (ko) 2002-12-25 2006-07-07 닛코킨조쿠 가부시키가이샤 특정골격을 갖는 4급아민화합물 중합체 및 유기유황화합물을 첨가제로서 포함하는 동전해액 및 그것에 의하여 제조되는 전해동박
KR100729061B1 (ko) 2003-07-29 2007-06-14 닛코킨조쿠 가부시키가이샤 특정골격을 갖는 디알킬아미노기 함유 중합체 및 유기유황화합물을 첨가제로서 포함하는 구리전해액 및 이것에 의해제조되는 전해구리박
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
DE102005060030A1 (de) * 2005-12-15 2007-06-21 Coventya Gmbh Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung
EP2292679B1 (de) 2009-09-08 2020-03-11 ATOTECH Deutschland GmbH Polymere mit Aminoendgruppen und deren Verwendung als Additive für galvanische Zink- und Zinklegierungsbäder
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

Also Published As

Publication number Publication date
TWI600802B (zh) 2017-10-01
CN104854265A (zh) 2015-08-19
EP2922985A2 (en) 2015-09-30
US9551080B2 (en) 2017-01-24
WO2014079737A3 (en) 2014-09-12
CN104854265B (zh) 2017-08-08
WO2014079737A2 (en) 2014-05-30
JP2016503461A (ja) 2016-02-04
EP2922985B1 (en) 2016-09-14
US20150299883A1 (en) 2015-10-22
PH12015501137A1 (en) 2015-08-03
EP2735627A1 (en) 2014-05-28
PH12015501137B1 (en) 2015-08-03
TW201422854A (zh) 2014-06-16
KR20150088307A (ko) 2015-07-31
KR102193485B1 (ko) 2020-12-22

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