JP2016503461A5 - - Google Patents

Download PDF

Info

Publication number
JP2016503461A5
JP2016503461A5 JP2015543389A JP2015543389A JP2016503461A5 JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5 JP 2015543389 A JP2015543389 A JP 2015543389A JP 2015543389 A JP2015543389 A JP 2015543389A JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5
Authority
JP
Japan
Prior art keywords
general formula
iii
ureylene
polymers according
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015543389A
Other languages
English (en)
Japanese (ja)
Other versions
JP6279598B2 (ja
JP2016503461A (ja
Filing date
Publication date
Priority claimed from EP12194261.9A external-priority patent/EP2735627A1/en
Application filed filed Critical
Publication of JP2016503461A publication Critical patent/JP2016503461A/ja
Publication of JP2016503461A5 publication Critical patent/JP2016503461A5/ja
Application granted granted Critical
Publication of JP6279598B2 publication Critical patent/JP6279598B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015543389A 2012-11-26 2013-11-12 銅めっき浴組成物 Active JP6279598B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12194261.9 2012-11-26
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition
PCT/EP2013/073629 WO2014079737A2 (en) 2012-11-26 2013-11-12 Copper plating bath composition

Publications (3)

Publication Number Publication Date
JP2016503461A JP2016503461A (ja) 2016-02-04
JP2016503461A5 true JP2016503461A5 (enExample) 2016-11-04
JP6279598B2 JP6279598B2 (ja) 2018-02-14

Family

ID=47226032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015543389A Active JP6279598B2 (ja) 2012-11-26 2013-11-12 銅めっき浴組成物

Country Status (8)

Country Link
US (1) US9551080B2 (enExample)
EP (2) EP2735627A1 (enExample)
JP (1) JP6279598B2 (enExample)
KR (1) KR102193485B1 (enExample)
CN (1) CN104854265B (enExample)
PH (1) PH12015501137B1 (enExample)
TW (1) TWI600802B (enExample)
WO (1) WO2014079737A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
ES2639300T3 (es) * 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
CN107771227B (zh) * 2015-04-20 2019-04-02 埃托特克德国有限公司 电解铜镀液组合物及其用法
EP3344800B1 (en) * 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
EP3135709B1 (en) * 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3141633B1 (en) 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
EP3452635B1 (en) 2016-05-04 2020-02-26 ATOTECH Deutschland GmbH Process for depositing a metal or metal alloy on a surface of a substrate including its activation
CN109790638B (zh) 2016-08-15 2021-06-18 德国艾托特克公司 用于电解镀铜的酸性水性组合物
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
PT3508620T (pt) 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN118812171A (zh) * 2023-04-17 2024-10-22 财团法人工业技术研究院 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
DE4126502C1 (enExample) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
WO2002090623A1 (fr) 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
CN1410601A (zh) 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
EP1607495A4 (en) 2002-12-25 2006-07-12 Nikko Materials Co Ltd COPPER ELECTROLYTE SOLUTION CONTAINS A QUINTERNATIVE AMINO-BONDED POLYMER COMPRISING A PARTICULAR SCAFFOLD AND ORGANIC SULFUR COMPOUND AS ADDITIONS AND ELECTROLYTIC COPPER FOIL MANUFACTURED THEREWITH
WO2005010239A1 (ja) 2003-07-29 2005-02-03 Nikko Materials Co., Ltd. 特定骨格を有するジアルキルアミノ基含有重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
DE602005022650D1 (de) * 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
DE102005060030A1 (de) * 2005-12-15 2007-06-21 Coventya Gmbh Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung
ES2788080T3 (es) * 2009-09-08 2020-10-20 Atotech Deutschland Gmbh Polímeros con grupos terminales amino y su uso como aditivos para baños galvanoplásticos de zinc y de aleaciones de zinc
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

Similar Documents

Publication Publication Date Title
BR112015027321A2 (pt) composições e métodos
ATE547129T1 (de) Multimodale formgedächtnis-polymere
MX392371B (es) Polimeros con procesabilidad mejorado para aplicaciones de tuberias.
JP2015158628A5 (enExample)
JP2016536436A5 (enExample)
AR060751A1 (es) Polimeros de condensacion de aminas como secuestrantes de fosfatos
JP2015530475A5 (enExample)
CN109641831A (zh) 单体、聚合物、制备方法及其用途
JP2015063604A5 (enExample)
JP2015193834A5 (enExample)
JP2008308572A5 (enExample)
JP2016094578A5 (enExample)
JP2017115098A5 (enExample)
CN109791980A (zh) 共轭聚合物及其在有机电子器件的应用
TH171952A (th) โพลีเอททิลีนความหนาแน่นสูง
JP2015044795A5 (ja) トリフルオロフェニル誘導体
TH124514B (th) คลิปหนีบ
TH140448S (th) อุปกรณ์ยึดขั้นบันได
RU2015136955A (ru) Мономер для получения поликонденсационных полимеров
Komov et al. Territorial organization of building sector of Mordovia republic
TH163113A (th) พอลิเมอร์ที่ดัดแปรด้วยอะมิโนซิเลน
TH47997S1 (th) อุปกรณ์ล็อค
TH91399B (th) โต๊ะนักเรียน
TH117921S (th) แผ่นรองพื้น
TH91398B (th) โต๊ะนักเรียน