JP2016503461A5 - - Google Patents

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JP2016503461A5
JP2016503461A5 JP2015543389A JP2015543389A JP2016503461A5 JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5 JP 2015543389 A JP2015543389 A JP 2015543389A JP 2015543389 A JP2015543389 A JP 2015543389A JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5
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Japan
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general formula
iii
ureylene
polymers according
unit
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JP2015543389A
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JP6279598B2 (ja
JP2016503461A (ja
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Priority claimed from EP12194261.9A external-priority patent/EP2735627A1/en
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一般式（Ｘ）および（ＸＩ）による前記２つの中間体ウレイレンポリマーは、一般式（ＩＩ）または（ＩＩＩ）によるウレイレンポリマーを得るために、さらに一般式（ＶＩ）による化合物と反応させる。一般式（ＩＩ）または（ＩＩＩ）によるウレイレンポリマーは、両端にアミノ基を有する単位Ａ’（一般式（ＩＩ）によるポリマー）、またはポリマー鎖の１つの端に単位Ａ’、別の端に単位Ａ（一般式（ＩＩＩ）によるポリマー）を含んでおり、有機的に結合したハロゲン、例えば、Ｃ−Ｃｌ部分を含んでいない。
JP2015543389A 2012-11-26 2013-11-12 銅めっき浴組成物 Active JP6279598B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12194261.9 2012-11-26
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition
PCT/EP2013/073629 WO2014079737A2 (en) 2012-11-26 2013-11-12 Copper plating bath composition

Publications (3)

Publication Number Publication Date
JP2016503461A JP2016503461A (ja) 2016-02-04
JP2016503461A5 true JP2016503461A5 (ja) 2016-11-04
JP6279598B2 JP6279598B2 (ja) 2018-02-14

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ID=47226032

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JP2015543389A Active JP6279598B2 (ja) 2012-11-26 2013-11-12 銅めっき浴組成物

Country Status (8)

Country Link
US (1) US9551080B2 (ja)
EP (2) EP2735627A1 (ja)
JP (1) JP6279598B2 (ja)
KR (1) KR102193485B1 (ja)
CN (1) CN104854265B (ja)
PH (1) PH12015501137A1 (ja)
TW (1) TWI600802B (ja)
WO (1) WO2014079737A2 (ja)

Families Citing this family (17)

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Publication number Priority date Publication date Assignee Title
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
ES2639300T3 (es) * 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
WO2016169952A1 (en) 2015-04-20 2016-10-27 Atotech Deutschland Gmbh Electrolytic copper plating bath compositions and a method for their use
JP6790075B2 (ja) * 2015-08-31 2020-11-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 水性銅めっき浴および基板上での銅または銅合金の析出方法
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
TWI713737B (zh) 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물

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DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
DE4126502C1 (ja) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
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DE102005060030A1 (de) * 2005-12-15 2007-06-21 Coventya Gmbh Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung
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EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

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