TWI600802B - 銅鍍浴組合物 - Google Patents

銅鍍浴組合物 Download PDF

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Publication number
TWI600802B
TWI600802B TW102140324A TW102140324A TWI600802B TW I600802 B TWI600802 B TW I600802B TW 102140324 A TW102140324 A TW 102140324A TW 102140324 A TW102140324 A TW 102140324A TW I600802 B TWI600802 B TW I600802B
Authority
TW
Taiwan
Prior art keywords
plating bath
group
aqueous solution
copper plating
acid
Prior art date
Application number
TW102140324A
Other languages
English (en)
Chinese (zh)
Other versions
TW201422854A (zh
Inventor
赫卡 布魯諾
柏德 羅福斯
阿格尼斯卡 薇札克
拉斯 可爾曼
奧莉維爾 曼
克里斯汀 歐德
提摩 班格特
安傑魯 費羅
安卓亞斯 克柏斯
安卓亞 史卡摩克
迪爾克 羅德
史蒂芬妮 阿克曼
Original Assignee
德國艾托特克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德國艾托特克公司 filed Critical 德國艾托特克公司
Publication of TW201422854A publication Critical patent/TW201422854A/zh
Application granted granted Critical
Publication of TWI600802B publication Critical patent/TWI600802B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW102140324A 2012-11-26 2013-11-06 銅鍍浴組合物 TWI600802B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition

Publications (2)

Publication Number Publication Date
TW201422854A TW201422854A (zh) 2014-06-16
TWI600802B true TWI600802B (zh) 2017-10-01

Family

ID=47226032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102140324A TWI600802B (zh) 2012-11-26 2013-11-06 銅鍍浴組合物

Country Status (8)

Country Link
US (1) US9551080B2 (enExample)
EP (2) EP2735627A1 (enExample)
JP (1) JP6279598B2 (enExample)
KR (1) KR102193485B1 (enExample)
CN (1) CN104854265B (enExample)
PH (1) PH12015501137A1 (enExample)
TW (1) TWI600802B (enExample)
WO (1) WO2014079737A2 (enExample)

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* Cited by examiner, † Cited by third party
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EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
EP3034650B1 (en) * 2014-12-16 2017-06-21 ATOTECH Deutschland GmbH Plating bath compositions for electroless plating of metals and metal alloys
KR102426521B1 (ko) * 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
EP3135709B1 (en) * 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
JP6790075B2 (ja) * 2015-08-31 2020-11-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 水性銅めっき浴および基板上での銅または銅合金の析出方法
EP3141633B1 (en) 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
TWI713737B (zh) 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
CN109790638B (zh) 2016-08-15 2021-06-18 德国艾托特克公司 用于电解镀铜的酸性水性组合物
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN118812171A (zh) * 2023-04-17 2024-10-22 财团法人工业技术研究院 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040187731A1 (en) * 1999-07-15 2004-09-30 Wang Qing Min Acid copper electroplating solutions
CN102482417A (zh) * 2009-09-08 2012-05-30 阿托特德国有限公司 具有末端氨基的聚合物及其作为锌及锌合金电沉积浴的添加剂的应用

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DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
DE4126502C1 (enExample) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
JP4392168B2 (ja) 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
CN1410601A (zh) 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
EP1607495A4 (en) 2002-12-25 2006-07-12 Nikko Materials Co Ltd COPPER ELECTROLYTE SOLUTION CONTAINS A QUINTERNATIVE AMINO-BONDED POLYMER COMPRISING A PARTICULAR SCAFFOLD AND ORGANIC SULFUR COMPOUND AS ADDITIONS AND ELECTROLYTIC COPPER FOIL MANUFACTURED THEREWITH
CN1806067B (zh) 2003-07-29 2010-06-16 日矿金属株式会社 含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
DE102005060030A1 (de) * 2005-12-15 2007-06-21 Coventya Gmbh Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040187731A1 (en) * 1999-07-15 2004-09-30 Wang Qing Min Acid copper electroplating solutions
CN102482417A (zh) * 2009-09-08 2012-05-30 阿托特德国有限公司 具有末端氨基的聚合物及其作为锌及锌合金电沉积浴的添加剂的应用

Also Published As

Publication number Publication date
EP2735627A1 (en) 2014-05-28
US20150299883A1 (en) 2015-10-22
JP6279598B2 (ja) 2018-02-14
JP2016503461A (ja) 2016-02-04
KR20150088307A (ko) 2015-07-31
CN104854265A (zh) 2015-08-19
PH12015501137B1 (en) 2015-08-03
US9551080B2 (en) 2017-01-24
WO2014079737A3 (en) 2014-09-12
CN104854265B (zh) 2017-08-08
KR102193485B1 (ko) 2020-12-22
PH12015501137A1 (en) 2015-08-03
EP2922985B1 (en) 2016-09-14
WO2014079737A2 (en) 2014-05-30
EP2922985A2 (en) 2015-09-30
TW201422854A (zh) 2014-06-16

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