JP6242665B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6242665B2
JP6242665B2 JP2013232448A JP2013232448A JP6242665B2 JP 6242665 B2 JP6242665 B2 JP 6242665B2 JP 2013232448 A JP2013232448 A JP 2013232448A JP 2013232448 A JP2013232448 A JP 2013232448A JP 6242665 B2 JP6242665 B2 JP 6242665B2
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Prior art keywords
semiconductor chip
conductive
protruding electrode
adhesive layer
relay substrate
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JP2013232448A
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Japanese (ja)
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JP2015095489A (ja
JP2015095489A5 (https=
Inventor
浩児 原
浩児 原
義博 井原
義博 井原
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2013232448A priority Critical patent/JP6242665B2/ja
Priority to US14/517,993 priority patent/US9508670B2/en
Publication of JP2015095489A publication Critical patent/JP2015095489A/ja
Publication of JP2015095489A5 publication Critical patent/JP2015095489A5/ja
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
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JP2013232448A 2013-11-08 2013-11-08 半導体装置 Active JP6242665B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013232448A JP6242665B2 (ja) 2013-11-08 2013-11-08 半導体装置
US14/517,993 US9508670B2 (en) 2013-11-08 2014-10-20 Semiconductor device including semiconductor chips stacked via relay substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013232448A JP6242665B2 (ja) 2013-11-08 2013-11-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2015095489A JP2015095489A (ja) 2015-05-18
JP2015095489A5 JP2015095489A5 (https=) 2016-09-23
JP6242665B2 true JP6242665B2 (ja) 2017-12-06

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JP2013232448A Active JP6242665B2 (ja) 2013-11-08 2013-11-08 半導体装置

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JP (1) JP6242665B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10229887B2 (en) * 2016-03-31 2019-03-12 Intel Corporation Systems and methods for electromagnetic interference shielding
CN110914982A (zh) * 2017-02-10 2020-03-24 微芯片技术股份有限公司 背面偏置式半导体管芯的接地技术以及相关的设备、系统和方法
JP2018137342A (ja) * 2017-02-22 2018-08-30 株式会社村田製作所 半導体装置及びその製造方法
JP7230419B2 (ja) * 2018-10-16 2023-03-01 富士電機株式会社 半導体装置、半導体装置の製造方法
KR20240003596A (ko) * 2022-07-01 2024-01-09 현대자동차주식회사 파워 모듈

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