JP6224444B2 - 樹脂組成物、熱伝導性硬化物、ケイ素化合物、シランカップリング剤組成物及び担持体 - Google Patents
樹脂組成物、熱伝導性硬化物、ケイ素化合物、シランカップリング剤組成物及び担持体 Download PDFInfo
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- JP6224444B2 JP6224444B2 JP2013249861A JP2013249861A JP6224444B2 JP 6224444 B2 JP6224444 B2 JP 6224444B2 JP 2013249861 A JP2013249861 A JP 2013249861A JP 2013249861 A JP2013249861 A JP 2013249861A JP 6224444 B2 JP6224444 B2 JP 6224444B2
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- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 claims description 7
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
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Description
[実施例1]化合物No.19の合成
ビフェニル−4−カルボン酸(5.0mmol、1.0g、東京化成工業社製)、O−(ベンゾトリアゾール−1−イル)−N,N,N’,N’−テトラメチルウロニウムヘキサフルオロホスファート(5.0mmol、1.9g)、及びジメチルホルムアミド(10.0ml)をフラスコに仕込み、40℃で0.5時間撹拌した。その後、N,N−ジイソプロピルエチルアミン(10.0mmol、1.3g)及び3−アミノプロピルトリエトキシシラン(5.0mmol、1.12g)を加えて、さらに2時間撹拌した。反応液に水(5ml)及びクロロホルム(5ml)を加え、油水分液を行った。得られた有機層をカラムクロマトグラフィー(移動相:ヘキサン/酢酸エチル=3/1(質量比))により精製することで、白色の固体1.49g(収率74%)を得た。得られた固体が化合物No.19であることを、UV−VIS(λmax)及び1H−NMR(重溶媒:CDCl3)を用いて確認した。収率及び外観観察結果を表1に示した。また、1H−NMRの結果を表2に示した。
実施例1で用いたビフェニル−4−カルボン酸を、目的とする化合物に対応した構造を有するカルボン酸に変更したこと以外は、実施例1と同様の方法により化合物No.1、10、20、24、28、37、43及び46を合成した。合成した化合物が目的化合物であることをUV−VIS(λmax)及び1H−NMR(重溶媒:CDCl3)を用いて確認した。収率及び外観観察結果を表1に示した。また、1H−NMRの結果を表2に示した。
目的化合物に対応した構造を有するカルボン酸化合物及びアミン化合物を用いたこと以外は、実施例1と同様の方法により化合物No.88を合成した。合成した化合物が目的化合物であることをUV−VIS(λmax)及び1H−NMR(重溶媒:CDCl3)を用いて確認した。収率及び外観観察結果を表1に示した。また、1H−NMRの結果を表2に示した。
[実施例10]担持体No.1の製造
100mlのナスフラスコに窒化アルミニウムフィラー(トクヤマ社製、Hグレード、球状、粒径:1μm)10.0gを秤量し、ここに化合物No.19を50.0mg及びトルエン50mlを加え、超音波処理を30分行った。その後、50℃の真空加熱処理により溶媒を蒸発させた。さらに100℃の真空加熱処理を2時間行い、窒化アルミニウムフィラーの表面に化合物No.19を固定化させることで担持体No.1を得た。
実施例10で用いた化合物No.19を、化合物No.1、10、20、24、28、37、43及び46にそれぞれ変更したこと以外は、実施例10と同様の方法により担持体No.2〜9を得た。
実施例10で用いた窒化アルミニウムフィラーを、混合フィラー(窒化アルミニウムフィラー(トクヤマ社製、Hグレード、球状、粒径:1μm)0.83g、酸化アルミニウムフィラー(電気化学工業社製、DAW−20、球状、粒径:20μm)5.50g、酸化アルミニウムフィラー(電気化学工業社製、DAW−03、球状、粒径:3μm)1.38g、及び酸化アルミニウムフィラー(昭和電工社製、AL−47−1、破砕状、粒径:1μm)2.29g)に変更したこと、及び化合物No.19を化合物No.20、24及び43にそれぞれ変更したこと以外は、実施例10と同様の方法により担持体No.10〜12を得た。
実施例10で用いた化合物No.19を化合物No.88に変更したこと以外は、実施例10と同様の方法により担持体No.13を得た。
実施例10で用いた化合物No.19を、以下に示す式(C−1)〜(C−3)で表される比較化合物1〜3にそれぞれ変更したこと以外は、実施例10と同様の方法により比
較担持体1〜3を得た。
[評価例1]固定化量の確認
担持体No.1にトルエン50mlを加えて30分間撹拌した後、30分間静置し、固体を完全に沈降させることで分析用サンプル1を得た。分析用サンプル1の上澄み液を1ml分取し、トルエンで25倍に希釈することで分析用サンプル2を得た。分析用サンプル2をUV−VIS測定することで、分析用サンプル2中の化合物No.19のモル濃度を算出した。そして、下記計算式1より、担持体No.1に固定化されている化合物No.19の固定化量を算出した。その結果、担持体No.1は、窒化アルミニウムフィラー10gの表面に、化合物No.19が31.6mg(6.7×10-5mol)固定化されたものであることが分かった。
S1=S2−(C×25×化合物No.19の分子量×L)
S1:担持体No.1に固定化されている化合物No.19の固定化量(g)
S2:担持体No.1を製造する際に使用した化合物No.19の量(g)
L:上澄み液の全容積(l)
C:分析用サンプル2中の化合物No.19のモル濃度(mol/l)
[実施例22〜34]樹脂組成物No.1〜13の製造
担持体No.1〜13(50g)に、ビフェニルアラルキル型エポキシ樹脂(商品名「NC−3000H」、日本化薬社製)7g及びビフェニルアラルキル型フェノール樹脂(商品名「MEH−7851H」、明和化成社製)3.5gをメチルエチルケトン10.5gに溶解した溶液、並びにイミダゾール系硬化剤(商品名「2PHZ−PW」、四国化成工業社製)0.1gを加え、3本ロールミルを使用して分散させることで、樹脂組成物No.1〜13を得た。
50gの(i)窒化アルミニウムフィラー(トクヤマ社製、Hグレード、球状、粒径:1μm)、(ii)混合フィラー(窒化アルミニウムフィラー(トクヤマ社製、Hグレード、球状、粒径:1μm)0.83g、酸化アルミニウムフィラー(電気化学工業社製、DAW−20、球状、粒径:20μm)5.50g、酸化アルミニウムフィラー(電気化学工業社製、DAW−03、球状、粒径:3μm)1.38g、及び酸化アルミニウムフィラー(昭和電工社製、AL−47−1、破砕状、粒径:1μm)2.29g)、又は(iii)比較担持体1〜3に、ビフェニルアラルキル型エポキシ樹脂(商品名「NC−3000H」、日本化薬社製)7g及びビフェニルアラルキル型フェノール樹脂(商品名「MEH−7851H」、明和化成社製)3.5gをメチルエチルケトン10.5gに溶解した溶液、並びにイミダゾール系硬化剤(商品名「2PHZ−PW」、四国化成工業社製)0.1gを加えた。そして、3本ロールミルを使用して分散させることで、比較樹脂組成物1〜5を得た。
[実施例35〜47]硬化物No.1〜13の製造
樹脂組成物No.1〜13をバーコーター法によりPETフィルムに100μmの厚さで塗布し、100℃で10分間加熱することで乾燥させた。さらに、190℃で90分間加熱して硬化させた後、PETフィルムを剥離して、シート状の熱伝導性硬化物である硬化物No.1〜13を製造した。
比較樹脂組成物1〜5をバーコーター法によりPETフィルムに100μmの厚さで塗布し、100℃で10分間加熱することで乾燥させた。さらに、190℃で90分間加熱して硬化させた後、PETフィルムを剥離して、シート状の熱伝導性硬化物である比較硬化物1〜5を製造した。
[評価例2]熱伝導性の評価
硬化物No.1〜13及び比較硬化物1〜5について、熱拡散率・熱伝導率測定装置(商品名「ai−Phase Mobile」、アイフェイズ社製)を使用、周期加熱法によって熱拡散率を測定した。結果を表6に示す。
Claims (5)
- シランカップリング剤組成物を担持した担持体を含有し、
前記シランカップリング剤組成物が、下記一般式(1)で表されるケイ素化合物を含有する樹脂組成物。
(前記一般式(1)中、R1は、それぞれ独立に炭素原子数1〜3の直鎖又は分岐状のアルキル基を表し、A1は単結合又は炭素原子数1〜4のアルカンジイル基を表し、Yは水素原子、炭素原子数1〜12の直鎖若しくは分岐状のアルキル基、炭素原子数1〜12の直鎖若しくは分岐状のオキシアルキル基、ジメチルアミノ基、ジエチルアミノ基、又はエチルメチルアミノ基を表す。Xは下記式(X−1)〜(X−6)のいずれかで表される基を表し、Xが下記式(X−1)で表される基である場合のZは−NHCO−であり、Xが下記式(X−2)〜(X−6)のいずれかで表される基である場合のZは単結合又は−NHCO−である)
- 請求項1に記載の樹脂組成物を硬化させて得られる熱伝導性硬化物。
- 請求項3に記載のケイ素化合物を含有するシランカップリング剤組成物。
- 請求項4に記載のシランカップリング剤組成物を担持した担持体。
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CN201480066236.3A CN105793361A (zh) | 2013-12-03 | 2014-11-27 | 树脂组合物、导热性固化物、硅化合物、硅烷偶联剂组合物和负载体 |
KR1020167017617A KR20160094407A (ko) | 2013-12-03 | 2014-11-27 | 수지 조성물, 열전도성 경화물, 규소화합물, 실란 커플링제 조성물 및 담지체 |
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