JP6221250B2 - 積層コイル部品 - Google Patents
積層コイル部品 Download PDFInfo
- Publication number
- JP6221250B2 JP6221250B2 JP2013025845A JP2013025845A JP6221250B2 JP 6221250 B2 JP6221250 B2 JP 6221250B2 JP 2013025845 A JP2013025845 A JP 2013025845A JP 2013025845 A JP2013025845 A JP 2013025845A JP 6221250 B2 JP6221250 B2 JP 6221250B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- pair
- corner
- virtual rectangle
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 260
- 239000012212 insulator Substances 0.000 claims description 138
- 238000010030 laminating Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 9
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- 229910007573 Zn-Mg Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013025845A JP6221250B2 (ja) | 2013-02-13 | 2013-02-13 | 積層コイル部品 |
KR20130167150A KR101483935B1 (ko) | 2013-02-13 | 2013-12-30 | 적층 코일 부품 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013025845A JP6221250B2 (ja) | 2013-02-13 | 2013-02-13 | 積層コイル部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014154839A JP2014154839A (ja) | 2014-08-25 |
JP6221250B2 true JP6221250B2 (ja) | 2017-11-01 |
Family
ID=51576363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013025845A Active JP6221250B2 (ja) | 2013-02-13 | 2013-02-13 | 積層コイル部品 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6221250B2 (ko) |
KR (1) | KR101483935B1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6197829B2 (ja) * | 2015-05-30 | 2017-09-20 | 株式会社村田製作所 | 表面実装インダクタ |
CN208722717U (zh) * | 2015-12-25 | 2019-04-09 | 株式会社村田制作所 | 低矮电感器 |
JP6828555B2 (ja) | 2017-03-29 | 2021-02-10 | Tdk株式会社 | コイル部品およびその製造方法 |
JP6780589B2 (ja) * | 2017-06-02 | 2020-11-04 | 株式会社村田製作所 | 電子部品 |
JP7238622B2 (ja) * | 2019-06-21 | 2023-03-14 | Tdk株式会社 | 積層コイル部品 |
JP7373930B2 (ja) | 2019-06-28 | 2023-11-06 | 太陽誘電株式会社 | 積層コイル部品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3941508B2 (ja) * | 2001-02-19 | 2007-07-04 | 株式会社村田製作所 | 積層型インピーダンス素子 |
JP2003017327A (ja) | 2001-06-29 | 2003-01-17 | Fdk Corp | 積層インダクタ |
JP2004303776A (ja) | 2003-03-28 | 2004-10-28 | Mitsubishi Materials Corp | 積層型コモンモードチョークコイル及びその製造方法 |
JP4895193B2 (ja) | 2006-11-24 | 2012-03-14 | Fdk株式会社 | 積層インダクタ |
JP5093210B2 (ja) * | 2009-10-20 | 2012-12-12 | Tdk株式会社 | コイル部品及びその製造方法 |
JP5240221B2 (ja) * | 2010-03-25 | 2013-07-17 | Tdk株式会社 | 積層型インダクタ、及び積層型インダクタの製造方法 |
CN102939634B (zh) * | 2010-06-09 | 2015-10-07 | 株式会社村田制作所 | 电子元件及其制造方法 |
JP5707988B2 (ja) * | 2011-02-04 | 2015-04-30 | 株式会社村田製作所 | コイル内蔵基板およびそれを備えたdc−dcコンバータモジュール |
-
2013
- 2013-02-13 JP JP2013025845A patent/JP6221250B2/ja active Active
- 2013-12-30 KR KR20130167150A patent/KR101483935B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101483935B1 (ko) | 2015-01-19 |
KR20140102120A (ko) | 2014-08-21 |
JP2014154839A (ja) | 2014-08-25 |
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