JP6216519B2 - 粘着性組成物、粘着剤および粘着シート - Google Patents

粘着性組成物、粘着剤および粘着シート Download PDF

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JP6216519B2
JP6216519B2 JP2013041769A JP2013041769A JP6216519B2 JP 6216519 B2 JP6216519 B2 JP 6216519B2 JP 2013041769 A JP2013041769 A JP 2013041769A JP 2013041769 A JP2013041769 A JP 2013041769A JP 6216519 B2 JP6216519 B2 JP 6216519B2
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pressure
sensitive adhesive
meth
monomer
adhesive
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JP2014169382A (ja
Inventor
祐樹 小澤
祐樹 小澤
仁 又野
仁 又野
隆行 荒井
隆行 荒井
所司　悟
悟 所司
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Lintec Corp
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Lintec Corp
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Priority to JP2013041769A priority Critical patent/JP6216519B2/ja
Priority to KR1020140020094A priority patent/KR102314962B1/ko
Priority to TW103106696A priority patent/TWI628250B/zh
Priority to CN201710583306.8A priority patent/CN107216837B/zh
Priority to CN201410075584.9A priority patent/CN104031582B/zh
Publication of JP2014169382A publication Critical patent/JP2014169382A/ja
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Publication of JP6216519B2 publication Critical patent/JP6216519B2/ja
Priority to KR1020210116182A priority patent/KR20210112281A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/205—Compounds containing groups, e.g. carbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2013041769A 2013-03-04 2013-03-04 粘着性組成物、粘着剤および粘着シート Active JP6216519B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013041769A JP6216519B2 (ja) 2013-03-04 2013-03-04 粘着性組成物、粘着剤および粘着シート
KR1020140020094A KR102314962B1 (ko) 2013-03-04 2014-02-21 점착성 조성물, 점착제 및 점착시트
TW103106696A TWI628250B (zh) 2013-03-04 2014-02-27 Adhesive composition, adhesive and adhesive sheet
CN201710583306.8A CN107216837B (zh) 2013-03-04 2014-03-04 压敏粘合性组合物、压敏粘合剂以及压敏粘合片
CN201410075584.9A CN104031582B (zh) 2013-03-04 2014-03-04 压敏粘合性组合物、压敏粘合剂以及压敏粘合片
KR1020210116182A KR20210112281A (ko) 2013-03-04 2021-09-01 점착성 조성물, 점착제 및 점착시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013041769A JP6216519B2 (ja) 2013-03-04 2013-03-04 粘着性組成物、粘着剤および粘着シート

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JP2017039632A Division JP6307189B2 (ja) 2017-03-02 2017-03-02 粘着性組成物、粘着剤および粘着シート

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JP2014169382A JP2014169382A (ja) 2014-09-18
JP6216519B2 true JP6216519B2 (ja) 2017-10-18

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JP (1) JP6216519B2 (ko)
KR (2) KR102314962B1 (ko)
CN (2) CN107216837B (ko)
TW (1) TWI628250B (ko)

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JP6826362B2 (ja) * 2015-06-30 2021-02-03 リンテック株式会社 粘着シート
JP2017132872A (ja) * 2016-01-27 2017-08-03 日東電工株式会社 粘着剤組成物、粘着部材、光学部材、および電子部材
CN109476970B (zh) * 2016-08-17 2021-09-14 三菱化学株式会社 丙烯酸系粘接剂组合物、利用该丙烯酸系粘接剂组合物而成的粘接剂、偏光板用粘接剂及图像显示装置
CN108753181A (zh) * 2018-05-23 2018-11-06 广东东立新材料科技股份有限公司 一种有机硅改性oca光学胶、光学胶带及其制备方法
CN108753182A (zh) * 2018-05-23 2018-11-06 广东东立新材料科技股份有限公司 一种性能优异的oca光学胶、光学胶带及其制备方法
WO2021193721A1 (ja) 2020-03-24 2021-09-30 日東電工株式会社 発光装置
WO2021193720A1 (ja) 2020-03-24 2021-09-30 日東電工株式会社 粘着型光学フィルム
CN115380093A (zh) 2020-03-24 2022-11-22 日东电工株式会社 粘合片和带剥离衬垫的粘合片
KR20220156055A (ko) 2020-03-24 2022-11-24 닛토덴코 가부시키가이샤 층간 시트, 박리 라이너를 구비하는 층간 시트 및 광학 적층체
KR20220153085A (ko) 2020-03-24 2022-11-17 닛토덴코 가부시키가이샤 점착제 조성물, 점착제 및 점착 시트
CN115335481A (zh) 2020-03-24 2022-11-11 日东电工株式会社 粘合剂组合物、粘合剂以及粘合片
KR20210150198A (ko) * 2020-06-03 2021-12-10 동우 화인켐 주식회사 이접착층 형성용 조성물 및 이를 이용한 하드코팅 필름
CN112175553A (zh) * 2020-10-28 2021-01-05 南京汇鑫光电材料有限公司 一种高折射率oca光学胶
CN112745786A (zh) * 2021-01-12 2021-05-04 江苏斯迪克新材料科技股份有限公司 高折射率的光学胶黏剂及其制备方法
KR20240041975A (ko) 2021-08-03 2024-04-01 닛토덴코 가부시키가이샤 점착제 및 점착 시트
KR20240040788A (ko) 2021-08-03 2024-03-28 닛토덴코 가부시키가이샤 점착제 조성물 및 점착 시트
JP2023038116A (ja) 2021-09-06 2023-03-16 日東電工株式会社 屈折率調整剤およびその利用
CN113755101A (zh) * 2021-09-07 2021-12-07 常州都铂高分子有限公司 一种具有良好再剥离性的胶水组合物
JP2023041990A (ja) 2021-09-14 2023-03-27 日東電工株式会社 粘着剤組成物および粘着シート
JP2023151520A (ja) 2022-03-31 2023-10-16 日東電工株式会社 粘着型光学フィルムおよび積層シート
JP2023151517A (ja) 2022-03-31 2023-10-16 日東電工株式会社 粘着剤組成物および粘着剤
JP2023151518A (ja) 2022-03-31 2023-10-16 日東電工株式会社 粘着剤
JP2023151515A (ja) 2022-03-31 2023-10-16 日東電工株式会社 シリコーン系可塑剤およびその利用
JP2023151516A (ja) 2022-03-31 2023-10-16 日東電工株式会社 粘着剤および粘着シート
JP2023151519A (ja) 2022-03-31 2023-10-16 日東電工株式会社 発光装置

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JP3838196B2 (ja) * 2002-12-24 2006-10-25 ブラザー工業株式会社 電子機器
JP4515357B2 (ja) * 2005-01-27 2010-07-28 リンテック株式会社 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
JP3997270B2 (ja) * 2005-11-21 2007-10-24 綜研化学株式会社 光学フィルム用粘着剤組成物および粘着シート、ならびにこれを用いた光学部材
JP2006206904A (ja) * 2006-01-20 2006-08-10 Nippon Synthetic Chem Ind Co Ltd:The 粘着フィルム
US20090105437A1 (en) * 2007-10-19 2009-04-23 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
JP5591477B2 (ja) 2008-03-13 2014-09-17 日東電工株式会社 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材、透明導電性積層体、タッチパネルおよび画像表示装置
KR101656757B1 (ko) * 2009-09-29 2016-09-12 린텍 코포레이션 점착제 및 점착 시트
JP5595034B2 (ja) * 2009-12-28 2014-09-24 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP5517716B2 (ja) * 2010-04-14 2014-06-11 日東電工株式会社 導電性フィルム用感圧性接着剤組成物及び感圧性接着シート、並びに導電性フィルム
JP2012077299A (ja) * 2010-09-10 2012-04-19 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物、粘着剤、光学部材用粘着剤、粘着剤層付き光学部材、画像表示装置
JP6097474B2 (ja) * 2010-12-13 2017-03-15 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルム、および画像表示装置
JP5604321B2 (ja) * 2011-01-26 2014-10-08 綜研化学株式会社 アルカリ剥離性粘着剤組成物およびこれを利用した粘着シート

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Publication number Publication date
KR20210112281A (ko) 2021-09-14
TW201443182A (zh) 2014-11-16
CN104031582B (zh) 2018-05-15
TWI628250B (zh) 2018-07-01
KR20140109265A (ko) 2014-09-15
KR102314962B1 (ko) 2021-10-19
CN104031582A (zh) 2014-09-10
CN107216837A (zh) 2017-09-29
CN107216837B (zh) 2020-01-17
JP2014169382A (ja) 2014-09-18

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