JP6204103B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6204103B2 JP6204103B2 JP2013155233A JP2013155233A JP6204103B2 JP 6204103 B2 JP6204103 B2 JP 6204103B2 JP 2013155233 A JP2013155233 A JP 2013155233A JP 2013155233 A JP2013155233 A JP 2013155233A JP 6204103 B2 JP6204103 B2 JP 6204103B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide semiconductor
- film
- semiconductor film
- transistor
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
Landscapes
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013155233A JP6204103B2 (ja) | 2012-07-27 | 2013-07-26 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012166568 | 2012-07-27 | ||
| JP2012166568 | 2012-07-27 | ||
| JP2013155233A JP6204103B2 (ja) | 2012-07-27 | 2013-07-26 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014042013A JP2014042013A (ja) | 2014-03-06 |
| JP2014042013A5 JP2014042013A5 (enExample) | 2016-09-01 |
| JP6204103B2 true JP6204103B2 (ja) | 2017-09-27 |
Family
ID=49994022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013155233A Expired - Fee Related JP6204103B2 (ja) | 2012-07-27 | 2013-07-26 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20140027762A1 (enExample) |
| JP (1) | JP6204103B2 (enExample) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027263A (ja) | 2012-06-15 | 2014-02-06 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP6134598B2 (ja) | 2012-08-02 | 2017-05-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| SG10201700805WA (en) | 2012-08-03 | 2017-02-27 | Semiconductor Energy Lab Co Ltd | Oxide semiconductor stacked film and semiconductor device |
| KR102171650B1 (ko) | 2012-08-10 | 2020-10-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9245958B2 (en) | 2012-08-10 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6220597B2 (ja) | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014024808A1 (en) | 2012-08-10 | 2014-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9929276B2 (en) | 2012-08-10 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN104584229B (zh) | 2012-08-10 | 2018-05-15 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| WO2014046222A1 (en) | 2012-09-24 | 2014-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| TWI671910B (zh) | 2012-09-24 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2014061762A1 (en) | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102220279B1 (ko) | 2012-10-19 | 2021-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법 |
| TWI582993B (zh) | 2012-11-30 | 2017-05-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2014103901A1 (en) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US9893192B2 (en) | 2013-04-24 | 2018-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US20150008428A1 (en) | 2013-07-08 | 2015-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| TWI632688B (zh) | 2013-07-25 | 2018-08-11 | 半導體能源研究所股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
| JP6264090B2 (ja) * | 2013-07-31 | 2018-01-24 | 株式会社リコー | 電界効果型トランジスタ、及び電界効果型トランジスタの製造方法 |
| JP6345023B2 (ja) * | 2013-08-07 | 2018-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| JP6131781B2 (ja) * | 2013-08-28 | 2017-05-24 | 三菱電機株式会社 | 薄膜トランジスタおよびその製造方法ならびに液晶表示装置 |
| TWI646690B (zh) | 2013-09-13 | 2019-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP6386323B2 (ja) | 2013-10-04 | 2018-09-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI721409B (zh) | 2013-12-19 | 2021-03-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US9929279B2 (en) * | 2014-02-05 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TWI657488B (zh) * | 2014-03-20 | 2019-04-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置、具有該半導體裝置的顯示裝置、具有該顯示裝置的顯示模組以及具有該半導體裝置、該顯示裝置和該顯示模組的電子裝置 |
| WO2015181997A1 (en) * | 2014-05-30 | 2015-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI646658B (zh) * | 2014-05-30 | 2019-01-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
| US20160005871A1 (en) * | 2014-07-04 | 2016-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6520489B2 (ja) * | 2014-07-17 | 2019-05-29 | 株式会社リコー | 電子回路装置、及び表示素子 |
| US9991393B2 (en) | 2014-10-16 | 2018-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, module, and electronic device |
| TW201624708A (zh) * | 2014-11-21 | 2016-07-01 | 半導體能源研究所股份有限公司 | 半導體裝置及記憶體裝置 |
| US10396210B2 (en) * | 2014-12-26 | 2019-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with stacked metal oxide and oxide semiconductor layers and display device including the semiconductor device |
| US10522693B2 (en) * | 2015-01-16 | 2019-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| KR20250143145A (ko) * | 2015-02-06 | 2025-09-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| CN107406966B (zh) | 2015-03-03 | 2020-11-20 | 株式会社半导体能源研究所 | 氧化物半导体膜、包括该氧化物半导体膜的半导体装置以及包括该半导体装置的显示装置 |
| KR102582523B1 (ko) * | 2015-03-19 | 2023-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US9806200B2 (en) | 2015-03-27 | 2017-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TWI561894B (en) * | 2015-05-29 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Manufacturing method of making electronic connection structure, tft substrate, and insulation layer |
| WO2017081579A1 (en) | 2015-11-13 | 2017-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US10559697B2 (en) | 2015-11-20 | 2020-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method of the semiconductor device, or display device including the semiconductor device |
| US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| JP6851814B2 (ja) | 2015-12-29 | 2021-03-31 | 株式会社半導体エネルギー研究所 | トランジスタ |
| CN105576038A (zh) * | 2016-01-12 | 2016-05-11 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、显示基板和显示装置 |
| KR20180123028A (ko) | 2016-03-11 | 2018-11-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장비, 상기 반도체 장치의 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102330605B1 (ko) * | 2016-06-22 | 2021-11-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| TW201813095A (zh) * | 2016-07-11 | 2018-04-01 | 半導體能源硏究所股份有限公司 | 半導體裝置 |
| KR102384624B1 (ko) * | 2016-10-21 | 2022-04-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2018220491A1 (ja) * | 2017-06-02 | 2018-12-06 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品及び電子機器 |
| JPWO2018224904A1 (ja) | 2017-06-05 | 2020-05-21 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| JP7190729B2 (ja) | 2018-08-31 | 2022-12-16 | 三国電子有限会社 | キャリア注入量制御電極を有する有機エレクトロルミネセンス素子 |
| JP7246681B2 (ja) * | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
| CN110600381A (zh) * | 2019-08-26 | 2019-12-20 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板和阵列基板的制备方法 |
| WO2021099885A1 (ja) | 2019-11-21 | 2021-05-27 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
| WO2021106811A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社Flosfia | 半導体装置および半導体システム |
| JP7444436B2 (ja) | 2020-02-05 | 2024-03-06 | 三国電子有限会社 | 液晶表示装置 |
| US11646379B2 (en) * | 2020-06-23 | 2023-05-09 | Taiwan Semiconductor Manufacturing Company Limited | Dual-layer channel transistor and methods of forming same |
| US20230361158A1 (en) * | 2022-05-09 | 2023-11-09 | International Business Machines Corporation | Resistor structure in integrated circuit |
| KR20240105993A (ko) * | 2022-12-29 | 2024-07-08 | 엘지디스플레이 주식회사 | 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치 |
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| KR101146574B1 (ko) * | 2006-12-05 | 2012-05-16 | 캐논 가부시끼가이샤 | 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치 |
| JP5401758B2 (ja) * | 2006-12-12 | 2014-01-29 | サンケン電気株式会社 | 半導体装置及びその製造方法 |
| KR101334181B1 (ko) * | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| US8274078B2 (en) * | 2007-04-25 | 2012-09-25 | Canon Kabushiki Kaisha | Metal oxynitride semiconductor containing zinc |
| JP2009016469A (ja) * | 2007-07-03 | 2009-01-22 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP5325446B2 (ja) * | 2008-04-16 | 2013-10-23 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| US20090278120A1 (en) * | 2008-05-09 | 2009-11-12 | Korea Institute Of Science And Technology | Thin Film Transistor |
| TWI450399B (zh) * | 2008-07-31 | 2014-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR20100023151A (ko) * | 2008-08-21 | 2010-03-04 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터 및 그 제조방법 |
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| TWI633605B (zh) * | 2008-10-31 | 2018-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| CN110061144A (zh) * | 2009-10-16 | 2019-07-26 | 株式会社半导体能源研究所 | 逻辑电路和半导体器件 |
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| KR20190100462A (ko) * | 2009-11-28 | 2019-08-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
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| JP2011138934A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| JP5739257B2 (ja) * | 2010-08-05 | 2015-06-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5897910B2 (ja) * | 2011-01-20 | 2016-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5820402B2 (ja) * | 2011-06-30 | 2015-11-24 | 株式会社Joled | 薄膜トランジスタ装置及び薄膜トランジスタ装置の製造方法 |
| WO2013001579A1 (ja) * | 2011-06-30 | 2013-01-03 | パナソニック株式会社 | 薄膜トランジスタ装置及び薄膜トランジスタ装置の製造方法 |
| US8748886B2 (en) * | 2011-07-08 | 2014-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| CN103038887A (zh) * | 2011-08-09 | 2013-04-10 | 松下电器产业株式会社 | 薄膜半导体器件及薄膜半导体器件的制造方法 |
| JPWO2013118233A1 (ja) * | 2012-02-06 | 2015-05-11 | 株式会社Joled | 薄膜半導体装置の製造方法及び薄膜半導体装置 |
| WO2013118234A1 (ja) * | 2012-02-06 | 2013-08-15 | パナソニック株式会社 | 薄膜半導体装置の製造方法及び薄膜半導体装置 |
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| JP6082930B2 (ja) * | 2012-04-20 | 2017-02-22 | 株式会社Joled | 薄膜トランジスタおよび表示装置 |
| TWI799011B (zh) * | 2012-09-14 | 2023-04-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP5951442B2 (ja) * | 2012-10-17 | 2016-07-13 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014061762A1 (en) * | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2014103901A1 (en) * | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI618252B (zh) * | 2013-02-12 | 2018-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI620324B (zh) * | 2013-04-12 | 2018-04-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI664731B (zh) * | 2013-05-20 | 2019-07-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| CN109860278A (zh) * | 2013-05-20 | 2019-06-07 | 株式会社半导体能源研究所 | 半导体装置 |
| DE102014019794B4 (de) * | 2013-05-20 | 2024-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| JP6400336B2 (ja) * | 2013-06-05 | 2018-10-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
-
2013
- 2013-07-16 US US13/942,866 patent/US20140027762A1/en not_active Abandoned
- 2013-07-26 JP JP2013155233A patent/JP6204103B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20140027762A1 (en) | 2014-01-30 |
| JP2014042013A (ja) | 2014-03-06 |
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