JP6199724B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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Description
(半導体装置)
まず、第1の実施形態の製造方法により製造する半導体装置について、図1および図2を参照して説明する。図1は半導体装置の上面図、図2は半導体装置の断面図である。これらの図に示す半導体装置1は、配線基板2と、配線基板2の第1の面2a上に搭載された半導体チップ3と、半導体チップ3を封止する封止樹脂層4と、封止樹脂層4の上面および側面と配線基板2の側面の少なくとも一部を覆う導電性シールド層5とを具備するシールド機能付き半導体装置である。なお、封止樹脂層4の上面等における上下の方向は、配線基板2の半導体チップ3が搭載された面を上とした場合を基準とする。
次に、第1の実施形態による半導体装置1の製造工程について説明する。まず、通常の半導体パッケージの製造工程を適用し、図3に示すように導電性シールド層5を形成する前の工程までを実施することによって、導電性シールド層5を有しない半導体パッケージ20を作製する。すなわち、導電性シールド層5を有しない半導体パッケージ20を、スパッタ法を適用した導電性シールド層5の形成工程、すなわち導電性シールド層5のスパッタ成膜工程における被処理物として作製する。導電性シールド層5を有しない半導体パッケージ20は、例えば以下のようにして作製される。
(被処理物)
次に、第2の実施形態の製造方法について、図13ないし図15を参照して説明する。図13は半導体装置の製造工程で被処理物として使用する半導体パッケージの断面図、図14および図15は図13に示す被処理物を用いた半導体装置の製造工程を示している。第2の実施形態の製造方法は、第1の実施形態のトレー21におけるくぼみ部30、30Aを、BGA型半導体パッケージのバンプ電極の収容部として利用するものである。第2の実施形態の製造工程で使用するトレー21は、くぼみ部30、30Aをバンプ電極の収容部として用いることを除いて、第1の実施形態のトレー21と同一構造を有している。図13に示すように、第2の実施形態で被処理物として使用する半導体パッケージ40は、配線基板2の外部接続端子8上に設けられた半田バンプ等のバンプ電極41を有する。
次に、第2の実施形態による半導体装置1の製造工程について説明する。図14および図15に示すように、半導体パッケージ40はくぼみ部30、30Aにバンプ電極41を収容した状態で、トレー21の被処理物収納部内22に配置される。バンプ電極41を収容するくぼみ部は、底面を有する非貫通孔(30)および貫通孔(30A)のいずれであってもよい。第1の実施形態と同様に、半導体パッケージ40はトレー21に収納された状態でスパッタ工程に送られ、その状態でスパッタ工程に供される。スパッタ工程は第1の実施形態と同様にして実施される。そのようなスパッタ工程によって、封止樹脂層4の上面および側面と配線基板2の側面を覆う導電性シールド層5が形成される。
Claims (16)
- 配線基板と、前記配線基板上に搭載された半導体チップと、前記半導体チップを封止するように前記配線基板上に設けられた封止樹脂層とを備える複数の被処理物を用意する工程と、
複数の被処理物収納部を備えるトレーを用意する工程と、
前記トレーの前記複数の被処理物収納部内に、前記配線基板上に前記半導体チップが搭載された面を上とした場合の前記封止樹脂層の上面および側面と前記配線基板の側面の少なくとも一部が露出するように、前記被処理物をそれぞれ配置する工程と、
前記複数の被処理物を収納した前記トレーをスパッタ装置のテーブル上に載置し、前記複数の被処理物に金属材料をスパッタすることにより、前記封止樹脂層の上面および側面と前記配線基板の側面の少なくとも一部を覆う導電性シールド層を形成する工程とを具備し、
前記被処理物収納部は、前記被処理物の側面を位置決めする2つのテーパ部と、前記2つのテーパ部間に設けられた凸部とを有する位置決め部材を備え、
前記2つのテーパ部の先端は、前記被処理物の側面による外形形状に対応し、かつ前記被処理物の側面と接して位置決めするように設けられ、前記テーパ部は前記被処理物が配置される面に対して35〜50度の範囲で傾斜しており、
前記凸部は前記被処理物の側面の少なくとも一辺に対応し、前記テーパ部先端の位置から後退した位置に設けられている、半導体装置の製造方法。 - 前記被処理物収納部の前記位置決め部材の高さは、前記被処理物収納部内に配置された前記被処理物の上面より低い、請求項1に記載の半導体装置の製造方法。
- 前記被処理物収納部は、前記被処理物の配置位置の一部にくぼみを備えている、請求項1または請求項2に記載の半導体装置の製造方法。
- 前記被処理物の側面全体に前記金属材料がスパッタされる、請求項1ないし請求項3のいずれか一項に記載の半導体装置の製造方法。
- 配線基板と、前記配線基板上に搭載された半導体チップと、前記半導体チップを封止するように前記配線基板上に設けられた封止樹脂層とを備える複数の被処理物の上面および側面に金属材料をスパッタする際に前記複数の被処理物が収納されるスパッタ用トレーであって、
前記複数の被処理物がそれぞれ配置される複数の被処理物収納部を備え、
前記被処理物収納部は、前記被処理物の側面を位置決めする2つのテーパ部と、前記2つのテーパ部間に設けられた凸部とを有する位置決め部材を備え、
前記2つのテーパ部の先端は、配置される前記被処理物の側面による外形形状に対応し、かつ前記被処理物の側面と接して位置決めするように設けられ、前記テーパ部は前記被処理物が配置される面に対して35〜50度の範囲で傾斜しており、
前記凸部は前記被処理物の側面の少なくとも一辺に対応し、前記テーパ部先端の位置から後退した位置に設けられている、スパッタ用トレー。 - 前記被処理物収納部の前記テーパ部の高さは、前記被処理物収納部内に配置された前記被処理物の上面より低くなるように設けられている、請求項5に記載のスパッタ用トレー。
- 前記被処理物収納部は、前記被処理物の配置位置の一部にくぼみを備えている、請求項5または請求項6に記載のスパッタ用トレー。
- 前記テーパ部の頂部が曲面状である、請求項5ないし請求項7のいずれか一項に記載のスパッタ用トレー。
- 配線基板と、前記配線基板上に搭載された半導体チップと、前記半導体チップを封止するように前記配線基板上に設けられた封止樹脂層とを備える複数の被処理物を用意する工程と、
前記被処理物より平面形状が大きい複数の被処理物収納部を備えるトレーを用意する工程と、
前記トレーの前記複数の被処理物収納部内に、前記配線基板上に前記半導体チップが搭載された面を上とした場合の前記封止樹脂層の上面および側面と前記配線基板の側面の少なくとも一部が露出するように、前記被処理物をそれぞれ配置する工程と、
前記複数の被処理物を収納した前記トレーをスパッタ装置のテーブル上に載置し、前記複数の被処理物に金属材料をスパッタすることにより、前記封止樹脂層の上面および側面と前記配線基板の側面の少なくとも一部を覆う導電性シールド層を形成する工程とを具備し、
前記被処理物収納部は、前記被処理物の側面を位置決めする2つのテーパ部と、前記2つのテーパ部間に設けられた凸部とを有する位置決め部材を備え、
前記2つのテーパ部の先端は、前記被処理物の側面による外形辺のそれぞれの一部と対応し、かつ前記被処理物の側面と接して位置決めするように設けられ、
前記2つのテーパ部は、前記被処理物が配置される面に対して傾斜しており、
前記凸部は前記被処理物の側面による外形辺の少なくとも一辺に対応し、前記テーパ部先端の位置から後退した位置に設けられている、半導体装置の製造方法。 - 前記被処理物収納部の前記位置決め部材の高さは、前記被処理物収納部内に配置された前記被処理物の上面より低い、請求項9に記載の半導体装置の製造方法。
- 前記被処理物収納部は、前記被処理物の配置位置の一部にくぼみを備えている、請求項9または請求項10に記載の半導体装置の製造方法。
- 前記被処理物の側面全体に前記金属材料がスパッタされる、請求項9ないし請求項11のいずれか一項に記載の半導体装置の製造方法。
- 配線基板と、前記配線基板上に搭載された半導体チップと、前記半導体チップを封止するように前記配線基板上に設けられた封止樹脂層とを備える複数の被処理物の上面および側面に金属材料をスパッタする際に前記複数の被処理物が収納されるスパッタ用トレーであって、
前記複数の被処理物がそれぞれ配置される、前記被処理物より平面形状が大きい複数の被処理物収納部を備え、
前記被処理物収納部は、前記被処理物の側面を位置決めする2つのテーパ部と、前記2つのテーパ部間に設けられた凸部とを有する位置決め部材を備え、
前記2つのテーパ部の先端は、配置される前記被処理物の側面による外形辺のそれぞれの一部と対応し、かつ前記被処理物の側面と接して位置決めするように設けられ、
前記2つのテーパ部は前記被処理物が配置される面に対して傾斜しており、
前記凸部は前記被処理物の側面による外形辺の少なくとも一辺に対応し、前記テーパ部先端の位置から後退した位置に設けられている、スパッタ用トレー。 - 前記被処理物収納部の前記テーパ部の高さは、前記被処理物収納部内に配置される前記被処理物の上面より低くなるように設けられている、請求項13に記載のスパッタ用トレー。
- 前記被処理物収納部は、前記被処理物の配置位置の一部にくぼみを備えている、請求項13または14に記載のスパッタ用トレー。
- 前記テーパ部の頂部が曲面状である、請求項13ないし請求項15のいずれか一項に記載のスパッタ用トレー。
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