JP6190980B2 - 電解銅箔、その電解銅箔を用いた各種製品 - Google Patents

電解銅箔、その電解銅箔を用いた各種製品 Download PDF

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Publication number
JP6190980B2
JP6190980B2 JP2016570143A JP2016570143A JP6190980B2 JP 6190980 B2 JP6190980 B2 JP 6190980B2 JP 2016570143 A JP2016570143 A JP 2016570143A JP 2016570143 A JP2016570143 A JP 2016570143A JP 6190980 B2 JP6190980 B2 JP 6190980B2
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JP
Japan
Prior art keywords
copper foil
electrolytic copper
foil
electrolytic
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016570143A
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English (en)
Japanese (ja)
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JPWO2017051767A1 (ja
Inventor
季実子 藤澤
季実子 藤澤
健作 篠崎
健作 篠崎
政登 胡木
政登 胡木
篠崎 淳
淳 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JP6190980B2 publication Critical patent/JP6190980B2/ja
Publication of JPWO2017051767A1 publication Critical patent/JPWO2017051767A1/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/10Moulds; Masks; Masterforms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • H01M10/0525Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • H01M4/661Metal or alloys, e.g. alloy coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2016570143A 2015-09-25 2016-09-15 電解銅箔、その電解銅箔を用いた各種製品 Active JP6190980B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015188509 2015-09-25
JP2015188509 2015-09-25
PCT/JP2016/077336 WO2017051767A1 (ja) 2015-09-25 2016-09-15 電解銅箔、その電解銅箔を用いた各種製品

Publications (2)

Publication Number Publication Date
JP6190980B2 true JP6190980B2 (ja) 2017-08-30
JPWO2017051767A1 JPWO2017051767A1 (ja) 2017-09-21

Family

ID=58386557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016570143A Active JP6190980B2 (ja) 2015-09-25 2016-09-15 電解銅箔、その電解銅箔を用いた各種製品

Country Status (5)

Country Link
JP (1) JP6190980B2 (ko)
KR (2) KR102413674B1 (ko)
CN (1) CN108350588B (ko)
TW (1) TWI707062B (ko)
WO (1) WO2017051767A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134203B2 (ja) 2020-09-01 2022-09-09 株式会社Lixil サッシ窓の気密/断熱構造
JP7250672B2 (ja) 2019-12-26 2023-04-03 Ykk Ap株式会社 建具

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018198905A1 (ja) * 2017-04-25 2018-11-01 古河電気工業株式会社 表面処理銅箔
TWI660541B (zh) * 2018-10-01 2019-05-21 長春石油化學股份有限公司 用於鋰二次電池集電體之銅箔及包含其之負極
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN110093635B (zh) * 2019-04-24 2021-07-02 福建清景铜箔有限公司 高强度电解铜箔及其使用该铜箔的各种制品
CN110670093A (zh) * 2019-10-21 2020-01-10 湖北中科铜箔科技有限公司 4.5μm双面光电解铜箔的生产方法
CN110656359A (zh) * 2019-10-21 2020-01-07 湖北中科铜箔科技有限公司 一种高频高速电解铜箔的生产方法
CN110699714A (zh) * 2019-10-21 2020-01-17 湖北中科铜箔科技有限公司 一种反转电解铜箔的生产方法
CN110656360A (zh) * 2019-10-21 2020-01-07 湖北中科铜箔科技有限公司 一种太阳能用电解铜箔的生产方法
CN111455414A (zh) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 一种用于生产渐变式电解铜箔的添加剂
CN113566764B (zh) * 2021-07-20 2023-04-07 山东合盛铜业有限公司 一种烫金箔卷筒厚度检验设备
US20240052513A1 (en) 2022-08-08 2024-02-15 Dupont Electronics, Inc. Electrolytic copper foil, a method for manufacturing the same, and articles made therefrom

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3281783B2 (ja) 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
JP4439081B2 (ja) 2000-05-31 2010-03-24 日本電解株式会社 電解銅箔の製造方法とそれに用いる装置
JP2003328177A (ja) * 2002-05-14 2003-11-19 Mitsui Mining & Smelting Co Ltd カソード電極材及びその製造方法並びにそのカソード電極材を用いた電解銅箔製造用の回転陰極ドラム
JP2008123622A (ja) * 2006-11-14 2008-05-29 Nippon Steel Chem Co Ltd Hddサスペンション用積層体の製造方法
JP2009289312A (ja) * 2008-05-28 2009-12-10 Nippon Steel Chem Co Ltd 金属張積層体及び配線一体型サスペンション
KR101385761B1 (ko) * 2010-07-01 2014-04-17 미쓰이금속광업주식회사 전해 동박 및 그 제조 방법
JP5666384B2 (ja) * 2011-05-31 2015-02-12 日本電解株式会社 支持体付極薄銅箔とその製造方法
JP5379928B2 (ja) * 2011-06-30 2013-12-25 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池
JP5822928B2 (ja) * 2011-07-13 2015-11-25 Jx日鉱日石金属株式会社 強度が高く、かつ反りの少ない電解銅箔及びその製造方法
KR101632852B1 (ko) * 2012-06-27 2016-06-22 후루카와 덴키 고교 가부시키가이샤 리튬 이온 이차 전지용 전해 구리박, 리튬 이온 이차 전지의 부극 전극 및 리튬 이온 이차 전지
JP5352748B1 (ja) * 2012-10-26 2013-11-27 Jx日鉱日石金属株式会社 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法
KR101787513B1 (ko) * 2013-01-29 2017-10-18 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박을 이용한 전지용 집전체, 상기 집전체를 이용한 이차전지용 전극, 상기 전극을 이용한 이차전지

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7250672B2 (ja) 2019-12-26 2023-04-03 Ykk Ap株式会社 建具
JP7134203B2 (ja) 2020-09-01 2022-09-09 株式会社Lixil サッシ窓の気密/断熱構造

Also Published As

Publication number Publication date
CN108350588A (zh) 2018-07-31
KR20180058735A (ko) 2018-06-01
KR20210024237A (ko) 2021-03-04
JPWO2017051767A1 (ja) 2017-09-21
KR102413674B1 (ko) 2022-06-27
TWI707062B (zh) 2020-10-11
TW201725286A (zh) 2017-07-16
WO2017051767A1 (ja) 2017-03-30
CN108350588B (zh) 2020-03-17

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