JP6182974B2 - 基板検査方法 - Google Patents

基板検査方法 Download PDF

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Publication number
JP6182974B2
JP6182974B2 JP2013105984A JP2013105984A JP6182974B2 JP 6182974 B2 JP6182974 B2 JP 6182974B2 JP 2013105984 A JP2013105984 A JP 2013105984A JP 2013105984 A JP2013105984 A JP 2013105984A JP 6182974 B2 JP6182974 B2 JP 6182974B2
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JP
Japan
Prior art keywords
wiring pattern
substrate
inspection
unit
wiring
Prior art date
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Application number
JP2013105984A
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English (en)
Japanese (ja)
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JP2014228301A5 (enExample
JP2014228301A (ja
Inventor
山下　宗寛
宗寛 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013105984A priority Critical patent/JP6182974B2/ja
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to PCT/JP2014/002631 priority patent/WO2014188701A1/en
Priority to TW105106033A priority patent/TWI613451B/zh
Priority to CN201480028288.1A priority patent/CN105209924B/zh
Priority to KR1020157029036A priority patent/KR101663920B1/ko
Priority to TW103117541A priority patent/TWI536027B/zh
Publication of JP2014228301A publication Critical patent/JP2014228301A/ja
Publication of JP2014228301A5 publication Critical patent/JP2014228301A5/ja
Application granted granted Critical
Publication of JP6182974B2 publication Critical patent/JP6182974B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
JP2013105984A 2013-05-20 2013-05-20 基板検査方法 Active JP6182974B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法
TW105106033A TWI613451B (zh) 2013-05-20 2014-05-19 基板檢測用夾具
CN201480028288.1A CN105209924B (zh) 2013-05-20 2014-05-19 基板检测方法及基板检测用夹具
KR1020157029036A KR101663920B1 (ko) 2013-05-20 2014-05-19 기판 검사 방법 및 기판 검사용 지그
PCT/JP2014/002631 WO2014188701A1 (en) 2013-05-20 2014-05-19 Board inspection method
TW103117541A TWI536027B (zh) 2013-05-20 2014-05-19 基板檢測方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法

Publications (3)

Publication Number Publication Date
JP2014228301A JP2014228301A (ja) 2014-12-08
JP2014228301A5 JP2014228301A5 (enExample) 2016-05-19
JP6182974B2 true JP6182974B2 (ja) 2017-08-23

Family

ID=51933268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013105984A Active JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法

Country Status (5)

Country Link
JP (1) JP6182974B2 (enExample)
KR (1) KR101663920B1 (enExample)
CN (1) CN105209924B (enExample)
TW (2) TWI613451B (enExample)
WO (1) WO2014188701A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5078269U (enExample) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
ATE224061T1 (de) * 1998-02-18 2002-09-15 Luther & Maelzer Gmbh Verfahren und vorrichtung zum prüfen von gedruckten leiterplatten
JP3311698B2 (ja) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
JP2002005981A (ja) * 2000-06-16 2002-01-09 Oht Inc 検査装置及び検査方法
TWI269878B (en) * 2000-12-01 2007-01-01 Toppan Printing Co Ltd Circuit pattern detector and circuit pattern detecting method
KR100877243B1 (ko) * 2001-02-19 2009-01-07 니혼 덴산 리드 가부시끼가이샤 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP4264305B2 (ja) * 2003-07-11 2009-05-13 日本電産リード株式会社 基板検査装置及び基板検査方法
JP3953087B2 (ja) * 2005-10-18 2007-08-01 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2009250659A (ja) * 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
EP2732299A4 (en) * 2011-07-15 2015-03-25 Orbotech Ltd ELECTRICAL TESTING OF ELECTRONIC DEVICES BY MEANS OF ELECTRON BEAM-INDUCED PLASMA STONES
JP6069884B2 (ja) * 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置

Also Published As

Publication number Publication date
TW201627676A (zh) 2016-08-01
WO2014188701A1 (en) 2014-11-27
JP2014228301A (ja) 2014-12-08
TW201445145A (zh) 2014-12-01
KR20150130506A (ko) 2015-11-23
TWI536027B (zh) 2016-06-01
TWI613451B (zh) 2018-02-01
CN105209924A (zh) 2015-12-30
KR101663920B1 (ko) 2016-10-07
CN105209924B (zh) 2018-11-20

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