KR101663920B1 - 기판 검사 방법 및 기판 검사용 지그 - Google Patents

기판 검사 방법 및 기판 검사용 지그 Download PDF

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Publication number
KR101663920B1
KR101663920B1 KR1020157029036A KR20157029036A KR101663920B1 KR 101663920 B1 KR101663920 B1 KR 101663920B1 KR 1020157029036 A KR1020157029036 A KR 1020157029036A KR 20157029036 A KR20157029036 A KR 20157029036A KR 101663920 B1 KR101663920 B1 KR 101663920B1
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South Korea
Prior art keywords
wiring pattern
substrate
terminal
inspection
wiring
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English (en)
Korean (ko)
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KR20150130506A (ko
Inventor
무네히로 야마시타
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니혼덴산리드가부시키가이샤
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Publication of KR20150130506A publication Critical patent/KR20150130506A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G01R31/02—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
KR1020157029036A 2013-05-20 2014-05-19 기판 검사 방법 및 기판 검사용 지그 Active KR101663920B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-105984 2013-05-20
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法
PCT/JP2014/002631 WO2014188701A1 (en) 2013-05-20 2014-05-19 Board inspection method

Publications (2)

Publication Number Publication Date
KR20150130506A KR20150130506A (ko) 2015-11-23
KR101663920B1 true KR101663920B1 (ko) 2016-10-07

Family

ID=51933268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157029036A Active KR101663920B1 (ko) 2013-05-20 2014-05-19 기판 검사 방법 및 기판 검사용 지그

Country Status (5)

Country Link
JP (1) JP6182974B2 (enExample)
KR (1) KR101663920B1 (enExample)
CN (1) CN105209924B (enExample)
TW (2) TWI613451B (enExample)
WO (1) WO2014188701A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) * 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP2005030882A (ja) 2003-07-11 2005-02-03 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2009250659A (ja) 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5078269U (enExample) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
ATE224061T1 (de) * 1998-02-18 2002-09-15 Luther & Maelzer Gmbh Verfahren und vorrichtung zum prüfen von gedruckten leiterplatten
JP3311698B2 (ja) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
JP2002005981A (ja) * 2000-06-16 2002-01-09 Oht Inc 検査装置及び検査方法
TWI269878B (en) * 2000-12-01 2007-01-01 Toppan Printing Co Ltd Circuit pattern detector and circuit pattern detecting method
KR100877243B1 (ko) * 2001-02-19 2009-01-07 니혼 덴산 리드 가부시끼가이샤 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
JP3953087B2 (ja) * 2005-10-18 2007-08-01 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
EP2732299A4 (en) * 2011-07-15 2015-03-25 Orbotech Ltd ELECTRICAL TESTING OF ELECTRONIC DEVICES BY MEANS OF ELECTRON BEAM-INDUCED PLASMA STONES
JP6069884B2 (ja) * 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP2005030882A (ja) 2003-07-11 2005-02-03 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2009250659A (ja) 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法

Also Published As

Publication number Publication date
CN105209924B (zh) 2018-11-20
TW201445145A (zh) 2014-12-01
CN105209924A (zh) 2015-12-30
TWI613451B (zh) 2018-02-01
JP2014228301A (ja) 2014-12-08
JP6182974B2 (ja) 2017-08-23
TWI536027B (zh) 2016-06-01
KR20150130506A (ko) 2015-11-23
WO2014188701A1 (en) 2014-11-27
TW201627676A (zh) 2016-08-01

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