CN105209924B - 基板检测方法及基板检测用夹具 - Google Patents

基板检测方法及基板检测用夹具 Download PDF

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Publication number
CN105209924B
CN105209924B CN201480028288.1A CN201480028288A CN105209924B CN 105209924 B CN105209924 B CN 105209924B CN 201480028288 A CN201480028288 A CN 201480028288A CN 105209924 B CN105209924 B CN 105209924B
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China
Prior art keywords
substrate
wiring pattern
terminal
detection
unit
Prior art date
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CN201480028288.1A
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English (en)
Chinese (zh)
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CN105209924A (zh
Inventor
山下宗宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
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Nidec Read Corp
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Publication of CN105209924A publication Critical patent/CN105209924A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
CN201480028288.1A 2013-05-20 2014-05-19 基板检测方法及基板检测用夹具 Active CN105209924B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法
JP2013-105984 2013-05-20
PCT/JP2014/002631 WO2014188701A1 (en) 2013-05-20 2014-05-19 Board inspection method

Publications (2)

Publication Number Publication Date
CN105209924A CN105209924A (zh) 2015-12-30
CN105209924B true CN105209924B (zh) 2018-11-20

Family

ID=51933268

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480028288.1A Active CN105209924B (zh) 2013-05-20 2014-05-19 基板检测方法及基板检测用夹具

Country Status (5)

Country Link
JP (1) JP6182974B2 (enExample)
KR (1) KR101663920B1 (enExample)
CN (1) CN105209924B (enExample)
TW (2) TWI613451B (enExample)
WO (1) WO2014188701A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1380980A (zh) * 2000-06-16 2002-11-20 Oht株式会社 检查装置及检查方法
CN1996028A (zh) * 2005-12-28 2007-07-11 日本电产丽德株式会社 基板检查装置及基板检查方法
CN101191811A (zh) * 2006-11-30 2008-06-04 日本电产理德株式会社 基板检查装置和基板检查方法
CN101292166A (zh) * 2005-10-18 2008-10-22 日本电产理德株式会社 绝缘检查装置和绝缘检查方法
CN101454680A (zh) * 2006-06-20 2009-06-10 日本电产理德株式会社 基板检查装置和基板检查方法
CN104246523A (zh) * 2012-05-08 2014-12-24 日本电产理德株式会社 绝缘检查方法以及绝缘检查装置

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JPS5078269U (enExample) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
ATE224061T1 (de) * 1998-02-18 2002-09-15 Luther & Maelzer Gmbh Verfahren und vorrichtung zum prüfen von gedruckten leiterplatten
JP3311698B2 (ja) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
TWI269878B (en) * 2000-12-01 2007-01-01 Toppan Printing Co Ltd Circuit pattern detector and circuit pattern detecting method
KR100877243B1 (ko) * 2001-02-19 2009-01-07 니혼 덴산 리드 가부시끼가이샤 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP4264305B2 (ja) * 2003-07-11 2009-05-13 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2009250659A (ja) * 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
EP2732299A4 (en) * 2011-07-15 2015-03-25 Orbotech Ltd ELECTRICAL TESTING OF ELECTRONIC DEVICES BY MEANS OF ELECTRON BEAM-INDUCED PLASMA STONES

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1380980A (zh) * 2000-06-16 2002-11-20 Oht株式会社 检查装置及检查方法
CN101292166A (zh) * 2005-10-18 2008-10-22 日本电产理德株式会社 绝缘检查装置和绝缘检查方法
CN1996028A (zh) * 2005-12-28 2007-07-11 日本电产丽德株式会社 基板检查装置及基板检查方法
CN101454680A (zh) * 2006-06-20 2009-06-10 日本电产理德株式会社 基板检查装置和基板检查方法
CN101191811A (zh) * 2006-11-30 2008-06-04 日本电产理德株式会社 基板检查装置和基板检查方法
CN104246523A (zh) * 2012-05-08 2014-12-24 日本电产理德株式会社 绝缘检查方法以及绝缘检查装置

Also Published As

Publication number Publication date
TW201627676A (zh) 2016-08-01
WO2014188701A1 (en) 2014-11-27
JP2014228301A (ja) 2014-12-08
TW201445145A (zh) 2014-12-01
KR20150130506A (ko) 2015-11-23
TWI536027B (zh) 2016-06-01
TWI613451B (zh) 2018-02-01
CN105209924A (zh) 2015-12-30
JP6182974B2 (ja) 2017-08-23
KR101663920B1 (ko) 2016-10-07

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