TWI613451B - 基板檢測用夾具 - Google Patents

基板檢測用夾具 Download PDF

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Publication number
TWI613451B
TWI613451B TW105106033A TW105106033A TWI613451B TW I613451 B TWI613451 B TW I613451B TW 105106033 A TW105106033 A TW 105106033A TW 105106033 A TW105106033 A TW 105106033A TW I613451 B TWI613451 B TW I613451B
Authority
TW
Taiwan
Prior art keywords
substrate
wiring pattern
terminal
detecting
unit
Prior art date
Application number
TW105106033A
Other languages
English (en)
Chinese (zh)
Other versions
TW201627676A (zh
Inventor
山下宗寛
Original Assignee
日本電産理徳股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産理徳股份有限公司 filed Critical 日本電産理徳股份有限公司
Publication of TW201627676A publication Critical patent/TW201627676A/zh
Application granted granted Critical
Publication of TWI613451B publication Critical patent/TWI613451B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
TW105106033A 2013-05-20 2014-05-19 基板檢測用夾具 TWI613451B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法
JP2013-105984 2013-05-20

Publications (2)

Publication Number Publication Date
TW201627676A TW201627676A (zh) 2016-08-01
TWI613451B true TWI613451B (zh) 2018-02-01

Family

ID=51933268

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105106033A TWI613451B (zh) 2013-05-20 2014-05-19 基板檢測用夾具
TW103117541A TWI536027B (zh) 2013-05-20 2014-05-19 基板檢測方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103117541A TWI536027B (zh) 2013-05-20 2014-05-19 基板檢測方法

Country Status (5)

Country Link
JP (1) JP6182974B2 (enExample)
KR (1) KR101663920B1 (enExample)
CN (1) CN105209924B (enExample)
TW (2) TWI613451B (enExample)
WO (1) WO2014188701A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155149A (ja) * 1998-11-19 2000-06-06 Okano Hightech Kk 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
US20020113598A1 (en) * 2001-02-19 2002-08-22 Yoshio Tsuji Circuit board testing apparatus and method for testing a circuit board
CN1395697A (zh) * 2000-12-01 2003-02-05 凸版印刷株式会社 电路图形检测装置和电路图形检测方法
TW201033625A (en) * 2008-10-23 2010-09-16 Nidec Read Corp Printed circuit board testing fixture and printed circuit board testing system with the same
JP2011145279A (ja) * 2009-12-18 2011-07-28 Micronics Japan Co Ltd プローブカード及び検査装置
TW201307872A (zh) * 2011-07-15 2013-02-16 Photon Dynamics Inc 非機械性接觸訊號測量裝置及其訊號測量方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5078269U (enExample) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
ATE224061T1 (de) * 1998-02-18 2002-09-15 Luther & Maelzer Gmbh Verfahren und vorrichtung zum prüfen von gedruckten leiterplatten
JP2002005981A (ja) * 2000-06-16 2002-01-09 Oht Inc 検査装置及び検査方法
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP4264305B2 (ja) * 2003-07-11 2009-05-13 日本電産リード株式会社 基板検査装置及び基板検査方法
JP3953087B2 (ja) * 2005-10-18 2007-08-01 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2009250659A (ja) * 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP6069884B2 (ja) * 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155149A (ja) * 1998-11-19 2000-06-06 Okano Hightech Kk 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
CN1395697A (zh) * 2000-12-01 2003-02-05 凸版印刷株式会社 电路图形检测装置和电路图形检测方法
US20020113598A1 (en) * 2001-02-19 2002-08-22 Yoshio Tsuji Circuit board testing apparatus and method for testing a circuit board
TW201033625A (en) * 2008-10-23 2010-09-16 Nidec Read Corp Printed circuit board testing fixture and printed circuit board testing system with the same
JP2011145279A (ja) * 2009-12-18 2011-07-28 Micronics Japan Co Ltd プローブカード及び検査装置
TW201307872A (zh) * 2011-07-15 2013-02-16 Photon Dynamics Inc 非機械性接觸訊號測量裝置及其訊號測量方法

Also Published As

Publication number Publication date
TW201627676A (zh) 2016-08-01
WO2014188701A1 (en) 2014-11-27
JP2014228301A (ja) 2014-12-08
TW201445145A (zh) 2014-12-01
KR20150130506A (ko) 2015-11-23
TWI536027B (zh) 2016-06-01
CN105209924A (zh) 2015-12-30
JP6182974B2 (ja) 2017-08-23
KR101663920B1 (ko) 2016-10-07
CN105209924B (zh) 2018-11-20

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