JP6175432B2 - 基板処理装置、温度計測システム、処理装置の温度計測方法、搬送装置及び記録媒体 - Google Patents
基板処理装置、温度計測システム、処理装置の温度計測方法、搬送装置及び記録媒体 Download PDFInfo
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
Claims (17)
- 保持具に保持した状態で装入された基板を処理する処理室と、前記処理室の温度を計測する温度計測器と、少なくとも前記保持具に前記基板を搬送する搬送装置と、前記処理室の温度を計測する前に、前記搬送装置を、予め設定された位置に移動させ、前記処理室の温度を計測する際に、前記温度計測器を取り付けた状態で前記搬送装置を昇降させながら、前記温度計測器からの温度を取得するコントローラと、を有する基板処理装置。
- 被処理体を処理する処理室の温度を計測する温度計測器と、前記被処理体を搬送する搬送装置と、前記温度計測器を前記搬送装置に取り付けるための冶具と、前記搬送装置に前記冶具を介して前記温度計測器を取り付けた状態で、前記搬送装置を昇降させながら、前記温度計測器からの温度を取得するコントローラと、を有する温度計測システム。
- 被処理体を処理する処理室の温度を計測する温度計測器と、前記被処理体を搬送する搬送装置と、前記温度計測器及び前記搬送装置にそれぞれ接続されるコントローラと、を有する処理装置の温度計測方法であって、前記コントローラは、前記処理室の温度を計測する前に、前記搬送装置を、予め設定された位置に移動させ、前記処理室の温度を計測する際に、前記温度計測器を取り付けた状態で前記搬送装置を昇降させながら、前記温度計測器からの温度を取得する処理装置の温度計測方法。
- 被処理体を処理する処理室の温度を計測する温度計測器を取り付けた状態で昇降可能な搬送装置であって、前記温度計測器を取り付けるための冶具と、前記冶具と着脱可能な温度計測器支持機構の取付けまたは取外しを認識するセンサを備え、
前記処理室の温度を計測する前に、予め設定された位置で前記治具に温度計測器支持機構が取り付けられ、前記処理室の温度を計測する際に前記温度計測器を取り付けた状態で昇降するように構成されている搬送装置。 - 処理室の温度が搬送装置に取り付けられた温度計測器によって計測される処理を行う処理装置を制御するためのコンピュータにおいて実行されるプログラムであって、前記搬送装置を、予め設定された位置に移動させる処理と、前記温度計測器を取り付けた状態で前記搬送装置を昇降させながら、前記温度計測器からの温度を取得する処理が実行される処理装置をコンピュータによって制御させるためのプログラム。
- 前記コントローラは、前記処理室の温度を測定するための所定のシーケンスを実行することにより、計測条件を変更させて前記処理室の温度を繰り返し計測するように構成されている請求項1記載の基板処理装置。
- 更に、前記温度計測器を支持する温度計測器支持機構と、前記温度計測器支持機構が取り付けられる冶具と、前記冶具に設けられるセンサと、を有し、
前記センサは、前記治具が前記温度計測器支持機構に取り付けられているかを検出する請求項1記載の基板処理装置。 - 前記搬送装置は、前記温度計測器支持機構を介して前記温度計測器に取り付ける前、または、前記温度計測による温度計測の前に、予め設定された位置に移動されるよう構成されている請求項7記載の基板処理装置。
- 前記コントローラは、前記搬送装置が所定の開始位置から外れている場合、前記所定のシーケンスを実行しないで終了するように構成されている請求項6記載の基板処理装置。
- 前記コントローラは、前記搬送装置が所定の終了位置に、所定時間内に到達しない場合に、前記所定のシーケンスによる温度計測を終了するように構成されている請求項6記載の基板処理装置。
- 前記コントローラは、前記温度計測器により計測された温度から温度補正値を算出するよう構成されている請求項1記載の基板処理装置。
- 基板を処理する処理室と、前記基板を保持する保持具と、前記基板を保持具に搬送する搬送装置と、
前記処理室の温度を計測する温度計測器を支持する温度計測器支持機構と、がそれぞれ設けられ、
前記搬送装置は、予め設定された位置に移動され前記温度計測器支持機構が取付けられ、前記処理室の温度を計測するために前記温度計測器支持機構を介して前記温度計測器を昇降させるように構成されている基板処理装置。 - 被処理体を処理する処理室の温度を計測する温度計測器と、前記被処理体を搬送する搬送装置と、前記温度計測器を前記搬送装置に取り付けるための冶具と、がそれぞれ設けられ、前記搬送装置に前記冶具を介して前記温度計測器を取り付けた状態で前記搬送装置を昇降させるよう構成されている温度計測システム。
- 保持具に保持した状態で装入された基板を処理する処理室と、前記処理室の温度を計測する温度計測器と、少なくとも前記保持具に前記基板を搬送する搬送装置と、前記処理室の温度を計測する前に、前記搬送装置を、予め設定された位置に移動させ、前記処理室の温度を計測する際に、前記温度計測器を取り付けた状態で前記搬送装置を降下させながら、前記温度計測器からの温度を取得するコントローラと、を有する基板処理装置。
- 被処理体を処理する処理室の温度を計測する温度計測器と、前記被処理体を搬送する搬送装置と、前記温度計測器を前記搬送装置に取り付けるための冶具と、前記搬送装置に前記冶具を介して前記温度計測器を取り付けた状態で、前記搬送装置を降下させながら、前記温度計測器からの温度を取得するコントローラと、を有する温度計測システム。
- 被処理体を処理する処理室の温度を計測する温度計測器と、前記被処理体を搬送する搬送装置と、前記温度計測器及び前記搬送装置にそれぞれ接続されるコントローラと、を有する処理装置の温度計測方法であって、前記コントローラは、前記処理室の温度を計測する前に、前記搬送装置を、予め設定された位置に移動させ、前記処理室の温度を計測する際に、前記温度計測器を取り付けた状態で前記搬送装置を降下させながら、前記温度計測器からの温度を取得する処理装置の温度計測方法。
- 処理室の温度が搬送装置に取り付けられた温度計測器によって計測される処理を行う処理装置を制御するためのコンピュータにおいて、実行されるプログラムであって、前記搬送装置を、予め設定された位置に移動させる処理と、前記温度計測器を取り付けた状態で前記搬送装置を降下させながら、前記温度計測器からの温度を取得する処理が実行される処理装置を、コンピュータによって制御させるためのプログラム。
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JP2014518416A JP6175432B2 (ja) | 2012-05-28 | 2013-05-23 | 基板処理装置、温度計測システム、処理装置の温度計測方法、搬送装置及び記録媒体 |
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PCT/JP2013/064380 WO2013180010A1 (ja) | 2012-05-28 | 2013-05-23 | 基板処理装置、温度計測システム、処理装置の温度計測方法、搬送装置及び記録媒体 |
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US10297481B2 (en) * | 2013-03-21 | 2019-05-21 | Tokyo Electron Limited | Magnetic annealing apparatus |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
JP6454425B2 (ja) * | 2015-09-28 | 2019-01-16 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置およびプログラム |
CN108885993B (zh) * | 2016-03-24 | 2019-12-10 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法以及存储介质 |
CN107424947A (zh) * | 2017-08-16 | 2017-12-01 | 君泰创新(北京)科技有限公司 | 薄膜电池工艺设备的温度测试方法及系统 |
US10978322B2 (en) * | 2017-08-30 | 2021-04-13 | Tokyo Electron Limited | Transfer device, substrate processing apparatus, and transfer method |
WO2020188675A1 (ja) * | 2019-03-18 | 2020-09-24 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置およびプログラム |
CN111755359B (zh) * | 2019-03-26 | 2024-04-12 | 株式会社国际电气 | 基板处理装置、反应管以及半导体装置的制造方法 |
US11915960B2 (en) * | 2019-07-31 | 2024-02-27 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
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US6193506B1 (en) * | 1995-05-24 | 2001-02-27 | Brooks Automation, Inc. | Apparatus and method for batch thermal conditioning of substrates |
JPH095172A (ja) * | 1995-06-15 | 1997-01-10 | Kokusai Electric Co Ltd | 温度測定方法 |
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JP2004022943A (ja) * | 2002-06-19 | 2004-01-22 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US20050067757A1 (en) * | 2003-08-26 | 2005-03-31 | Takeshi Suga | Sheet feeding apparatus and image forming apparatus having the same |
CN100367460C (zh) * | 2003-10-30 | 2008-02-06 | 东京毅力科创株式会社 | 热处理装置及热处理方法 |
JP2008117810A (ja) * | 2006-10-31 | 2008-05-22 | Sharp Corp | 熱処理装置および熱処理装置における加熱条件取得方法 |
JP5273961B2 (ja) * | 2007-07-20 | 2013-08-28 | 株式会社日立国際電気 | 基板処理システムおよび基板処理方法 |
JP5373550B2 (ja) * | 2009-10-26 | 2013-12-18 | アズビル株式会社 | 温度制御装置および異常判定方法 |
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