JP6172966B2 - 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ - Google Patents

光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ Download PDF

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Publication number
JP6172966B2
JP6172966B2 JP2013030291A JP2013030291A JP6172966B2 JP 6172966 B2 JP6172966 B2 JP 6172966B2 JP 2013030291 A JP2013030291 A JP 2013030291A JP 2013030291 A JP2013030291 A JP 2013030291A JP 6172966 B2 JP6172966 B2 JP 6172966B2
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Japan
Prior art keywords
optical element
metal
ceramic substrate
substrate
porous ceramic
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JP2013030291A
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English (en)
Japanese (ja)
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JP2014160731A5 (enExample
JP2014160731A (ja
Inventor
瑞惠 福島
福島　　瑞惠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2013030291A priority Critical patent/JP6172966B2/ja
Publication of JP2014160731A publication Critical patent/JP2014160731A/ja
Publication of JP2014160731A5 publication Critical patent/JP2014160731A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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JP2013030291A 2013-02-19 2013-02-19 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ Active JP6172966B2 (ja)

Priority Applications (1)

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JP2013030291A JP6172966B2 (ja) 2013-02-19 2013-02-19 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013030291A JP6172966B2 (ja) 2013-02-19 2013-02-19 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ

Publications (3)

Publication Number Publication Date
JP2014160731A JP2014160731A (ja) 2014-09-04
JP2014160731A5 JP2014160731A5 (enExample) 2016-04-07
JP6172966B2 true JP6172966B2 (ja) 2017-08-02

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JP2013030291A Active JP6172966B2 (ja) 2013-02-19 2013-02-19 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ

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JP (1) JP6172966B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3185655B8 (de) * 2015-12-22 2024-01-03 Heraeus Electronics GmbH & Co. KG Verfahren zur individuellen codierung von metall-keramik-substraten
JP6868455B2 (ja) * 2016-06-02 2021-05-12 パナソニック株式会社 電子部品パッケージおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006287126A (ja) * 2005-04-04 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄランプ、およびそのユニット板の製造方法
JP4744335B2 (ja) * 2006-01-30 2011-08-10 京セラ株式会社 発光装置および照明装置
TWI314366B (en) * 2006-04-28 2009-09-01 Delta Electronics Inc Light emitting apparatus
JP2008091831A (ja) * 2006-10-05 2008-04-17 Toshiba Corp Ｌｅｄ用サブマウント基板およびそれを用いた発光装置並びにｌｅｄ用サブマウント基板の製造方法
JP4780203B2 (ja) * 2009-02-10 2011-09-28 日亜化学工業株式会社 半導体発光装置

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JP2014160731A (ja) 2014-09-04

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