JP2014160731A5 - - Google Patents
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- Publication number
- JP2014160731A5 JP2014160731A5 JP2013030291A JP2013030291A JP2014160731A5 JP 2014160731 A5 JP2014160731 A5 JP 2014160731A5 JP 2013030291 A JP2013030291 A JP 2013030291A JP 2013030291 A JP2013030291 A JP 2013030291A JP 2014160731 A5 JP2014160731 A5 JP 2014160731A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic substrate
- optical element
- porous ceramic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013030291A JP6172966B2 (ja) | 2013-02-19 | 2013-02-19 | 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013030291A JP6172966B2 (ja) | 2013-02-19 | 2013-02-19 | 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014160731A JP2014160731A (ja) | 2014-09-04 |
| JP2014160731A5 true JP2014160731A5 (enExample) | 2016-04-07 |
| JP6172966B2 JP6172966B2 (ja) | 2017-08-02 |
Family
ID=51612233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013030291A Active JP6172966B2 (ja) | 2013-02-19 | 2013-02-19 | 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6172966B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3185655B8 (de) * | 2015-12-22 | 2024-01-03 | Heraeus Electronics GmbH & Co. KG | Verfahren zur individuellen codierung von metall-keramik-substraten |
| JP6868455B2 (ja) * | 2016-06-02 | 2021-05-12 | パナソニック株式会社 | 電子部品パッケージおよびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006287126A (ja) * | 2005-04-04 | 2006-10-19 | Toyoda Gosei Co Ltd | Ｌｅｄランプ、およびそのユニット板の製造方法 |
| JP4744335B2 (ja) * | 2006-01-30 | 2011-08-10 | 京セラ株式会社 | 発光装置および照明装置 |
| TWI314366B (en) * | 2006-04-28 | 2009-09-01 | Delta Electronics Inc | Light emitting apparatus |
| JP2008091831A (ja) * | 2006-10-05 | 2008-04-17 | Toshiba Corp | Ｌｅｄ用サブマウント基板およびそれを用いた発光装置並びにｌｅｄ用サブマウント基板の製造方法 |
| JP4780203B2 (ja) * | 2009-02-10 | 2011-09-28 | 日亜化学工業株式会社 | 半導体発光装置 |
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2013
- 2013-02-19 JP JP2013030291A patent/JP6172966B2/ja active Active