JP2012164945A5 - - Google Patents
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- Publication number
- JP2012164945A5 JP2012164945A5 JP2011026355A JP2011026355A JP2012164945A5 JP 2012164945 A5 JP2012164945 A5 JP 2012164945A5 JP 2011026355 A JP2011026355 A JP 2011026355A JP 2011026355 A JP2011026355 A JP 2011026355A JP 2012164945 A5 JP2012164945 A5 JP 2012164945A5
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- disposed
- plug
- semiconductor device
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011026355A JP5709564B2 (ja) | 2011-02-09 | 2011-02-09 | 半導体装置の製造方法 |
| US13/366,577 US8846436B2 (en) | 2011-02-09 | 2012-02-06 | Semiconductor device manufacturing method for forming an opening to provide a plug |
| CN201210027892.5A CN102637705B (zh) | 2011-02-09 | 2012-02-09 | 半导体器件制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011026355A JP5709564B2 (ja) | 2011-02-09 | 2011-02-09 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015042753A Division JP5968481B2 (ja) | 2015-03-04 | 2015-03-04 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012164945A JP2012164945A (ja) | 2012-08-30 |
| JP2012164945A5 true JP2012164945A5 (enExample) | 2014-09-18 |
| JP5709564B2 JP5709564B2 (ja) | 2015-04-30 |
Family
ID=46600899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011026355A Active JP5709564B2 (ja) | 2011-02-09 | 2011-02-09 | 半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8846436B2 (enExample) |
| JP (1) | JP5709564B2 (enExample) |
| CN (1) | CN102637705B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4866972B1 (ja) * | 2011-04-20 | 2012-02-01 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| US20120267741A1 (en) * | 2011-04-21 | 2012-10-25 | Panasonic Corporation | Solid-state imaging device and method for manufacturing the same |
| JP6039294B2 (ja) | 2012-08-07 | 2016-12-07 | キヤノン株式会社 | 半導体装置の製造方法 |
| JP2015114433A (ja) * | 2013-12-10 | 2015-06-22 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2015153870A (ja) * | 2014-02-13 | 2015-08-24 | キヤノン株式会社 | 半導体装置の製造方法、光電変換装置 |
| JP2017162925A (ja) * | 2016-03-08 | 2017-09-14 | キヤノン株式会社 | 撮像装置の製造方法 |
| JP2017220620A (ja) | 2016-06-09 | 2017-12-14 | キヤノン株式会社 | 固体撮像装置の製造方法 |
| US10319765B2 (en) * | 2016-07-01 | 2019-06-11 | Canon Kabushiki Kaisha | Imaging device having an effective pixel region, an optical black region and a dummy region each with pixels including a photoelectric converter |
| JP6574808B2 (ja) * | 2016-07-01 | 2019-09-11 | キヤノン株式会社 | 撮像装置 |
| JP7086558B2 (ja) * | 2016-10-28 | 2022-06-20 | キヤノン株式会社 | 光電変換装置および撮像システム |
| GB2558714B (en) | 2016-10-28 | 2020-04-08 | Canon Kk | Photoelectric conversion apparatus and image pickup system |
| EP3955300A1 (en) * | 2020-08-11 | 2022-02-16 | Infineon Technologies Dresden GmbH & Co . KG | Device for an image sensor, image sensor for an optical camera and optical camera |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61173251A (ja) * | 1985-01-28 | 1986-08-04 | Mitsubishi Electric Corp | フオトマスクの製造方法 |
| JP2002057318A (ja) | 2000-08-07 | 2002-02-22 | Sony Corp | 固体撮像素子及びその製造方法 |
| JP4427949B2 (ja) | 2002-12-13 | 2010-03-10 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
| US7442973B2 (en) * | 2002-12-13 | 2008-10-28 | Sony Corporation | Solid-state imaging device and production method therefor |
| JP2008103757A (ja) * | 2002-12-25 | 2008-05-01 | Sony Corp | 固体撮像素子およびその製造方法 |
| JP2006229206A (ja) * | 2005-02-14 | 2006-08-31 | Samsung Electronics Co Ltd | 向上された感度を有するイメージセンサ及びその製造方法 |
| JP2007149893A (ja) | 2005-11-25 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 固体撮像装置の製造方法、固体撮像装置及びカメラ |
| JP2008166677A (ja) | 2006-12-08 | 2008-07-17 | Sony Corp | 固体撮像装置とその製造方法並びにカメラ |
| US7973271B2 (en) * | 2006-12-08 | 2011-07-05 | Sony Corporation | Solid-state image pickup device, method for manufacturing solid-state image pickup device, and camera |
| JP5446484B2 (ja) * | 2008-07-10 | 2014-03-19 | ソニー株式会社 | 固体撮像装置とその製造方法および撮像装置 |
| JP5402083B2 (ja) | 2008-09-29 | 2014-01-29 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP2011023481A (ja) * | 2009-07-14 | 2011-02-03 | Panasonic Corp | 固体撮像装置及びその製造方法 |
| JP5418044B2 (ja) * | 2009-07-30 | 2014-02-19 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
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2011
- 2011-02-09 JP JP2011026355A patent/JP5709564B2/ja active Active
-
2012
- 2012-02-06 US US13/366,577 patent/US8846436B2/en active Active
- 2012-02-09 CN CN201210027892.5A patent/CN102637705B/zh active Active