JP6144841B2 - 基板検査方法及びそれを用いた基板検査システム - Google Patents
基板検査方法及びそれを用いた基板検査システム Download PDFInfo
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- JP6144841B2 JP6144841B2 JP2016536044A JP2016536044A JP6144841B2 JP 6144841 B2 JP6144841 B2 JP 6144841B2 JP 2016536044 A JP2016536044 A JP 2016536044A JP 2016536044 A JP2016536044 A JP 2016536044A JP 6144841 B2 JP6144841 B2 JP 6144841B2
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- 239000000758 substrate Substances 0.000 title claims description 235
- 238000007689 inspection Methods 0.000 title claims description 89
- 238000000034 method Methods 0.000 title claims description 48
- 230000002950 deficient Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000008602 contraction Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/167—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by projecting a pattern on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
Claims (7)
- 基板検査装置を用いて基板の不良かどうかを検査する基板検査方法であって、
前記基板検査装置が、
はんだが塗布された基板をワークステージに移送する段階と、
前記基板に複数のパターン光を照射して測定された高さ情報又は基板上に形成された少なくとも2つの認識マークの間の距離に基づいて基板の反りを検査する段階と、
前記検査の結果、前記基板の反りの程度が許容範囲以内の場合、前記反りに関する情報をマウンターに転送する段階と、
前記検査の結果、前記基板の一部の領域において反りの程度が許容範囲を外れた場合、前記反りに関する情報と、基板の領域別の未実装命令と、をマウンターに転送する段階と、を含むことを特徴とする基板検査方法。 - 前記反りを検査する段階以後に、
前記基板の反りの程度をチェックするための前記許容範囲と前記基板の3次元画像をディスプレーする段階をさらに含むことを特徴とする請求項1に記載の基板検査方法。 - 前記ディスプレーする段階は、
前記基板の最大高さ、最小高さ、高さの差及びオフセットのうち少なくとも一つを含む反り結果、前記基板が収縮された程度、X軸方向のオフセット及びY軸方向のオフセットのうちの少なくとも一つを含む収縮結果、及び前記基板の反りの最大許容範囲である最大反りをディスプレーすることを特徴とする請求項2に記載の基板検査方法。 - 前記反りに関する情報は反りの位置を示す反り座標、反り形状、反り程度のうち少なくとも一つの情報を含むことを特徴とする請求項1に記載の基板検査方法。
- 前記反りに関する情報に応じてマウンターが対応した結果情報のフィードバックを前記マウンターから受ける段階と、
前記結果情報を通計分析する段階と、をさらに含むことを特徴とする請求項1に記載の基板検査方法。 - はんだが塗布された基板の反りを検査して、前記基板が不良かどうかを判断し、前記反りに関する情報を部品実装部に転送する検査部と、
前記反りに関する情報に基づいて、前記基板に部品を実装するヘッドの速度、高さと角度のうち少なくとも一つを調節して部品を実装し、前記反りに関する情報に基づく前記ヘッドの調節の結果に関する情報を前記検査部にフィードバックする部品実装部を含むことを特徴とする基板検査システム。 - 前記検査部は、
前記ヘッドの調節の結果に関する情報を通計分析することを特徴とする請求項6に記載の基板検査システム。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0100454 | 2013-08-23 | ||
KR20130100454 | 2013-08-23 | ||
KR20140108752A KR20150023205A (ko) | 2013-08-23 | 2014-08-21 | 기판 검사방법 및 이를 이용한 기판 검사시스템 |
KR10-2014-0108752 | 2014-08-21 | ||
PCT/KR2014/007880 WO2015026212A1 (ko) | 2013-08-23 | 2014-08-25 | 기판 검사방법 및 이를 이용한 기판 검사시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016530522A JP2016530522A (ja) | 2016-09-29 |
JP6144841B2 true JP6144841B2 (ja) | 2017-06-07 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2016536044A Active JP6144841B2 (ja) | 2013-08-23 | 2014-08-25 | 基板検査方法及びそれを用いた基板検査システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US20160209207A1 (ja) |
EP (1) | EP3038444B1 (ja) |
JP (1) | JP6144841B2 (ja) |
KR (2) | KR20150023205A (ja) |
CN (1) | CN104584713B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10285320B2 (en) * | 2014-02-12 | 2019-05-07 | Fuji Corporation | Production management device of board production line |
JP6624598B2 (ja) * | 2015-08-04 | 2019-12-25 | 株式会社Fuji | 基板生産ラインの生産管理装置 |
KR101810991B1 (ko) * | 2016-02-04 | 2018-01-25 | 주식회사 고영테크놀러지 | 검사대, 검사 시스템 및 검사 방법 |
EP3419404B1 (en) * | 2016-02-18 | 2021-05-19 | Fuji Corporation | Component determination device and component determination method |
CN106403840A (zh) * | 2016-09-09 | 2017-02-15 | 蚌埠中建材信息显示材料有限公司 | 一种超薄浮法玻璃弯曲度检测方法 |
KR101893831B1 (ko) * | 2016-10-20 | 2018-08-31 | 주식회사 고영테크놀러지 | 기판 검사장치 및 이를 이용한 기판 검사방법 |
JP6883436B2 (ja) * | 2017-01-31 | 2021-06-09 | アルファーデザイン株式会社 | 塗布装置、塗布方法、プログラム |
JP6850882B2 (ja) * | 2017-05-24 | 2021-03-31 | 株式会社Fuji | 測定位置決定装置 |
KR20230150886A (ko) * | 2018-02-26 | 2023-10-31 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치 및 부품의 실장 상태를 검사하기 위한 방법 |
DE112018007439T5 (de) * | 2018-04-06 | 2020-12-31 | Yamaha Hatsudoki Kabushiki Kaisha | Bauteilmontagesystem, Bauteilmontagevorrichtung und Bauteilmontageverfahren |
WO2020005001A1 (ko) * | 2018-06-28 | 2020-01-02 | 주식회사 고영테크놀러지 | 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법 |
KR102267919B1 (ko) | 2018-06-28 | 2021-06-23 | 주식회사 고영테크놀러지 | 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법 |
WO2020111756A1 (ko) | 2018-11-27 | 2020-06-04 | 주식회사 고영테크놀러지 | 기판에 대한 검사 결과를 표시하는 전자 장치 및 방법 |
CN111638230A (zh) * | 2019-03-01 | 2020-09-08 | Oppo(重庆)智能科技有限公司 | 终端镜片检测方法、装置、电子设备及存储介质 |
US20220312659A1 (en) * | 2019-09-11 | 2022-09-29 | Fuji Corporation | Component mounting machine |
CN112611343A (zh) * | 2020-10-30 | 2021-04-06 | 江苏天艾美自动化科技有限公司 | 一种用于5g环形器的芯片平整度检测装置及其检测方法 |
CN112595234A (zh) * | 2021-01-04 | 2021-04-02 | 胜宏科技(惠州)股份有限公司 | 一种线路板复杂外形尺寸的检测方法 |
JP2024060867A (ja) * | 2022-10-20 | 2024-05-07 | Jswアクティナシステム株式会社 | レーザ照射システム、レーザ照射方法、及び有機elディスプレイの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61175516A (ja) * | 1985-01-30 | 1986-08-07 | Mitsubishi Electric Corp | 電子部品装着装置 |
JPH034600A (ja) * | 1989-06-01 | 1991-01-10 | Mitsubishi Electric Corp | 電子部品装着機 |
US5835223A (en) * | 1996-01-05 | 1998-11-10 | Electronic Packaging Services, Ltd. | System for measuring surface flatness using shadow moire technology |
JP2003046300A (ja) * | 2001-07-31 | 2003-02-14 | Toshiba Corp | Pcb製造ラインの管理システムおよびpcb製造管理方法 |
JP2004235314A (ja) * | 2003-01-29 | 2004-08-19 | Toshiba Corp | プリント回路基板の測定結果表示システム及び測定結果表示方法 |
JP2005010103A (ja) * | 2003-06-20 | 2005-01-13 | Sony Corp | プリント回路板の測定方法及びプリント回路板の製造方法 |
SG132551A1 (en) * | 2005-11-28 | 2007-06-28 | Rokko Systems Pte Ltd | Detection method and system |
JP2010186940A (ja) * | 2009-02-13 | 2010-08-26 | I-Pulse Co Ltd | 電子部品の装着装置および装着方法 |
JP2010237210A (ja) * | 2009-03-30 | 2010-10-21 | Koh Young Technology Inc | 検査方法 |
JP5246064B2 (ja) * | 2009-06-29 | 2013-07-24 | パナソニック株式会社 | 電子部品実装方法 |
JP5799206B2 (ja) * | 2011-08-22 | 2015-10-21 | パナソニックIpマネジメント株式会社 | 実装部品検査装置、部品実装システム及び部品実装方法 |
US8859335B2 (en) * | 2012-11-02 | 2014-10-14 | Fujitsu Limited | Method and system for controlling chip inclination during flip-chip mounting |
US8975092B2 (en) * | 2012-11-26 | 2015-03-10 | Fujitsu Limited | Method and system for controlling chip warpage during bonding |
-
2014
- 2014-08-21 KR KR20140108752A patent/KR20150023205A/ko active Application Filing
- 2014-08-25 EP EP14838383.9A patent/EP3038444B1/en active Active
- 2014-08-25 US US14/913,740 patent/US20160209207A1/en not_active Abandoned
- 2014-08-25 CN CN201480001348.0A patent/CN104584713B/zh active Active
- 2014-08-25 JP JP2016536044A patent/JP6144841B2/ja active Active
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2016
- 2016-01-28 KR KR1020160010472A patent/KR20160017659A/ko active Search and Examination
Also Published As
Publication number | Publication date |
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JP2016530522A (ja) | 2016-09-29 |
CN104584713B (zh) | 2017-06-13 |
EP3038444A4 (en) | 2017-04-05 |
CN104584713A (zh) | 2015-04-29 |
KR20150023205A (ko) | 2015-03-05 |
EP3038444B1 (en) | 2019-03-20 |
US20160209207A1 (en) | 2016-07-21 |
EP3038444A1 (en) | 2016-06-29 |
KR20160017659A (ko) | 2016-02-16 |
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