SG132551A1 - Detection method and system - Google Patents

Detection method and system

Info

Publication number
SG132551A1
SG132551A1 SG200507704-5A SG2005077045A SG132551A1 SG 132551 A1 SG132551 A1 SG 132551A1 SG 2005077045 A SG2005077045 A SG 2005077045A SG 132551 A1 SG132551 A1 SG 132551A1
Authority
SG
Singapore
Prior art keywords
detection method
detection
Prior art date
Application number
SG200507704-5A
Inventor
Shen Xue Fang
Lim Chong Chen
Baek Seung Ho
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG200507704-5A priority Critical patent/SG132551A1/en
Priority to PCT/SG2006/000366 priority patent/WO2007061388A1/en
Publication of SG132551A1 publication Critical patent/SG132551A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG200507704-5A 2005-11-28 2005-11-28 Detection method and system SG132551A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200507704-5A SG132551A1 (en) 2005-11-28 2005-11-28 Detection method and system
PCT/SG2006/000366 WO2007061388A1 (en) 2005-11-28 2006-11-28 Detection of warp in an ic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200507704-5A SG132551A1 (en) 2005-11-28 2005-11-28 Detection method and system

Publications (1)

Publication Number Publication Date
SG132551A1 true SG132551A1 (en) 2007-06-28

Family

ID=38067501

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200507704-5A SG132551A1 (en) 2005-11-28 2005-11-28 Detection method and system

Country Status (2)

Country Link
SG (1) SG132551A1 (en)
WO (1) WO2007061388A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5329833B2 (en) * 2008-04-08 2013-10-30 リンテック株式会社 Adhesive sheet for semiconductor wafer processing, adjustment method for semiconductor wafer processing apparatus using the same, and evaluation method for adhesive sheet
KR20150023205A (en) * 2013-08-23 2015-03-05 주식회사 고영테크놀러지 Board inspection method and board inspection system using the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110966A (en) * 1993-10-13 1995-04-25 Nikon Corp Method and apparatus for measurement of warp of substance
JPH08166226A (en) * 1994-12-14 1996-06-25 Casio Comput Co Ltd Flatness measuring device and flatness measuring method using the same
JP2002277235A (en) * 2001-03-16 2002-09-25 Hitachi Chem Co Ltd Instrument and method for automatically measuring warp
JP3639546B2 (en) * 2001-07-25 2005-04-20 株式会社日立国際電気 Substrate processing apparatus and semiconductor device manufacturing method
US7131211B2 (en) * 2003-08-18 2006-11-07 Micron Technology, Inc. Method and apparatus for measurement of thickness and warpage of substrates
JP2005083939A (en) * 2003-09-09 2005-03-31 Ricoh Co Ltd Method and device for measuring amount of warp and device for lamination
JP4549078B2 (en) * 2004-03-05 2010-09-22 日東電工株式会社 Method of measuring warpage of semiconductor wafer and workpiece for adjusting adhesive sheet pasting device
US20050241168A1 (en) * 2004-04-29 2005-11-03 Iannuzzelli Raymond J PWB warp gauge

Also Published As

Publication number Publication date
WO2007061388A1 (en) 2007-05-31

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