WO2015026212A1 - 기판 검사방법 및 이를 이용한 기판 검사시스템 - Google Patents
기판 검사방법 및 이를 이용한 기판 검사시스템 Download PDFInfo
- Publication number
- WO2015026212A1 WO2015026212A1 PCT/KR2014/007880 KR2014007880W WO2015026212A1 WO 2015026212 A1 WO2015026212 A1 WO 2015026212A1 KR 2014007880 W KR2014007880 W KR 2014007880W WO 2015026212 A1 WO2015026212 A1 WO 2015026212A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- warpage
- information
- unit
- mounter
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Definitions
- the present invention relates to a substrate inspection method and a substrate inspection system using the same, and more particularly, to a substrate inspection method and a substrate inspection system using the same that can increase the productivity and inspection efficiency of the product.
- PCB printed circuit board
- various circuit elements such as a circuit pattern, a connection pad part, and a driving chip electrically connected to the connection pad part are provided on the printed circuit board. Are fitted.
- the printed circuit board is manufactured by applying lead to a pad region of a bare substrate and then coupling terminals of an electronic component to a lead coating region.
- a solder paste inspection (SPI) process is performed prior to mounting an electronic component on a printed circuit board to check whether lead is properly applied to the pad area of the printed circuit board, and the electronic component is printed on the printed circuit board.
- SPI solder paste inspection
- AOI automated optical inspection
- the printed circuit board cannot check the defects of the bare substrate that occurred before soldering only by the inspection as described above, and such defects may cause a defect such as misinsertion or non-insertion even when the electronic component is mounted.
- mass production of defective products and performing unnecessary processes may impair the productivity and inspection efficiency of the product.
- the problem to be solved by the present invention is to provide a substrate inspection method that can increase the productivity and inspection efficiency of the product.
- Another problem to be solved by the present invention is to provide a substrate inspection system that can increase the productivity of the product and the efficiency of inspection.
- a method of inspecting a substrate may include: transferring a substrate to a work stage before mounting a component to a mounter, and inspecting warpage of the substrate.
- the method may include: transferring the substrate to the mounter when the substrate is determined to be good as a result of the inspection, and determining that the substrate is defective without transferring the substrate to the mounter when the substrate is determined to be defective. do.
- the checking of the warpage of the substrate may include: determining whether warpage exists on the substrate; determining that the substrate is good when the warpage of the substrate does not exist; Checking the degree of warpage of the substrate when warpage exists on the substrate; determining the substrate as good if the degree of warpage of the substrate is within an acceptable range; and the degree of warpage of the substrate. If is outside the allowable range, it may include determining the substrate as defective. In this case, when the warpage is present on the substrate, the method may further include displaying the warpage of the substrate as a 3D image before checking the warpage degree of the substrate. .
- the substrate inspection method may further include transmitting warpage information of the substrate to the mounter when it is determined that the substrate is good.
- the warpage information may include at least one of warpage coordinate information, warpage shape information, area warpage information, and warpage degree information.
- the method may further include receiving feedback of the corresponding result information according to the warpage information from the mounter, and performing statistical analysis on the corresponding result information and deriving additional countermeasures.
- the method for inspecting the substrate may include determining that the substrate is partially good when warpage exists in a partial region of the substrate but no warpage exists in the remaining region or is within the allowable range. As a result, when it is determined that the substrate is partially good, the method may further include transferring the substrate to the mounter.
- the substrate inspection method may further include transmitting warpage information of the substrate to the mounter when it is determined that the substrate is partially good as a result of the inspection.
- the warpage information may include: It can include area-mounted or unmounted commands.
- the substrate inspection method may further include obtaining height information of the substrate before inspecting warpage of the substrate, wherein inspecting the warpage of the substrate may include: It may be performed based on the height information of the obtained substrate.
- acquiring height information of the substrate may include irradiating the grid pattern light to the substrate, acquiring a pattern image of the grid pattern light reflected by the substrate, and using the obtained pattern image. Comprising the step of calculating the height information of the substrate.
- the substrate inspection method may further include measuring a distance between at least two recognition marks formed on the substrate before inspecting warpage of the substrate.
- inspecting the warpage of the substrate may include comparing the distance between the recognition marks with a reference distance.
- a substrate inspection system includes a work stage transfer unit, a warpage inspection unit, and a mounter transfer unit.
- the work stage transfer unit transfers the substrate before mounting the component to the mounter to the work stage.
- the warpage inspection unit inspects the warpage of the substrate to determine whether the substrate is defective.
- the mounter transfer unit transfers the substrate to the mounter when it is determined that the substrate is good as a result of the inspection of the warpage inspection unit.
- the warpage inspection unit includes a warpage determination unit that determines whether warpage exists on the substrate, and a warpage check that checks the degree of warpage of the substrate when warpage exists on the substrate. If the warpage of the substrate and the substrate do not exist and the degree of warpage of the substrate is within the allowable range, the substrate is judged to be good; if the degree of warpage of the substrate is outside the allowable range, the substrate is defective It includes a substrate quality determination unit judged as.
- the warp determination unit may determine that the substrate is partially good if warpage exists in a partial region of the substrate but warpage does not exist in the remaining region or is within the allowable range.
- the apparatus may further include a transmitter configured to transmit warpage information including a mounted or unmounted command for each region of the substrate to the mounter.
- the warpage inspection unit may further include a display unit displaying the warpage of the substrate as a 3D image.
- the display unit may include a shape display unit for displaying a three-dimensional shape of the substrate, a display shape adjusting unit for adjusting a three-dimensional shape of the substrate to be displayed, and warpage information for displaying information about warpage of the substrate. It may include a display unit.
- the substrate inspection system may further include a height information acquisition unit for acquiring height information of the substrate.
- the warpage inspection unit inspects the warpage of the substrate based on the height information of the substrate obtained by the height information acquisition unit.
- the height information acquisition unit may include a projection unit for irradiating the grid pattern light on the substrate, a camera unit for obtaining the pattern image of the grid pattern light reflected by the substrate, and the substrate using the obtained pattern image. It may include a control unit for calculating the height information of.
- the substrate inspection system may further include a distance measuring unit measuring a distance between at least two recognition marks formed on the substrate, and the warpage inspection unit measures a distance between the recognition marks. The warpage of the substrate is inspected against the reference distance.
- the warpage inspection unit may perform statistical analysis and additional countermeasures on the corresponding result information when receiving feedback of the corresponding result information according to the warpage information from the mounter.
- the present invention by inspecting the warpage of the substrate prior to mounting the component on the substrate, and confirming in advance as defective without transferring the substrate determined as defective to the mounter, unnecessary work and mass production of defective products in advance to prevent It can increase productivity and inspection efficiency.
- the operator can easily grasp and check the warpage generated on the substrate, and the shape of the substrate to be displayed using a predetermined input tool You can adjust and set the allowable range of warpage.
- FIG. 1 is a flow chart showing a substrate inspection method according to an embodiment of the present invention.
- FIG. 2 is a flowchart illustrating an embodiment of a process of inspecting warpage of a substrate in the substrate inspection method of FIG. 1.
- FIG. 3 is a conceptual diagram illustrating a board inspection system according to an embodiment of the present invention.
- FIG. 4 is a block diagram illustrating an example of a warpage inspection unit of the substrate inspection system of FIG. 3.
- FIG. 5 is a conceptual diagram illustrating an example of a screen implemented and displayed by the display unit of the warpage inspection unit of FIG. 4.
- first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
- the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
- FIG. 1 is a flow chart showing a substrate inspection method according to an embodiment of the present invention.
- a substrate before mounting a component to a mounter is transferred to a work stage (S110).
- the warpage of the substrate is inspected (S120).
- the warpage of the substrate may appear in the case where the substrate is made defective from the beginning, when the warpage occurs after the substrate is manufactured, or when the thickness of the substrate is thinner than the size. Accordingly, the warpage may appear due to the existence of bending or deflection of the substrate.
- the substrate is transferred to the mounter (S130).
- the substrate is transferred to the mounter as in the prior art, the operation of mounting the component is performed.
- the substrate is determined to be defective without transferring the substrate to the mounter (S140).
- the substrate is transferred to the mounter as in the prior art and the work for mounting the parts is not immediately performed, and it is immediately determined as defective.
- the defect is confirmed beforehand before the component mounting operation, so that when the component is mounted on the substrate using the mounting or misinsertion or inspection, the inspection of the substrate It is possible to prevent the occurrence of inspection errors in advance.
- FIG. 2 is a flowchart illustrating an embodiment of a process of inspecting warpage of a substrate in the substrate inspection method of FIG. 1.
- Whether or not the warpage is present may be performed based on image data obtained through 3D shape measurement.
- height information of the substrate may be obtained in advance.
- the process of inspecting warpage of the substrate may be performed based on the obtained height information of the substrate.
- the grid pattern light is irradiated onto the substrate, the pattern image of the grid pattern light reflected by the substrate is obtained, and then the obtained pattern image is used to obtain the pattern image.
- Height information of the substrate can be calculated.
- the grid pattern light irradiated to the substrate may be performed N times while transferring the grid (N is a natural number of 2 or more), and the height information of the substrate may be calculated using a bucket algorithm.
- a distance between at least two recognition marks formed on the substrate may be measured.
- the process of inspecting warpage of the substrate may be performed by comparing the distance between the recognition marks with a reference distance.
- the substrate is determined to be good. Specifically, when it is determined that warpage does not exist on the substrate as a result of the warpage inspection, the substrate is determined to be good.
- the degree of warpage of the substrate is checked (S126). When the degree of warpage of the substrate is within an allowable range, the substrate is determined to be good, and the substrate If the degree of warpage is outside the allowable range, the substrate is judged to be defective.
- warpage information information on the warpage and information on the determination result (hereinafter, “warpage information”) may be transmitted to the mounter.
- the warpage information may include warpage coordinate information, warpage shape information, Warpage information for each area, warpage degree information, and the like may be included.
- warpage information may be transmitted to the mounter, and the warpage information includes warpage coordinate information, warpage shape information, area warpage information, warpage degree information, area mounted or unmounted command, and the like. can do.
- the warpage of the substrate may be displayed as a three-dimensional image (S124).
- the check of the degree of warpage and the setting of the allowable range may be automatically performed through a computer or the like based on previously input criteria and information.
- the check of the warpage degree and the setting of the allowable range may be manually performed by the operator manually based on the displayed 3D image.
- FIG. 3 is a conceptual diagram illustrating a board inspection system according to an embodiment of the present invention.
- the substrate inspection system 100 includes a work stage transfer unit 110, a warpage inspection unit 120, and a mounter transfer unit 130.
- the work stage transfer unit 110 transfers the substrate BD to the work stage before mounting the component PT to the mounter MT.
- the work stage transfer unit 110 may perform a process (S110) of transferring the substrate shown in FIGS. 1 and 2 to a work stage.
- the warpage inspection unit 120 determines whether the substrate BD is defective by inspecting the warpage of the substrate BD.
- the warpage inspection unit 120 may perform a process (S120) of inspecting warpage of the substrate illustrated in FIGS. 1 and 2.
- FIG. 4 is a block diagram illustrating an example of a warpage inspection unit of the substrate inspection system of FIG. 3.
- the warpage inspecting unit 120 may include a warpage determining unit 122, a warpage checking unit 124, and a substrate quantity determining unit 126.
- the warpage determination unit 122 determines whether warpage exists on the substrate BD.
- the warpage determination unit 122 may perform a process of determining whether warpage exists in the substrate BD illustrated in FIGS. 1 and 2 (S122).
- the warpage checker 124 checks the degree of warpage of the substrate BD when warpage exists on the substrate BD.
- the warpage check unit 124 may perform a process (S126) of checking the degree of warpage of the substrate BD illustrated in FIGS. 1 and 2.
- the substrate determination unit 126 determines that the substrate BD is satisfactory when the warpage of the substrate BD does not exist and the degree of warpage of the substrate BD is within an allowable range. When the degree of warpage of the substrate BD is outside the allowable range, the substrate BD is determined to be defective.
- the substrate determination unit 126 may perform a process substantially the same as the process of determining whether the substrate is in the process of checking warpage of the substrate shown in FIGS. 1 and 2 (S120).
- the warpage inspection unit 120 may further include a display unit 128 displaying a warpage of the substrate BD as a 3D image.
- FIG. 5 is a conceptual diagram illustrating an example of a screen implemented and displayed by the display unit of the warpage inspection unit of FIG. 4.
- the display unit 128 may perform a process of displaying the warpage of the substrate BD as shown in FIGS. 1 and 2 as a 3D image (S120).
- the 3D image may be displayed on a screen 28 of a device such as a monitor.
- the display unit 128 may include a shape display unit 128a, a display shape control unit 128b, and a warpage information display unit 128c.
- the shape display unit 128a displays a three-dimensional shape of the substrate BD so that an operator can easily grasp the degree or shape of the warpage of the substrate BD.
- the three-dimensional shape 28a of the substrate BD may be displayed on the screen 28 of the device such as the monitor shown in FIG. 5.
- the display shape adjusting unit 128b adjusts the three-dimensional shape 28a of the displayed display board BD by automatically or by an operator receiving the viewing direction and magnification of the displayed display board BD.
- the operator inputs or touches through an input device such as a mouse or a keyboard.
- the three-dimensional shape 28a in which the substrate BD is displayed may be adjusted based on an input method of. For example, the viewing direction of the substrate BD may be adjusted using a tool located above the shape adjusting tool 28b, and the substrate may be adjusted using a tool located below the shape adjusting tool 28b. You can adjust the magnification of the BD.
- the warpage information display unit 128c displays information about warpage of the substrate BD.
- a war including Warpage Result, Shrinkage Result, Max Warpage, etc. on a screen 28 of a device such as the monitor shown in FIG.
- the sebum information 28c can be displayed.
- the warpage result may include a maximum height, a minimum height, a height difference, an offset, etc. of the substrate BD as a measurement result of the warpage existing in the substrate BD.
- the information on which the substrate BD is shrunk may include a degree of shrinkage, an X-axis offset, and a Y-axis offset.
- the maximum warpage may display a preset value or an automatically calculated value for the type of the substrate BD as an allowable range of the warpage, and may be input or modified by an operator differently or separately.
- the mounter transfer unit 130 transfers the substrate BD to the mounter MT when it is determined that the substrate BD is satisfactory as a result of the inspection of the warpage inspection unit 120. .
- the mounter transfer unit 130 may perform a process (S130) of transferring the substrate BD illustrated in FIGS. 1 and 2 to the mounter MT.
- the mounter MT may receive the warpage information as described in FIG. 2.
- the mounter MT may mount the component PT on the substrate BD based on the received warpage information, and the speed, height, etc. of the corresponding head may be adjusted using the warpage information.
- the mounter MT may feed back corresponding result information according to the warpage information to a solder inspection apparatus (not shown).
- the solder test equipment may analyze the corresponding result information, and may statistically analyze or derive an additional countermeasure.
- the degree of warpage of the substrate BD is within an allowable range and the substrate BD is judged to be good, or the warpage is applied to a portion of the substrate BD.
- the information is transmitted to the mounter MT.
- the mounter BD the specific area of the substrate BD or the substrate BD is transmitted. Failure to mount components may occur. In this case, the allowable range may be lowered by a predetermined unit.
- the mounter MT in the state where the speed, height, and maximum distorted mounting angle information of the head are received from the mounter MT before the warpage inspection, it may be determined whether the head is abnormal by comparing with information included in the corresponding result information. The determined result information may be displayed or transmitted back to the mounter MT.
- the substrate inspection system 100 may further include a height information acquisition unit 140 for acquiring height information of the substrate BD.
- the warpage inspecting unit 120 inspects warpage of the substrate BD based on the height information of the substrate BD obtained by the height information obtaining unit 140.
- the height information acquisition unit 140 includes a projection unit 142, a camera unit 144, and a control unit 146.
- the projection unit 142 irradiates the grid pattern light onto the substrate BD.
- the camera unit 144 acquires a pattern image of the grid pattern light reflected by the substrate BD.
- the controller 146 calculates height information of the substrate BD by using the obtained pattern image.
- the height information acquisition unit 140 may perform the height measurement process illustrated in FIGS. 1 and 2.
- the substrate inspection system 100 may further include a distance measuring unit (not shown) for measuring a distance between at least two recognition marks formed on the substrate BD.
- the warpage inspection unit 120 compares the distance between the recognition marks with a reference distance to inspect the warpage of the substrate BD.
- unnecessary work and defective products are checked by inspecting the warpage of the substrate before mounting the components on the substrate, and determining the defect as a defect without transferring the substrate determined to the mounter to the mounter. Proactively prevent mass production and increase product productivity and inspection efficiency.
- the operator can easily grasp and check the warpage generated on the substrate, and the shape of the substrate to be displayed using a predetermined input tool You can adjust and set the allowable range of warpage.
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Claims (20)
- 마운터(mounter)로 부품을 장착하기 이전의 기판을 워크 스테이지(work stage)로 이송하는 단계;상기 기판의 워피지(warpage)를 검사하는 단계;상기 검사 결과 상기 기판이 양호로 판단된 경우, 상기 기판을 상기 마운터로 이송하는 단계; 및상기 검사 결과 상기 기판이 불량으로 판단된 경우, 상기 기판을 상기 마운터로 이송하지 않고 불량으로 확정하는 단계를 포함하는 기판 검사방법.
- 제1항에 있어서,상기 기판의 워피지를 검사하는 단계는,상기 기판에 워피지가 존재하는지 여부를 판단하는 단계;상기 기판의 워피지가 존재하지 않는 경우, 상기 기판을 양호로 판단하는 단계;상기 기판에 워피지가 존재하는 경우, 상기 기판의 워피지의 정도를 체크하는 단계;상기 기판의 워피지의 정도가 허용범위 이내인 경우, 상기 기판을 양호로 판단하는 단계; 및상기 기판의 워피지의 정도가 허용범위 밖인 경우, 상기 기판을 불량으로 판단하는 단계를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제2항에 있어서,상기 기판에 워피지가 존재하는 경우, 상기 기판의 워피지의 정도를 체크하는 단계 이전에,상기 기판의 워피지를 3차원 영상으로 디스플레이하는 단계를 더 포함하는 것을 특징으로 하는 기판 검사방법.
- 제2항에 있어서,상기 검사 결과 상기 기판이 양호로 판단된 경우, 상기 기판의 워피지 정보를 상기 마운터로 전송하는 단계를 더 포함하는 것을 특징으로 하는 기판 검사방법.
- 제4항에 있어서,상기 워피지 정보는 워피지 좌표 정보, 워피지 형상 정보, 영역별 워피지 정보, 워피지 정도 정보 중 적어도 하나를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제4항에 있어서,상기 마운터로부터 상기 워피지 정보에 따른 대응 결과 정보를 피드백 받는 단계; 및상기 대응 결과 정보에 대한 통계 분석 및 추가 대응 방안 도출을 수행하는 단계를 더 포함하는 것을 특징으로 하는 기판 검사 방법.
- 제2항에 있어서,상기 기판의 일부 영역에 워피지가 존재하지만 나머지 영역에는 워피지가 존재하지 않거나 상기 허용범위 이내로 양호한 경우, 상기 기판을 일부 양호로 판단하는 단계; 및상기 검사 결과 상기 기판이 일부 양호로 판단된 경우, 상기 기판을 상기 마운터로 이송하는 단계를 더 포함하는 것을 특징으로 하는 기판 검사방법.
- 제7항에 있어서,상기 검사 결과 상기 기판이 일부 양호로 판단된 경우, 상기 기판의 워피지 정보를 상기 마운터로 전송하는 단계를 더 포함하고,상기 워피지 정보는 영역별 실장 혹은 미실장 명령을 포함하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서,상기 기판의 워피지를 검사하는 단계 이전에,상기 기판의 높이 정보를 획득하는 단계를 더 포함하고,상기 기판의 워피지를 검사하는 단계는,상기 획득된 기판의 높이 정보를 기초로 수행되는 것을 특징으로 하는 기판 검사방법.
- 제9항에 있어서,상기 기판의 높이 정보를 획득하는 단계는,상기 기판에 격자패턴광을 조사하는 단계;상기 기판에 의해 반사된 상기 격자패턴광의 패턴영상을 획득하는 단계; 및상기 획득된 패턴영상을 이용하여 상기 기판의 높이 정보를 산출하는 단계를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서,상기 기판의 워피지를 검사하는 단계 이전에,상기 기판 상에 형성된 적어도 둘 이상의 인식마크들 사이의 거리를 측정하는 단계를 더 포함하고,상기 기판의 워피지를 검사하는 단계는,상기 인식마크들 사이의 거리를 기준 거리와 비교하는 단계를 포함하는 것을 특징으로 하는 기판 검사방법.
- 마운터(mounter)로 부품을 장착하기 이전의 기판을 워크 스테이지(work stage)로 이송하는 워크 스테이지 이송부;상기 기판의 워피지(warpage)를 검사하여 상기 기판의 불량 여부를 판단하는 워피지 검사부; 및상기 워피지 검사부의 검사 결과 상기 기판이 양호로 판단된 경우, 상기 기판을 상기 마운터로 이송하는 마운터 이송부를 포함하는 기판 검사시스템.
- 제12항에 있어서,상기 워피지 검사부는,상기 기판에 워피지가 존재하는지 여부를 판단하는 워피지 판단부;상기 기판에 워피지가 존재하는 경우, 상기 기판의 워피지의 정도를 체크하는 워피지 체크부; 및상기 기판의 워피지가 존재하지 않는 경우 및 상기 기판의 워피지의 정도가 허용범위 이내인 경우 상기 기판을 양호로 판단하고, 상기 기판의 워피지의 정도가 허용범위 밖인 경우 상기 기판을 불량으로 판단하는 기판 양부 판단부를 포함하는 것을 특징으로 하는 기판 검사시스템.
- 제13항에 있어서,상기 기판 양부 판단부는, 상기 기판의 일부 영역에 워피지가 존재하지만 나머지 영역에는 워피지가 존재하지 않거나 상기 허용범위 이내로 양호한 경우, 상기 기판을 일부 양호로 판단하고,상기 기판의 영역별 실장 혹은 미실장 명령을 포함하는 워피지 정보를 상기 마운터로 전송하는 전송부를 더 포함하는 것을 특징으로 하는 기판 검사시스템.
- 제13항에 있어서,상기 워피지 검사부는,상기 기판의 워피지를 3차원 영상으로 디스플레이하는 디스플레이부를 더 포함하는 것을 특징으로 하는 기판 검사시스템.
- 제15항에 있어서,상기 디스플레이부는,상기 기판의 3차원 형상을 디스플레이하는 형상 표시부;디스플레이되는 상기 기판의 3차원 형상을 조절하는 표시형상 조절부; 및상기 기판의 워피지에 관한 정보를 디스플레이하는 워피지정보 표시부를 포함하는 것을 특징으로 하는 기판 검사시스템.
- 제12항에 있어서,상기 기판의 높이 정보를 획득하는 높이 정보 획득부를 더 포함하고,상기 워피지 검사부는,상기 높이 정보 획득부에 의해 획득된 기판의 높이 정보를 기초로 상기 기판의 워피지를 검사하는 것을 특징으로 하는 기판 검사시스템.
- 제17항에 있어서,상기 높이 정보 획득부는,상기 기판에 격자패턴광을 조사하는 투영부;상기 기판에 의해 반사된 상기 격자패턴광의 패턴영상을 획득하는 카메라부; 및상기 획득된 패턴영상을 이용하여 상기 기판의 높이 정보를 산출하는 제어부를 포함하는 것을 특징으로 하는 기판 검사시스템.
- 제12항에 있어서,상기 기판 상에 형성된 적어도 둘 이상의 인식마크들 사이의 거리를 측정하는 거리 측정부를 더 포함하고,상기 워피지 검사부는,상기 인식마크들 사이의 거리를 기준 거리와 비교하여 상기 기판의 워피지를 검사하는 것을 특징으로 하는 기판 검사시스템.
- 제12항에 있어서,상기 워피지 검사부는,상기 마운터로부터 워피지 정보에 따른 대응 결과 정보를 피드백 받는 경우, 상기 대응 결과 정보에 대한 통계 분석 및 추가 대응 방안 도출을 수행하는 것을 특징으로 하는 기판 검사시스템.
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JP2016536044A JP6144841B2 (ja) | 2013-08-23 | 2014-08-25 | 基板検査方法及びそれを用いた基板検査システム |
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