JP6090161B2 - 積層フィルム - Google Patents
積層フィルム Download PDFInfo
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- JP6090161B2 JP6090161B2 JP2013512666A JP2013512666A JP6090161B2 JP 6090161 B2 JP6090161 B2 JP 6090161B2 JP 2013512666 A JP2013512666 A JP 2013512666A JP 2013512666 A JP2013512666 A JP 2013512666A JP 6090161 B2 JP6090161 B2 JP 6090161B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1476—Release layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
Description
下記製造例1〜18に記載のポリアミド酸樹脂溶液(PA1〜PA18)を厚さ18μmの電解銅箔の光沢面に厚さ20μmになるようにバーコーターで塗布後、80℃で10分、150℃で10分乾燥し、さらに窒素雰囲気下250℃で10分加熱処理を行って、ポリイミドに変換し、ポリイミド積層銅箔を得た。次に得られたポリイミド積層銅箔の銅箔を塩化第2鉄溶液で全面エッチングし、ポリイミドの単膜を得た。
上記で得られたポリイミドの単膜約15mgをアルミ製標準容器に詰め、熱重量分析装置 TGA−50(島津製作所(株)製)を用いて測定した。測定条件は、60℃で30分保持した後、昇温速度5℃/分で500℃まで昇温した。
各実施例および比較例で得られたポリイミドフィルム積層ガラス基板上のポリイミドフィルムを10mm幅に切り目を入れ、10mm幅のポリイミドフィルムを TOYO BOLDWIN社製”テンシロン”UTM−4−100にて引っ張り速度50mm/分、90゜剥離で測定した。
試料となるポリシロキサン系ジアミン5gをビーカーに採取し、ここに、IPA:トルエンが1:1の混合溶液を50mL入れ溶解した。次に、京都電子工業(株)製の電位差自動測定装置AT−610を用い、0.1N塩酸水溶液を撹拌しながら滴下し、中和点となる滴下量を求めた。得られた0.1N塩酸水溶液の滴下量から下式(3)を用いて平均分子量を算出した。
2×〔10×36.5×(滴下量(g))〕/5=平均分子量 (3)
次に、用いたポリシロキサン系ジアミンがn=1であった場合およびn=10であった場合の分子量を化学構造式から計算し、nの数値と分子量の関係を一次関数の関係式として求めた。この関係式に上記平均分子量をあてはめ、nの平均値を求めた。
BPDA:3,3’,4,4’−ビフェニルテトラカルボン酸二無水物
ODPA:3,3’,4,4’−ジフェニルエーテルテトラカルボン酸二無水物
BTDA:3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物
SiDA:1,1,3,3−テトラメチル−1,3−ビス(3−アミノプロピル)ジシロキサン(分子量:248、式(1)においてn=1)
APPS1:α,ω−ビス(3−アミノプロピル)ポリジメチルシロキサン(平均分子量:400、式(1)においてn=3)
APPS2:α,ω−ビス(3−アミノプロピル)ポリジメチルシロキサン(平均分子量:860、式(1)においてn=9)
APPS3:α,ω−ビス(3−アミノプロピル)ポリジメチルシロキサン(平均分子量:1600、式(1)においてn=19)
APPS4:α,ω−ビス(3−アミノプロピル)ポリジメチルシロキサン(平均分子量:3000、式(1)においてn=37)
APPS5:α,ω−ビス(3−アミノプロピル)ポリジメチルシロキサン(平均分子量:4400、式(1)においてn=57)
44DAE:4,4’−ジアミノジフェニルエーテル
APB:1,3−ビス(3−アミノフェノキシ)ベンゼン
33DDS:3,3’−ジアミノジフェニルスルホン
PDA:p−フェニレンジアミン
m−TB:2,2’−ジメチル−4,4’−ジアミノビフェニル
TPE−R:1,4−ビス(3−アミノフェノキシ)ベンゼン
DMAc:N,N−ジメチルアセトアミド 。
温度計、乾燥窒素導入口、温水・冷却水による加熱・冷却装置、および、攪拌装置を付した反応釜に、APPS2 86g(0.1mol)、44DAE 80.1g(0.4mol)をDMAc 1285gと共に仕込み、溶解させた後、ODPA 155.1g(0.5mol)を添加し、室温で1時間、続いて60℃で5時間反応させて、20重量%のポリアミド酸樹脂溶液(PA1)を得た。
酸二無水物、ジアミンの種類と仕込量を表1のように変えた以外は製造例1と同様の操作を行い、30重量%のポリアミド酸樹脂溶液(PA2〜PA11)を得た。
酸二無水物、ジアミンの種類と仕込量を表2のように変えた以外は製造例1と同様の操作を行い、30重量%のポリアミド酸樹脂溶液(PA12〜PA18)を得た。
実施例1
厚さ0.7mmの無アルカリガラス基板(コーニング社製)上に、製造例3で得られたポリアミド酸樹脂溶液(PA3)を、乾燥、イミド化後の厚みが10μmになるようにスピンコーターで回転数を調整して塗布し、120℃で10分熱処理して乾燥した後、250℃で10分熱処理して完全にイミド化を行い、ポリイミド樹脂積層ガラス基板を得た。
ポリアミド酸樹脂溶液を表3のごとく変えた以外は、実施例1と同様の操作を行い、ポリイミドフィルム積層ガラス基板を得た。
ポリアミド酸樹脂溶液を表3のごとく変えた以外は、実施例1と同様の操作を行い、ポリイミドフィルム積層ガラス基板を得た。
ポリアミド酸樹脂溶液をPA−9に変えた以外は、実施例1と同様の操作を行い、ポリイミドフィルム積層ガラス基板を得た。
ポリアミド酸樹脂溶液を表4のごとく変えた以外は、実施例1と同様の操作を行い、ポリイミドフィルム積層ガラス基板を得た。
ポリアミド酸樹脂溶液(PA−10、PA−11)が重合中にゲル化したため、粘着力、ガラス転移温度、分解改組温度の測定は不可能であった。
ポリアミド酸樹脂溶液を表5のごとく変えた以外は、実施例1と同様の操作を行い、ポリイミドフィルム積層ガラス基板を得た。
シリコーン樹脂で離型処理した厚み100μm、幅250mmのポリイミドフィルム(“カプトン”300H 東レ・デュポン(株)製)に、製造例4で得られた耐熱性樹脂溶液(PA−4)を、乾燥、イミド化後の膜厚が15μmになるようにコンマコーターで塗工後、120℃で1分、続いて250℃で1分熱処理し、片面にポリイミド樹脂層を有するポリイミド樹脂積層フィルムを得た。次に、ポリイミド樹脂層上にシリコーン樹脂で離型処理した厚み38μm、幅250mmのPETフィルムを25℃でラミネートし、保護フィルム付きポリイミド樹脂積層フィルムを得た。
Claims (5)
- 少なくとも酸二無水物残基とジアミン残基を有し、ガラス転移温度が30℃以下であり、ジアミン残基として、一般式(1)で表されるポリシロキサン系ジアミンの残基を全ジアミン残基中80〜90モル%含み、さらに1,3−ビス(3−アミノフェノキシ)ベンゼンまたは3,3’−ジアミノジフェニルスルホンの残基を1〜20モル%含むポリイミド樹脂を含む樹脂組成物を、耐熱性絶縁フィルムの少なくとも片面に積層した積層フィルム。
- ポリイミド樹脂の酸二無水物残基が芳香族テトラカルボン酸二無水物の残基である請求項1記載の積層フィルム。
- 樹脂組成物のガラス転移温度が30℃以下である請求項1または2に記載の積層フィルム。
- 樹脂組成物を積層する耐熱性絶縁フィルムの表面が、離型処理されている請求項1〜3のいずれか記載の積層フィルム。
- 積層した樹脂組成物表面に、離型処理されたフィルムをさらに積層した請求項1〜4のいずれか記載の積層フィルム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2011197953 | 2011-09-12 | ||
JP2011197953 | 2011-09-12 | ||
PCT/JP2012/073025 WO2013039029A1 (ja) | 2011-09-12 | 2012-09-10 | ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム |
Publications (2)
Publication Number | Publication Date |
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JPWO2013039029A1 JPWO2013039029A1 (ja) | 2015-03-26 |
JP6090161B2 true JP6090161B2 (ja) | 2017-03-08 |
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JP2013512666A Active JP6090161B2 (ja) | 2011-09-12 | 2012-09-10 | 積層フィルム |
Country Status (8)
Country | Link |
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US (1) | US20150017370A1 (ja) |
EP (1) | EP2735580A4 (ja) |
JP (1) | JP6090161B2 (ja) |
KR (1) | KR20140068846A (ja) |
CN (1) | CN103748141B (ja) |
MY (1) | MY171368A (ja) |
TW (1) | TWI579318B (ja) |
WO (1) | WO2013039029A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006008920A1 (ja) * | 2004-07-15 | 2006-01-26 | Mitsui Mining & Smelting Co., Ltd. | 熱式センサ及びそれを用いた測定装置 |
Families Citing this family (9)
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JPWO2014148441A1 (ja) * | 2013-03-18 | 2017-02-16 | 旭化成株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法 |
SG11201606994XA (en) * | 2014-02-26 | 2016-09-29 | Toray Industries | Polyimide resin, resin composition using same, and laminated film |
CN110734736B (zh) * | 2014-08-08 | 2022-04-19 | 东丽株式会社 | 临时粘接用粘合剂、粘合剂层、晶片加工体及使用其的半导体器件的制造方法 |
KR20180077185A (ko) * | 2015-10-29 | 2018-07-06 | 도레이 카부시키가이샤 | 가부착용 적층체 필름, 가부착용 적층체 필름을 사용한 기판 가공체 및 적층 기판 가공체의 제조 방법, 및 이것들을 사용한 반도체 장치의 제조 방법 |
CN108864932A (zh) * | 2017-05-11 | 2018-11-23 | 信越化学工业株式会社 | 有机硅改性聚酰亚胺树脂组合物 |
KR102018455B1 (ko) * | 2017-05-24 | 2019-09-04 | 주식회사 엘지화학 | 폴리이미드 적층필름 롤체 및 그 제조 방법 |
WO2018230495A1 (ja) * | 2017-06-16 | 2018-12-20 | 大日本印刷株式会社 | 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置 |
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2012
- 2012-09-10 US US14/344,227 patent/US20150017370A1/en not_active Abandoned
- 2012-09-10 KR KR20147000228A patent/KR20140068846A/ko not_active Application Discontinuation
- 2012-09-10 WO PCT/JP2012/073025 patent/WO2013039029A1/ja active Application Filing
- 2012-09-10 MY MYPI2014700569A patent/MY171368A/en unknown
- 2012-09-10 EP EP12832347.4A patent/EP2735580A4/en not_active Withdrawn
- 2012-09-10 CN CN201280040202.8A patent/CN103748141B/zh active Active
- 2012-09-10 JP JP2013512666A patent/JP6090161B2/ja active Active
- 2012-09-11 TW TW101133076A patent/TWI579318B/zh active
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WO2006008920A1 (ja) * | 2004-07-15 | 2006-01-26 | Mitsui Mining & Smelting Co., Ltd. | 熱式センサ及びそれを用いた測定装置 |
Also Published As
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KR20140068846A (ko) | 2014-06-09 |
EP2735580A4 (en) | 2015-02-25 |
MY171368A (en) | 2019-10-10 |
EP2735580A1 (en) | 2014-05-28 |
CN103748141A (zh) | 2014-04-23 |
WO2013039029A1 (ja) | 2013-03-21 |
US20150017370A1 (en) | 2015-01-15 |
JPWO2013039029A1 (ja) | 2015-03-26 |
TWI579318B (zh) | 2017-04-21 |
TW201317276A (zh) | 2013-05-01 |
CN103748141B (zh) | 2016-04-20 |
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