JP6089099B2 - 電力トランジスタモジュール - Google Patents

電力トランジスタモジュール Download PDF

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Publication number
JP6089099B2
JP6089099B2 JP2015509111A JP2015509111A JP6089099B2 JP 6089099 B2 JP6089099 B2 JP 6089099B2 JP 2015509111 A JP2015509111 A JP 2015509111A JP 2015509111 A JP2015509111 A JP 2015509111A JP 6089099 B2 JP6089099 B2 JP 6089099B2
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JP
Japan
Prior art keywords
power
transistor
power transistor
node
segment
Prior art date
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Active
Application number
JP2015509111A
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English (en)
Japanese (ja)
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JP2015519741A (ja
JP2015519741A5 (enExample
Inventor
デニソン マリー
デニソン マリー
ウドムパニャヴィット ウボル
ウドムパニャヴィット ウボル
ジョージ ロペス オスヴァルト
ジョージ ロペス オスヴァルト
モーリス カヤット ジョセフ
モーリス カヤット ジョセフ
Original Assignee
日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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Publication of JP2015519741A publication Critical patent/JP2015519741A/ja
Publication of JP2015519741A5 publication Critical patent/JP2015519741A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0003—Details of control, feedback or regulation circuits
    • H02M1/0009—Devices or circuits for detecting current in a converter
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Amplifiers (AREA)
JP2015509111A 2012-04-24 2013-04-24 電力トランジスタモジュール Active JP6089099B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/454,730 2012-04-24
US13/454,730 US8581660B1 (en) 2012-04-24 2012-04-24 Power transistor partial current sensing for high precision applications
PCT/US2013/038012 WO2013163308A1 (en) 2012-04-24 2013-04-24 Power transistor module

Publications (3)

Publication Number Publication Date
JP2015519741A JP2015519741A (ja) 2015-07-09
JP2015519741A5 JP2015519741A5 (enExample) 2016-06-16
JP6089099B2 true JP6089099B2 (ja) 2017-03-01

Family

ID=49379538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015509111A Active JP6089099B2 (ja) 2012-04-24 2013-04-24 電力トランジスタモジュール

Country Status (4)

Country Link
US (1) US8581660B1 (enExample)
JP (1) JP6089099B2 (enExample)
CN (1) CN104247027B (enExample)
WO (1) WO2013163308A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5664536B2 (ja) * 2011-12-19 2015-02-04 株式会社デンソー 電流検出回路および半導体集積回路装置
US9214415B2 (en) * 2013-04-11 2015-12-15 Texas Instruments Incorporated Integrating multi-output power converters having vertically stacked semiconductor chips
DE102018207308B4 (de) 2018-05-09 2020-07-02 Infineon Technologies Ag Halbleiterbauteil mit integriertem shunt-widerstand und verfahren zu dessen herstellung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061863A (en) * 1989-05-16 1991-10-29 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Transistor provided with a current detecting function
JPH05299431A (ja) * 1992-04-16 1993-11-12 Toyota Autom Loom Works Ltd 電流検出機能付トランジスタ
JP3243902B2 (ja) * 1993-09-17 2002-01-07 株式会社日立製作所 半導体装置
JPH11134049A (ja) * 1997-10-30 1999-05-21 Dve:Kk 基準電圧回路
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
US6369646B1 (en) * 2001-01-29 2002-04-09 Delphi Technologies, Inc. Leakage current compensation circuit
ATE339013T1 (de) * 2002-01-29 2006-09-15 Advanced Power Technology Leistungsmodul mit geteiltem gatter und methode zur unterdrückung von schwingungen darin
CN100444371C (zh) * 2004-09-13 2008-12-17 国际整流器公司 功率半导体封装
JP4610453B2 (ja) * 2005-09-27 2011-01-12 三洋電機株式会社 電流検出回路
US7615854B2 (en) * 2005-11-03 2009-11-10 International Rectifier Corporation Semiconductor package that includes stacked semiconductor die
JP4916745B2 (ja) * 2006-03-28 2012-04-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5390064B2 (ja) * 2006-08-30 2014-01-15 ルネサスエレクトロニクス株式会社 半導体装置
JP4930904B2 (ja) * 2007-09-07 2012-05-16 サンケン電気株式会社 電気回路のスイッチング装置
JP2009277930A (ja) * 2008-05-15 2009-11-26 Nec Electronics Corp 半導体装置
JP5188465B2 (ja) * 2009-06-30 2013-04-24 日立オートモティブシステムズ株式会社 電流検出装置およびこれを用いた制御システム
JP5445329B2 (ja) * 2010-05-25 2014-03-19 株式会社デンソー 電力半導体装置
DE102010030317B4 (de) * 2010-06-21 2016-09-01 Infineon Technologies Ag Schaltungsanordnung mit Shuntwiderstand
DE102010038731B3 (de) * 2010-07-30 2011-12-08 Semikron Elektronik Gmbh & Co. Kg Submodul und Leistungshalbleitermodul
JP5372257B2 (ja) * 2010-09-03 2013-12-18 三菱電機株式会社 半導体装置
CN202084540U (zh) * 2011-04-02 2011-12-21 四川大雁微电子有限公司 一种表面贴装型功率晶体管模块

Also Published As

Publication number Publication date
US8581660B1 (en) 2013-11-12
JP2015519741A (ja) 2015-07-09
CN104247027B (zh) 2017-09-12
US20130278328A1 (en) 2013-10-24
CN104247027A (zh) 2014-12-24
WO2013163308A1 (en) 2013-10-31

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