CN202084540U - 一种表面贴装型功率晶体管模块 - Google Patents
一种表面贴装型功率晶体管模块 Download PDFInfo
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Abstract
本实用新型提供了一种表面贴装型功率晶体管模块,包括至少两个功率晶体管管芯和引线框架载体,每个功率晶体管管芯均通过粘片胶固定于引线框架载体上;功率晶体管管芯的集电极均与引线框架载体连接后直接连接引脚,发射极、基极分别通过对应的内引线连接于引线框架载体外的引脚;所述功率晶体管管芯、引线框架载体、内引线、引脚通过塑封体连接形成一整体,引脚的端部位于塑封体外部;本实用新型是将两个以上的功率晶体管整合成一个表面贴装型模块,实质功率晶体管之间没有直接连接关系,可以解决分立器件的放大及开关时间等参数的分散性,利于电子节能灯和电子镇流器的质量控制和保证,提高了其热性能及可靠性;本模块散热性好、体积小,能减少电路焊锡用量,缩小电路结构体积,利于自动化生产,进一步降低生产成本。
Description
技术领域
本实用新型涉及电子元器件,特别是适合电子节能灯、电子镇流器功率开关振荡电路中使用的一种表面贴装型功率晶体管模块。
背景技术
表面贴装型的半导体器件通过回流焊或流动焊等方法可靠且容易贴装在PCB电路基板上,具有小型、轻量、可靠性高等特点。
目前电子节能灯、电子镇流器的功率开关振荡电路中通常使用的是由两个分立的功率开关晶体管或带阻尼的功率开关晶体管做为主要构成部分,但是由于其放大及开关时间等参数的分散性,容易使产品在大批量生产中存在许多困难和缺点,也就使得电子节能灯和电子镇流器的质量很难控制和保证,热性能及可靠性都比较差。而且,直插分立式器件具有体积大的特点,还会出现电路焊锡用量多,导致电路结构体积很难缩小,不利于自动化生产及生产成本高等缺点。
为了解决上述问题,有些厂商采取另一种模块结构,如图1所示,该晶体管模块特征在于:由两只高反压大功率开关晶体管管芯(6、7)、两只电阻(8、9)、铝基基板11和基座13、外壳10构成,晶体管管芯(6、7)和电阻(8、9)与基板11联接,原件间的联接是按一只晶体管管芯6的发射极与另一只晶体管管芯7的集电极间串联一个电阻8、另一个电阻9接在另一只晶体管管芯7的发射极上、分别在晶体管管芯6的集电极和基极引出端子C2、B2,在晶体管管芯7的集电极、基极、发射板电阻外端引出端子C1、B1、E1,该模块芯片上涂树脂保护层12,然后通过基座装入外壳10内封装构成。该晶体管模块将采用两晶体管联成一体方式,给使用带来信号干扰问题;仍为直插分立式器件不利于电路结构体积的缩小;此方式需加外壳、电阻及芯片涂树脂保护层等,在制造生产过程不方便,增加模块的成本。
实用新型内容
本实用新型提供了一种表面贴装型功率晶体管模块,目的是为了解决分立器件的参数分散性问题,可以分立器件封装在单一整体理,特别适用于电子节能灯和电子镇流器的的功率开关振荡电路中,具有小型化、高可靠性、高质量价格比等特点。
本实用新型的技术方案如下:
一种表面贴装型功率晶体管模块,其特征在于:包括至少两个功率晶体管管芯和引线框架载体,所述每个功率晶体管管芯均通过粘片胶固定于引线框架载体上;
每个功率晶体管管芯的集电极均与引线框架载体连接后直接连接引脚;
每个功率晶体管管芯的发射极、基极分别通过对应的内引线连接于引线框架载体外的引脚;
所述功率晶体管管芯、引线框架载体、内引线、引脚通过塑封体连接形成一整体,引脚的端部位于塑封体外部,塑封体对该模块器件起到了保护和支撑作用。
该模块可以采用一个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式,也可以采用多个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式。
所述功率晶体管管芯、引线框架载体、内引线、引脚可以被塑封体填充包裹,功率晶体管管芯、引线框架载体、内引线均全部位于塑料体中;
或者,所述功率晶体管管芯、引线框架载体、内引线、引脚可以被塑封体填充,使得功率晶体管管芯、内引线全部位于塑料体中,功引线框架载体下表面暴露于空气中,则具有更好的散热性。
本实用新型的结构合理是将两个以上的功率晶体管整合成一个表面贴装型模块,实质功率晶体管之间没有直接连接关系,这样得到的有益效果如下:
将两个分立器件整合在一起,解决了两个分立器件的放大及开关时间等参数的分散性,利于电子节能灯和电子镇流器的质量控制和保证,提高了其热性能及可靠性;原有是两个器件需要上两次电路板,本模块只需上一次电路板,便于生产管理,降低生产成本;本模块散热性好、体积小,能减少电路焊锡用量,缩小电路结构体积,利于自动化生产,进一步降低生产成本。
附图说明
图1为现有功率晶体管模块俯视示意图
图2为现有功率晶体管模块结构剖面示意图
图3为本实用新型功率晶体管模块俯视示意图
图4为本实用新型功率晶体管模块结构剖面示意图
图5为本实用新型变形例功率晶体管模块俯视示意图
图6为本实用新型变形例功率晶体管模块结构剖面示意图
其中附图标记为:1、2 管芯,3 粘片胶,4 引线框架载体,5 塑封体,6’内引线,E1、E2、B1、B2、C1、C2 引脚;6、7晶体管管芯、8、9电阻、10外壳、11铝基基板、12树脂保护层、13基座。
具体实施方式
下面结合附图对本实用新型做进一步说明:
如图3-4所示,本实用新型包括两只高反压大功率开关晶体管管芯1、2,引线框架载体4,粘片胶3,引脚E1、E2、B1、B2、C1、C2,塑封体5,内引线6’;管芯1、2的集电极通过粘片胶3与引线框架载体4相连并分别引出引脚C1、C2,管芯1、2的发射极和基极通过内引线6’分别引出引脚E1、E2、B1、B2;所述引线框架载体4、管芯1、2、内引线6’、引脚部分被塑封体5包围成一整体,并对器件起到了保护和支撑作用。
以上的管芯1、2可以是相同型号,也可以是不同型号。
粘片胶3可以是软焊料、锡膏或芯片背覆软焊料,也可以是导电胶、不导电胶等。
内引线6’可以是金线、铜线、铝线、铝带,也可以是各种合金线,可应用单一线材或多种线材混合应用。
该模块可以采用一个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式,也可以采用多个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式。
所述功率晶体管管芯、引线框架载体、内引线、引脚可以被塑封体填充包裹,功率晶体管管芯、引线框架载体、内引线均全部位于塑料体中;
或者,如图5-6所示,所述功率晶体管管芯、引线框架载体、内引线、引脚可以被塑封体填充,使得功率晶体管管芯、内引线全部位于塑料体中,功引线框架载体下表面暴露于空气中,则具有更好的散热性。
以上,参照具体例对本实用新型的实施形态进行说明。但是,本实用新型并不仅限于上述具体例。
例如,关于本实用新型中引线框架、管芯、塑封体的具体形态或配置关系,业内人士对其进行适当设计变更的也属于本实用新型范围。
Claims (5)
1.一种表面贴装型功率晶体管模块,其特征在于:包括至少两个功率晶体管管芯和引线框架载体,所述每个功率晶体管管芯均通过粘片胶固定于引线框架载体上;
每个功率晶体管管芯的集电极均与引线框架载体连接后直接连接引脚;
每个功率晶体管管芯的发射极、基极分别通过对应的内引线连接于引线框架载体外的引脚;
所述功率晶体管管芯、引线框架载体、内引线、引脚通过塑封体连接形成一整体,引脚的端部位于塑封体外部。
2.根据权利要求1所述的一种表面贴装型功率晶体管模块,其特征在于:所述模块采用一个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式。
3.根据权利要求1所述的一种表面贴装型功率晶体管模块,其特征在于:所述模块采用多个功率晶体管管芯通过粘片胶连接于一个引线框架载体的方式。
4.根据权利要求1所述的一种表面贴装型功率晶体管模块,其特征在于:所述功率晶体管管芯、引线框架载体、内引线、引脚被塑封体填充包裹,功率晶体管管芯、引线框架载体、内引线均全部位于塑料体中。
5.根据权利要求1所述的一种表面贴装型功率晶体管模块,其特征在于:所述功率晶体管管芯、引线框架载体、内引线、引脚被塑封体填充,功率晶体管管芯、内引线全部位于塑料体中,功引线框架载体下表面暴露于空气中。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104247027A (zh) * | 2012-04-24 | 2014-12-24 | 德克萨斯仪器股份有限公司 | 功率晶体管模块 |
CN104377289A (zh) * | 2013-08-13 | 2015-02-25 | 鸿富锦精密工业(武汉)有限公司 | 双晶体管的封装结构及使用该封装结构的供电电路 |
CN117116923A (zh) * | 2023-10-25 | 2023-11-24 | 广东风华芯电科技股份有限公司 | 一种双通道开关晶体管及其制作方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104247027A (zh) * | 2012-04-24 | 2014-12-24 | 德克萨斯仪器股份有限公司 | 功率晶体管模块 |
CN104247027B (zh) * | 2012-04-24 | 2017-09-12 | 德克萨斯仪器股份有限公司 | 功率晶体管模块 |
CN104377289A (zh) * | 2013-08-13 | 2015-02-25 | 鸿富锦精密工业(武汉)有限公司 | 双晶体管的封装结构及使用该封装结构的供电电路 |
CN104377289B (zh) * | 2013-08-13 | 2017-05-03 | 鸿富锦精密工业(武汉)有限公司 | 双晶体管的封装结构及使用该封装结构的供电电路 |
CN117116923A (zh) * | 2023-10-25 | 2023-11-24 | 广东风华芯电科技股份有限公司 | 一种双通道开关晶体管及其制作方法 |
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