JP6088950B2 - スタッドバンプ構造およびその製造方法 - Google Patents
スタッドバンプ構造およびその製造方法 Download PDFInfo
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- JP6088950B2 JP6088950B2 JP2013191912A JP2013191912A JP6088950B2 JP 6088950 B2 JP6088950 B2 JP 6088950B2 JP 2013191912 A JP2013191912 A JP 2013191912A JP 2013191912 A JP2013191912 A JP 2013191912A JP 6088950 B2 JP6088950 B2 JP 6088950B2
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- silver alloy
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Description
本発明の他の実施形態は、銀合金線を提供するステップ、銀合金線の先端を溶解し、第1のフリーエアボール(FAB)を形成するステップ、第1のフリーエアボールを基板上に接合し、第1のボール接合を形成するステップ、および前記銀合金線を切断して、第1のボール接合が基板上に残され、銀:金:パラジウム=60〜99.98:0.01〜30:0.01〜10の重量比を有する第1の銀合金スタッドバンプを形成するステップを含むスタッドバンプ構造を製造する方法を提供する。
純金線(直径25.4μm)の一端は、電子フレームオフ(EFO)によって溶解され、表面張力によりフリーエアボールを形成する。フリーエアボールは、超音波ホットプレスによってシリコンチップ上のアルミニウムパッドに接合され、ボール接合を形成する。次いで、金線は、切断され、金スタッドバンプを形成する。製造の詳細は表1に表わされる。結果として得られた金スタッドバンプのサイズは、表2に表わされる。結果として得られた金スタッドバンプの接着力は、表3に表わされる。
純銅線(直径25.4μm)の一端は、電子フレームオフ(EFO)によって溶解され、表面張力によりフリーエアボールを形成する。フリーエアボールは、フォーミングガス(95%N2+5%H2)において、超音波ホットプレスによってシリコンチップ上のアルミニウムパッドに接合され、ボール接合を形成する。次いで、銅線は、切断され、銅スタッドバンプを形成する。製造の詳細は表1に表わされる。結果として得られた銅スタッドバンプのサイズは、表2に表わされる。結果として得られた銅スタッドバンプの接着力は、表3に表わされる。
銀合金線の一端(89wt%Ag−8wt%Au−3wt%Pd;diameter:25.4μm)は、電子フレームオフ(EFO)によって溶解され、表面張力によりフリーエアボールを形成する。フリーエアボールは、超音波ホットプレスによってシリコンチップ上のアルミニウムパッドに接合され、ボール接合を形成する。次いで、銀合金線は、切断され、銀合金スタッドバンプを形成する。製造の詳細は表1に表わされる。結果として得られた銀合金スタッドバンプのサイズは、表2に表わされる。結果として得られた銀合金スタッドバンプの接着力は、表3に表わされる。図2を参照すると、銀合金スタッドバンプのサイズは、スタッドバンプを形成するのに用いられるはんだ線は、同じ直径を有するが、金スタッドバンプのサイズより小さく、銅スタッドバンプのサイズよりやや大きい。小さいサイズの銀合金スタッドバンプは、接続距離の小さい高密度のパッケージで用いることができるため利点を有する。ボールシェアテストは、ボンドテスタDAGE4000によって、実施例1の結果として得られた銀合金スタッドバンプおよび比較例1の金スタッドバンプに実行され、その結果、銀合金スタッドバンプの接着力は、金スタッドバンプおよび銅スタッドバンプの接着力よりそれぞれ21%および28%高いことが表わされている。
シリコンチップに製造される実施例1の銀合金スタッドバンプ、比較例1の金スタッドバンプ、および比較例2の銅スタッドバンプは、チップに各々接合され、次いで、アンダーフィルされ、はんだプロセス(はんだ組成: 96.5wt%Pb−3wt%Ag−0.5wt%Cu)によって、ボールグリッドアレイパッケージ(BGA)のビスマレイミドトリアジン樹脂(BT樹脂)基板にフリップチップ組み立てされる。次いで、フリーエアボールは、BT基板の裏面に配置され、フリップチップ/BGA高密度パッケージング製品の組み立てを完了する。その後、温度サイクル試験(TCT)、プレッシャクッカ試験(PCT)、高温保存試験(HTS)が、結果として得られたスタッドバンプパッケージング製品の各々に実行され、それらの信頼性を試験する。
12000の実施例1の銀合金スタッドバンプ、比較例1の金スタッドバンプ、および比較例2の銅スタッドバンプが、シリコンウエハ(6インチ)上にそれぞれ形成され、ウエハレベルパッケージ用に試験される。
実施例1の銀合金スタッドバンプ、比較例1の金スタッドバンプ、および比較例2の銅スタッドバンプは、集積回路チップ上のアルミニウムパッドにそれぞれ形成される。ホットプレスヘッドは、スタッドバンプとポリイミド(PI)基板上の銅電極に用いられる。次いで、ボールシェアテストは、ボンドテスタDAGE4000によって、チップ上の銀合金スタッドバンプおよび金スタッドバンプに実行される。その結果は表4に表わされている。表4に表わされるように、銀合金スタッドバンプの接着力は、金スタッドバンプおよび銅スタッドバンプの接着力よりそれぞれ17%および18%高い。
200 銀合金スタッドバンプ
202、816 基板
204、804、904、818 ボンディングパッド
206 第1のフリーエアボール
208、808 第1の銀合金スタッドバンプ
210、810、910 第2の銀合金スタッドバンプ
802 第1のチップ
814 接着剤
902 第2のチップ
212、812、912 スタッドバンプ積層構造
908 銀合金スタッドバンプ
Claims (11)
- 基板、および
前記基板上に設置された、銀:金:パラジウム=89〜96.99: 0.01: 3〜10の重量比を有する銀、金及びパラジウムからなる第1の銀合金スタッドバンプを含むスタッドバンプ構造。 - 前記基板はチップまたはウエハを含む請求項1に記載のスタッドバンプ構造。
- 前記基板上のボンディングパッドを更に含み、前記第1の銀合金スタッドバンプは前記ボンディングパッド上に配置される請求項1に記載のスタッドバンプ構造。
- 前記第1の銀合金スタッドバンプ上に配置された第2の銀合金スタッドバンプを更に含む請求項1に記載のスタッドバンプ構造。
- 前記第2の銀合金スタッドバンプおよび前記第1の銀合金スタッドバンプは、同一組成を有する請求項4に記載のスタッドバンプ構造。
- 銀合金線を提供するステップ、
前記銀合金線の先端を溶解し、第1のフリーエアボール(FAB)を形成するステップ、
前記第1のフリーエアボールを基板上に接合し、第1のボール接合を形成するステップ、および
前記銀合金線を切断して、前記第1のボール接合が基板上に残され、銀:金:パラジウム=89〜96.99: 0.01: 3〜10の重量比を有する銀、金及びパラジウムからなる第1の銀合金スタッドバンプを形成するステップを含むスタッドバンプ構造の製造方法。 - 前記基板はチップまたはウエハを含む請求項6に記載のスタッドバンプ構造の製造方法。
- 前記銀合金線の線径は、10μm〜50μmの間である請求項6に記載のスタッドバンプ構造の製造方法。
- 前記第1のフリーエアボールは、ホットプレスまたは超音波ホットプレスによって前記基板上に接合される請求項6に記載のスタッドバンプ構造の製造方法。
- 前記基板上のボンディングパッドを更に含み、前記第1のフリーエアボールは、前記ボンディングパッドに配置される請求項6に記載のスタッドバンプ構造の製造方法。
- 前記銀合金線の先端を溶解し、第2のフリーエアボールを形成するステップ、
前記第2のフリーエアボールを前記第1の銀合金スタッドバンプ上に接合し、第2のボール接合を形成するステップ、および
前記銀合金線を切断して、前記第2のボール接合が前記第2の銀合金スタッドバンプ基板上に残され、第2の銀合金スタッドバンプを形成するステップを更に含む請求項6に記載のスタッドバンプ構造の製造方法。
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US20150171039A1 (en) * | 2013-12-13 | 2015-06-18 | Chipmos Technologies Inc. | Redistribution layer alloy structure and manufacturing method thereof |
TWI538762B (zh) * | 2014-01-03 | 2016-06-21 | 樂金股份有限公司 | 銲球凸塊與封裝結構及其形成方法 |
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WO2016024180A1 (en) * | 2014-08-11 | 2016-02-18 | Koninklijke Philips N.V. | Alloy stud bump interconnects for semiconductor devices |
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US10170429B2 (en) * | 2016-11-28 | 2019-01-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming package structure including intermetallic compound |
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US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
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