JP6079425B2 - 導電粒子、異方性導電接着剤フィルム及び接続構造体 - Google Patents

導電粒子、異方性導電接着剤フィルム及び接続構造体 Download PDF

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JP6079425B2
JP6079425B2 JP2013102406A JP2013102406A JP6079425B2 JP 6079425 B2 JP6079425 B2 JP 6079425B2 JP 2013102406 A JP2013102406 A JP 2013102406A JP 2013102406 A JP2013102406 A JP 2013102406A JP 6079425 B2 JP6079425 B2 JP 6079425B2
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particles
particle
mother
conductive
insulator
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JP2013258138A (ja
Inventor
高井 健次
健次 高井
邦彦 赤井
邦彦 赤井
憂子 永原
憂子 永原
優 渡邊
優 渡邊
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/02Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013102406A 2012-05-16 2013-05-14 導電粒子、異方性導電接着剤フィルム及び接続構造体 Active JP6079425B2 (ja)

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JP2013102406A JP6079425B2 (ja) 2012-05-16 2013-05-14 導電粒子、異方性導電接着剤フィルム及び接続構造体

Applications Claiming Priority (3)

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JP2012112768 2012-05-16
JP2012112768 2012-05-16
JP2013102406A JP6079425B2 (ja) 2012-05-16 2013-05-14 導電粒子、異方性導電接着剤フィルム及び接続構造体

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JP2013258138A JP2013258138A (ja) 2013-12-26
JP6079425B2 true JP6079425B2 (ja) 2017-02-15

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JP (1) JP6079425B2 (zh)
KR (1) KR102039191B1 (zh)
CN (3) CN203659456U (zh)
TW (1) TWI603345B (zh)

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WO2014054572A1 (ja) * 2012-10-02 2014-04-10 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6431411B2 (ja) * 2014-03-10 2018-11-28 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6233139B2 (ja) * 2014-03-28 2017-11-22 デクセリアルズ株式会社 異方性導電フィルム
TWI664783B (zh) * 2014-03-31 2019-07-01 日商迪睿合股份有限公司 異向性導電膜、其製造方法、連接構造體、及連接構造體之製造方法
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
JP6798771B2 (ja) * 2014-07-10 2020-12-09 積水化学工業株式会社 導電性粒子の製造方法、導電材料の製造方法及び接続構造体の製造方法
JP6166849B2 (ja) * 2015-07-14 2017-07-19 積水化学工業株式会社 導電材料及び接続構造体
CN105776892B (zh) * 2016-01-29 2018-04-06 中北大学 一种磁性镀Ag玻璃微珠及其制备方法
JP6737292B2 (ja) * 2016-02-10 2020-08-05 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
WO2017159381A1 (ja) * 2016-03-17 2017-09-21 東洋紡株式会社 導電性皮膜およびレーザーエッチング加工用導電性ペースト
CN113078486B (zh) * 2016-10-24 2023-10-20 迪睿合株式会社 各向异性导电膜的制造方法
JP6935702B2 (ja) * 2016-10-24 2021-09-15 デクセリアルズ株式会社 異方性導電フィルム
JP6825324B2 (ja) * 2016-11-16 2021-02-03 昭和電工マテリアルズ株式会社 絶縁被覆導電粒子と、それを用いた異方導電性接着剤及び接続構造体
KR20210121308A (ko) * 2017-03-06 2021-10-07 데쿠세리아루즈 가부시키가이샤 수지 조성물, 수지 조성물의 제조 방법, 및 구조체
JP7287275B2 (ja) * 2017-04-28 2023-06-06 株式会社レゾナック 接着剤組成物、及び接続体の製造方法
CN107479274A (zh) * 2017-07-11 2017-12-15 武汉华星光电半导体显示技术有限公司 显示面板与外接电路的邦定方法及显示装置
WO2019050012A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및/또는 이를 포함하는 반도체 장치
JP7312108B2 (ja) * 2018-04-04 2023-07-20 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
CN116189963A (zh) * 2018-06-25 2023-05-30 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
JP6772401B2 (ja) 2018-07-10 2020-10-21 日本化学工業株式会社 被覆粒子
JP7220548B2 (ja) * 2018-10-19 2023-02-10 株式会社日本触媒 導電粒子用基材粒子およびその利用
JP7463069B2 (ja) * 2019-09-30 2024-04-08 積水化学工業株式会社 導電性粒子、導電材料、接続構造体及び接続構造体の製造方法
JPWO2021246523A1 (zh) 2020-06-04 2021-12-09

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SG100666A1 (en) * 2000-04-04 2003-12-26 Nec Tokin Corp Wiring board comprising granular magnetic film
US6663799B2 (en) * 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
US6969622B1 (en) 2001-02-09 2005-11-29 Jsr Corporation Anisotropically conductive connector, its manufacture method and probe member
JP3573120B2 (ja) 2001-08-31 2004-10-06 Jsr株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
JP4862921B2 (ja) * 2008-07-01 2012-01-25 日立化成工業株式会社 回路接続材料、回路接続構造体及びその製造方法
WO2011016524A1 (ja) * 2009-08-06 2011-02-10 日立化成工業株式会社 導電粒子
JP4957838B2 (ja) * 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
US20130000964A1 (en) * 2010-04-22 2013-01-03 Hiroshi Kobayashi Anisotropic conductive material and connection structure
JP5548053B2 (ja) * 2010-07-02 2014-07-16 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
KR101321636B1 (ko) * 2010-07-02 2013-10-23 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 이방성 도전 재료 및 접속 구조체
JP2012069362A (ja) * 2010-09-22 2012-04-05 Nippon Shokubai Co Ltd 絶縁被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム

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Publication number Publication date
CN203659456U (zh) 2014-06-18
CN203520899U (zh) 2014-04-02
TW201401299A (zh) 2014-01-01
TWI603345B (zh) 2017-10-21
KR102039191B1 (ko) 2019-10-31
KR20130128336A (ko) 2013-11-26
JP2013258138A (ja) 2013-12-26
CN103426499A (zh) 2013-12-04

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