JP6064875B2 - 液処理装置、液処理方法及び記憶媒体 - Google Patents

液処理装置、液処理方法及び記憶媒体 Download PDF

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Publication number
JP6064875B2
JP6064875B2 JP2013243005A JP2013243005A JP6064875B2 JP 6064875 B2 JP6064875 B2 JP 6064875B2 JP 2013243005 A JP2013243005 A JP 2013243005A JP 2013243005 A JP2013243005 A JP 2013243005A JP 6064875 B2 JP6064875 B2 JP 6064875B2
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substrate
liquid
processing
wafer
nozzle
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JP2015103656A (ja
JP2015103656A5 (cg-RX-API-DMAC7.html
Inventor
純 野中
純 野中
昌吾 溝田
昌吾 溝田
辰也 永松
辰也 永松
大輔 齊木
大輔 齊木
一大 寺岡
一大 寺岡
貴士 薮田
貴士 薮田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2013243005A priority Critical patent/JP6064875B2/ja
Priority to TW103139779A priority patent/TWI585881B/zh
Priority to US14/548,453 priority patent/US10236192B2/en
Priority to KR1020140163311A priority patent/KR102370517B1/ko
Publication of JP2015103656A publication Critical patent/JP2015103656A/ja
Publication of JP2015103656A5 publication Critical patent/JP2015103656A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013243005A 2013-11-25 2013-11-25 液処理装置、液処理方法及び記憶媒体 Active JP6064875B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013243005A JP6064875B2 (ja) 2013-11-25 2013-11-25 液処理装置、液処理方法及び記憶媒体
TW103139779A TWI585881B (zh) 2013-11-25 2014-11-17 Liquid treatment device, liquid treatment method and memory medium
US14/548,453 US10236192B2 (en) 2013-11-25 2014-11-20 Liquid processing apparatus, liquid processing method, and storage medium
KR1020140163311A KR102370517B1 (ko) 2013-11-25 2014-11-21 액 처리 장치, 액 처리 방법 및 기억 매체

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JP2013243005A JP6064875B2 (ja) 2013-11-25 2013-11-25 液処理装置、液処理方法及び記憶媒体

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JP2016251339A Division JP6304364B2 (ja) 2016-12-26 2016-12-26 液処理装置、液処理方法及び記憶媒体

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JP2015103656A JP2015103656A (ja) 2015-06-04
JP2015103656A5 JP2015103656A5 (cg-RX-API-DMAC7.html) 2015-12-17
JP6064875B2 true JP6064875B2 (ja) 2017-01-25

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US (1) US10236192B2 (cg-RX-API-DMAC7.html)
JP (1) JP6064875B2 (cg-RX-API-DMAC7.html)
KR (1) KR102370517B1 (cg-RX-API-DMAC7.html)
TW (1) TWI585881B (cg-RX-API-DMAC7.html)

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JP7357693B2 (ja) * 2019-12-16 2023-10-06 東京エレクトロン株式会社 基板処理方法
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TWI886306B (zh) * 2020-07-28 2025-06-11 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7486372B2 (ja) * 2020-07-29 2024-05-17 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
KR20230101837A (ko) * 2020-11-05 2023-07-06 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기록 매체
KR102877342B1 (ko) * 2021-01-11 2025-10-30 삼성디스플레이 주식회사 식각 장치 및 이를 이용한 식각 방법
JP2023047615A (ja) * 2021-09-27 2023-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
CN114420552B (zh) * 2021-12-31 2025-10-03 上海至纯洁净系统科技股份有限公司 一种基于流场控制的高温蚀刻方法
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Publication number Priority date Publication date Assignee Title
KR20210113061A (ko) 2020-03-06 2021-09-15 가부시키가이샤 스크린 홀딩스 기판 처리 방법

Also Published As

Publication number Publication date
JP2015103656A (ja) 2015-06-04
KR102370517B1 (ko) 2022-03-03
US20150147888A1 (en) 2015-05-28
US10236192B2 (en) 2019-03-19
TWI585881B (zh) 2017-06-01
KR20150060556A (ko) 2015-06-03
TW201535561A (zh) 2015-09-16

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